Abstract:
Releasable semiconductor dice are deposited with a magnetic layer a nd held by magnetic forces to a magnetic or electromagnetic transfer stamp for the transfer of the dice from a host substrate directly or indirectly to a target substrate.
Abstract:
A composite patterning device includes a stiff first layer having a Young's modulus in a first range, a flexible second layer having a Young's modulus in a second range, a fluidic layer interposed between the first and second layers and having a Young's modulus in a variable range, and a relief pattern in the second layer. The device can be used for establishing conformal contact between the relief pattern in the second layer and a contact surface of a host substrate with attached elements. Then, a magnetic field is applied to the device so as to increase the Young's modulus of the fluidic layer to be similar to that of second layer after which a force is applied to the contact surface so as to release and remove the elements from the host substrate by withdrawing the device.
Abstract:
A transfer-enabling apparatus, produced by a method of manufacturing, includes a substrate patterned with islands separated by trenches and an epitaxial layer, grown at least on the islands, providing semiconductor dice in such a configuration partially released from said substrate and suspended over the substrate, and interconnected, by anchors of epitaxial or other material that are attached to the substrate. The anchors are of width less than or equal to than the semiconductor dice and define fracture zones at connections of the anchors with the semiconductor dice.
Abstract:
In accordance with, certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
Abstract:
A package includes one or more lighting devices having electrical contact points, a substrate for supporting the lighting devices, a plurality of electrically conductive traces defined on the substrate so as to provide electrical contacts in close proximity to contact points of the lighting devices, a planarization or encapsulation layer applied on the substrate so as to cover at least the conductive traces thereon, and a conductive layer deposited over the contact points on each of the lighting devices and the electrical contacts of the conductive traces so as to electrically interconnect the respective devices and traces to provide a circuit path for supply of electrical drive power to the lighting devices via the conductive traces.
Abstract:
A luminaire that provides predetermined luminous intensity distribution, the luminaire comprising an array 100 of light-emitting elements 110 and, disposed over the light-emitting elements, a lens array comprising a plurality of aspheric lens elements 150 each optically coupled to a respective one of light-emitting elements 110 and producing an out-of-focus image thereof, the images combining to generate a predetermined luminous intensity distribution, e.g., providing constant illuminance on a plane.
Abstract:
A transfer stamp that can be charged with a spatial pattern of electrostatic charge for picking up selected semiconductor dice from a host substrate and transferring them to a target substrate. The stamp may be bulk charged and then selectively discharged using irradiation through a patterned mask. The technique may also be used to electrostatically transfer selected semiconductor dice from a host substrate to a target substrate.
Abstract:
In accordance with certain embodiments, regions of spatially varying wavelength- conversion particle concentration are formed over light-emitting dies.
Abstract:
In accordance with certain embodiments, interior spaces are illuminated with a combination of harvested sunlight and artificial light emitted by one or more light- emitting elements.