公开(公告)号：WO2016169696A1

公开(公告)日：2016-10-27

申请号：PCT/EP2016/055107

申请日：2016-03-10

Applicant: CARL ZEISS SMT GMBH ,  BANYAY, Matus ,  WEISER, Martin ,  BITTNER, Boris

Inventor： BANYAY, Matus ,  WEISER, Martin ,  BITTNER, Boris

IPC: G02B27/00 ,  G03F7/20 ,  G02B5/08 ,  G02F1/015 ,  G02B17/08

CPC classification number: G02B27/0025 ,  G02B3/0087 ,  G02B5/0891 ,  G02B17/0856 ,  G02B17/0892 ,  G03F7/70308 ,  G03F7/70316 ,  G03F7/70958 ,  G21K1/06 ,  G21K1/062 ,  H01S3/0903

Abstract: Die Erfindung betrifft ein Wellenfrontkorrekturelement zur Verwendung in einem optischen System, insbesondere in einem optischen System einer mikrolithographischen Projektionsbelichtungsanlage oder einer Maskeninspektionsanlage, mit einer Trägerfolie (110, 210, 410), welche im Betrieb des optischen Systems auf die Trägerfolie auftreffende, eine Arbeitswellenlänge des optischen Systems aufweisende elektromagnetische Strahlung zumindest teilweise transmittiert, wobei die Trägerfolie (110, 210, 410) derart ausgestaltet ist, dass der Realteil des komplexen Brechungsindex über einen Nutzbereich der Fläche der Trägerfolie (110, 210, 410) variiert.

Abstract translation: 本发明涉及一种用于在光学系统中使用的波前校正元件，特别是在微光刻投射曝光设备，或掩模检查工具的光学系统中，与载体膜（110，210,410），其入射在所述光学系统的所述载体箔，光学的工作波长的操作 具有电磁辐射的系统至少部分地透射，其中，所述基膜（110，210，410）被设计为使得复数折射率的在载体膜（110，210，410）变化的表面的有用范围的实部。

公开(公告)号：WO2008033828A1

公开(公告)日：2008-03-20

申请号：PCT/US2007/078146

申请日：2007-09-11

Applicant: HONEYWELL INTERNATIONAL INC. ,  WEISER, Martin ,  LI, Jianxing

Inventor： WEISER, Martin ,  LI, Jianxing

IPC: B23K35/26 ,  C22C12/00

CPC classification number: C22C12/00 ,  B23K35/26 ,  B23K35/264 ,  H01L24/29 ,  H01L2224/32225 ,  H01L2924/01322 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  Y10T428/31678 ,  H01L2924/00

Abstract: Lead-free solder compositions having a thermal conductivity are disclosed that include at least about 2% of silver, at least about 60% of bismuth, and at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range. Methods of producing these lead-free solder compositions are also disclosed that include providing at least about 2% of silver, providing at least about 60% of bismuth, providing at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, blending the bismuth with the at least one additional metal to form a bismuth-metal blend, and blending the bismuth-metal blend with copper to form the solder composition, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range. Additional methods of producing a lead-free solder composition having a thermal conductivity include providing at least about 2% of silver, providing at least about 60% of bismuth, providing at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, blending the silver with the at least one additional metal to form a silver-metal alloy, and blending the silver-metal alloy with bismuth to form the solder composition, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range.

Abstract translation: 公开了具有导热性的无铅焊料组合物，其包含至少约2％的银，至少约60％的铋以及至少一种额外的金属，其量将增加焊料组合物的热导率 由银和铋组成的比较焊料组合物，其中所述至少一种附加金属不会显着地改变固相线温度，并且不将液相线温度移动到可接受的液相线温度范围之外。 还公开了生产这些无铅焊料组合物的方法，其包括提供至少约2％的银，提供至少约60％的铋，提供至少一种额外的金属，其量将增加焊料的热导率 通过比较由银和铋组成的焊料组合物，将铋与至少一种另外的金属共混以形成铋 - 金属共混物，并将铋 - 金属共混物与铜混合以形成焊料组合物，其中至少一种 附加金属不会显着地改变固相线温度，并且不将液相线温度移动到可接受的液相线温度范围之外。 制备具有导热性的无铅焊料组合物的附加方法包括提供至少约2％的银，提供至少约60％的铋，提供至少一种额外的金属，其量将增加该导电性的导热性 焊料组合超过由银和铋组成的比较焊料组合物，将银与至少一种另外的金属共混以形成银 - 金属合金，并将银 - 金属合金与铋共混以形成焊料组合物，其中至少 一种额外的金属不会显着改变固相线温度，并且不会将液相线温度移动到可接受的液相线温度范围之外。

公开(公告)号：WO03026828A3

公开(公告)日：2003-06-19

申请号：PCT/US0230608

申请日：2002-09-25

Applicant: HONEYWELL INT INC ,  DEAN NANCY ,  LALENA JOHN ,  WEISER MARTIN

Inventor： DEAN NANCY ,  LALENA JOHN ,  WEISER MARTIN

IPC: B23K35/00 ,  B23K35/22 ,  B23K35/26 ,  C22C1/02 ,  C22C12/00 ,  C22C13/00

CPC classification number: B23K35/264 ,  B23K35/007 ,  B23K2201/40 ,  H01L24/29 ,  H01L24/32 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A lead-free (130) solder comprises an alloy of silver and bismuth in amounts of about 2 wt% to about 18 wt% and about 98 wt% to about 82 wt%, respectively. Contemplated alloys further comprise at least one of zinc, nickel, germanium or a combination thereof in an amount of up to about 1000 ppmy and have a solidus of no lower than about 262.5 DEG C and a liquidus of no higher than about 400 DEG C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of at least one of the constituents of the alloy, and particularly contemplated elements are phosphorus and germanium.

Abstract translation: 无铅（130）焊料包含量分别为约2重量％至约18重量％和约98重量％至约82重量％的银和铋的合金。 考虑的合金进一步包含至多约1000ppmy的锌，镍，锗或其组合中的至少一种，并具有不低于约262.5℃的固相线和不高于约400℃的液相线 考虑的合金可以进一步包含具有比合金的至少一种成分的氧亲和力更高的氧亲和力的化学元素，并且特别考虑的元素是磷和锗。

公开(公告)号：WO2003026828A2

公开(公告)日：2003-04-03

申请号：PCT/US2002/030608

申请日：2002-09-25

Applicant: HONEYWELL INTERNATIONAL INC. ,  DEAN, Nancy ,  LALENA, John ,  WEISER, Martin

Inventor： DEAN, Nancy ,  LALENA, John ,  WEISER, Martin

IPC: B23K

CPC classification number: B23K35/264 ,  B23K35/007 ,  B23K2201/40 ,  H01L24/29 ,  H01L24/32 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A lead-free solder comprises an alloy of silver and bismuth in amounts of about 2 wt% to about 18 wt% and about 98 wt% to about 82 wt%, respectively. Contemplated alloys further comprise at least one of zinc, nickel, germanium or a combination thereof in an amount of up to about 1000 ppm (preferably about 500ppm) and have a solidus of no lower than about 262.5 °C and a liquidus of no higher than about 400 °C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of at least one of the constituents of the alloy, and particularly contemplated elements are phosphorus and germanium.

Abstract translation: 无铅（130）焊料包含分别为约2重量％至约18重量％和约98重量％至约82重量％的量的银和铋合金。 考虑的合金还包含至多约1000ppmy的锌，镍，锗或其组合中的至少一种，并且具有不低于约262.5℃的固相线和不高于约400℃的液相线。 考虑的合金可以进一步包含具有高于合金的至少一种成分的氧亲和力的氧亲和力的化学元素，并且特别考虑的元素是磷和锗。

公开(公告)号：WO2002097145A1

公开(公告)日：2002-12-05

申请号：PCT/US2001/017491

申请日：2001-05-28

Applicant: HONEYWELL INTERNATIONAL INC. ,  LALENA, John ,  DEAN, Nancy ,  WEISER, Martin

Inventor： LALENA, John ,  DEAN, Nancy ,  WEISER, Martin

IPC: C22C13/00

CPC classification number: B23K35/264 ,  B23K35/00 ,  B23K2035/008 ,  C22C5/02 ,  C22C12/00 ,  C22C13/02 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29113 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A lead-free solder (130) comprises an alloy of silver and bismuth in amounts of 2wt% to 18wt% and 98wt% to 82wt%, respectively. Contemplated alloys have a solidus of no lower than 262.5°C and a liquidus of no higher than 400°C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of the alloy.

Abstract translation: 无铅焊料（130）分别含有2重量％至18重量％和98重量％至82重量％的银和铋合金。 沉积的合金具有不低于262.5℃的固相线和不高于400℃的液相线。考虑的合金可以进一步包含具有高于合金的氧亲和力的氧亲和力的化学元素。

公开(公告)号：WO2008147825A4

公开(公告)日：2009-05-07

申请号：PCT/US2008064422

申请日：2008-05-21

Applicant: HONEYWELL INT INC ,  WEISER MARTIN ,  BURNHAM KIKUE ,  ZHOU DE-LING ,  LEUNG ROGER ,  NEDBAL JAN ,  RASTOGI RAVI

Inventor： WEISER MARTIN ,  BURNHAM KIKUE ,  ZHOU DE-LING ,  LEUNG ROGER ,  NEDBAL JAN ,  RASTOGI RAVI

IPC: H01L23/373 ,  C09K5/14

CPC classification number: C09K5/14 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/0665 ,  H01L2924/00

Abstract: Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.

Abstract translation: 公开了热界面材料，其包括至少一种基质材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂改善所述热界面材料的热性能，相容性，物理质量或其组合。 还公开了形成热界面材料的方法，其包括提供至少一种基质材料组分，至少一种高电导率填料，至少一种焊料材料和至少一种材料改性剂中的每一种，混合组分; 并且可选地将热界面材料预施加或后施加到表面，基材或组分上固化。 此外，公开了热界面材料，其包括至少一种基体材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂至少一种改性的热填料型材。

公开(公告)号：WO2008014163A3

公开(公告)日：2008-01-31

申请号：PCT/US2007/073783

申请日：2007-07-18

Applicant: HONEYWELL INTERNATIONAL INC. ,  RASTOGI, Ravi ,  WEISER, Martin W.

Inventor： RASTOGI, Ravi ,  WEISER, Martin W.

IPC: H05K7/20 ,  H01L23/373 ,  H01L23/36

Abstract: Synergistically-modified surfaces are described herein, where a surface having a surface profile is synergistically modified such that the thermal contact resistance between the surface and the at least one thermal interface material is reduced as compared to a surface that is not synergistically modified. Methods are also described herein of producing a synergistically-modified surface, comprising a) providing a surface having a surface profile, b) providing at least one thermal interface material, c) synergistically modifying the surface profile of the surface such that thermal contact resistance between the surface and the at least one thermal interface material is reduced as compared to a surface that is not synergistically modified. Layered components are also disclosed that comprise a synergistically-modified surface; a thermal interface material; and at least one additional layer of material.

公开(公告)号：WO2007075763A1

公开(公告)日：2007-07-05

申请号：PCT/US2006/048566

申请日：2006-12-18

Applicant: HONEYWELL INTERNATIONAL, INC. ,  WEISER, Martin

Inventor： WEISER, Martin

IPC: C22C12/00 ,  B23K35/26

CPC classification number: C22C12/00 ,  H01B1/02 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83439 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: Solder compositions are described that include at least about 2% of silver, at least about 60% of bismuth, and at least one coupling element, wherein the at least one coupling element forms a complex with bismuth. Layered materials are also described that include a surface or substrate; an electrical interconnect; the solder composition described herein; and a semiconductor die or package. Methods of producing a solder composition are also described that include: a) providing at least about 2% of silver, b) providing at least about 60% of bismuth, c) providing at least one coupling element, wherein the at least one coupling element forms a complex with bismuth, and d) blending the silver, bismuth and at least one coupling element to form the solder composition.

Abstract translation: 描述了包含至少约2％的银，至少约60％的铋和至少一种偶联元素的焊料组合物，其中所述至少一种偶联元素与铋形成络合物。 还描述了包括表面或基底的分层材料; 电互连; 本文所述的焊料组合物; 和半导体管芯或封装。 还描述了生产焊料组合物的方法，其包括：a）提供至少约2％的银，b）提供至少约60％的铋，c）提供至少一个耦合元件，其中所述至少一个耦合元件 与铋形成络合物，和d）将银，铋和至少一种偶合元素混合以形成焊料组合物。

公开(公告)号：WO2003068447A1

公开(公告)日：2003-08-21

申请号：PCT/US2003/004374

申请日：2003-02-12

Applicant: HONEYWELL INTERNATIONAL INC. ,  LE, Kim-Chi ,  LALENA, John ,  WEISER, Martin

Inventor： LE, Kim-Chi ,  LALENA, John ,  WEISER, Martin

IPC: B23K35/22

CPC classification number: B23K35/025 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3613 ,  H05K3/3484

Abstract: A solder paste formulation has been developed that comprises a) at least one metal-based material; b) at least one support material; and c) at least one stability modification material. Furthermore, a method of producing a solder paste formulation having a stability component, as described herein, comprises a) providing at least one metal-based material; b) providing at least one support material; c) providing at least one stability modification material; and d) combining the at least one metal-based material, the at least one support material and the at least one stability modification material such that the stability component of the solder paste formulation is increased over a reference stability component of a conventional or reference solder paste formulation comprising similar metal-based materials and similar support materials.

Abstract translation: 已经开发了焊膏配方，其包括：a）至少一种金属基材料; b）至少一种支撑材料; 和c）至少一种稳定性改性材料。 此外，如本文所述的制备具有稳定性组分的焊膏制剂的方法包括：a）提供至少一种金属基材料; b）提供至少一种支撑材料; c）提供至少一种稳定性改性材料; 以及d）组合所述至少一种金属基材料，所述至少一种支撑材料和所述至少一种稳定性改性材料，使得所述焊膏配方的稳定性组分比常规或参考焊料的参考稳定性组分增加 糊剂制剂包含类似的金属基材料和类似的支撑材料。

公开(公告)号：WO2003064713A1

公开(公告)日：2003-08-07

申请号：PCT/US2002/012821

申请日：2002-04-23

Applicant: HONEYWELL INTERNATIONAL INC. ,  LALENA, John, N. ,  DEAN, Nancy, F. ,  WEISER, Martin, W.

Inventor： LALENA, John, N. ,  DEAN, Nancy, F. ,  WEISER, Martin, W.

IPC: C22C28/00

CPC classification number: C22C28/00 ,  C22C38/28 ,  H01L23/3736 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/16152 ,  H01L2924/00

Abstract: The invention includes a semiconductor package (10) which comprises a semiconductor substrate (14) and a heat spreader (18). A thermal interface material (20) thermally connects the substrate to the heat spreader (18). The thermal interface material (20) consists essentially of In, Zn, and one or more elements selected from the group consisting of Mg, Ca, Nb, Ta, B, Al, Ce, Ti and Zr. The invention also includes a composition consisting essentially of In and Zn. The Zn concentration within the composition is from about 0.5 weight% to about 3 weight%.

Abstract translation: 本发明包括半导体封装（10），其包括半导体衬底（14）和散热器（18）。 热界面材料（20）将衬底热连接到散热器（18）。 热界面材料（20）基本上由In，Zn和一种或多种选自Mg，Ca，Nb，Ta，B，Al，Ce，Ti和Zr的元素组成。 本发明还包括基本上由In和Zn组成的组合物。 组合物中的Zn浓度为约0.5重量％至约3重量％。