公开(公告)号：WO2017011246A1

公开(公告)日：2017-01-19

申请号：PCT/US2016/041169

申请日：2016-07-06

Applicant: ADVENTIVE TECHNOLOGY LTD. ,  WILLIAMS, Richard, K.

Inventor： WILLIAMS, Richard, K. ,  LIN, Keng-hung

IPC: H01L23/495 ,  H01L21/268 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L21/561 ,  H01L21/48 ,  H01L21/4828 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/92166 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014

Abstract: In the fabrication of semiconductor packages, a leadframe is formed by masking and etching a metal sheet from both sides, and a plastic block is formed over a plurality of dice attached to die pads in the leadframe. A laser beam is used to form individual plastic capsules for each package, and a second laser beam is used to singulate the packages by severing the metal conductors, tie bars and rails between the packages. A wide variety of different types of packages, from gull-wing footed packages to leadless packages, with either exposed or isolated die pads, may be fabricated merely by varying the patterns of the openings in the mask layers and the width of the plastic trenches created by the first laser beam.

Abstract translation: 在半导体封装的制造中，通过从两侧掩蔽和蚀刻金属片而形成引线框，并且在引导框架中附着到焊盘的多个裸片上形成塑料块。 激光束用于为每个封装形成单独的塑料胶囊，并且第二激光束用于通过在包装之间切断金属导体，连接条和导轨来对包装进行分割。 可以仅通过改变掩模层中的开口的图案和创建的塑料沟槽的宽度来制造各种不同类型的包装，从鸥翼底脚包装到无引线封装，具有裸露或隔离的裸片焊盘 通过第一激光束。

公开(公告)号：WO2016179111A1

公开(公告)日：2016-11-10

申请号：PCT/US2016/030456

申请日：2016-05-02

Applicant: ADVENTIVE TECHNOLOGY, LTD. ,  WILLIAMS, Richard, K.

Inventor： WILLIAMS, Richard, K. ,  LIN, Keng-Hung

IPC: H01L23/48 ,  H01L21/48

CPC classification number: H01L23/49562 ,  H01L21/4828 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49555 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/49107 ,  H01L2224/49111 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014 ,  H01L2924/0665

Abstract: A power package includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to die bottom of the die. The result is a package with a minimal footprint that is suitable for the technique known as "wave soldering" that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.

Abstract translation: 功率封装包括从暴露在封装的下侧的裸片焊盘延伸的散热片，其有助于将热量从裸片移除到PCB或其上安装封装件的其它表面。 热片具有与芯片焊盘的平坦底表面和引线底表面共面的底表面。 引线包括水平脚部段，垂直柱状段和面向管芯焊盘的水平悬臂段。 热片也可以有一个脚。 包含功率器件的管芯安装在管芯焊盘的顶表面上，并且可以使用接合线或夹子电连接到引线。 管芯可以用导电材料安装在管芯焊盘上，并且封装还可以包括从管芯焊盘延伸并且因此电连接到管芯的管芯底部的引线。 结果是具有最小占地面积的封装，适用于在相对低成本的印刷电路板组装工厂中使用的称为“波峰焊”的技术。 公开了制造封装的方法。