COMPOSITE PATTERNING DEVICE AND METHOD FOR REMOVING ELEMENTS FROM HOST SUBSTRATE BY ESTABLISHING CONFORMAL CONTACT BETWEEN DEVICE AND A CONTACT SURFACE
    2.
    发明申请
    COMPOSITE PATTERNING DEVICE AND METHOD FOR REMOVING ELEMENTS FROM HOST SUBSTRATE BY ESTABLISHING CONFORMAL CONTACT BETWEEN DEVICE AND A CONTACT SURFACE 审中-公开
    复合图案装置和方法,通过在装置和接触表面之间建立一致的接触来从主体基板移除元件

    公开(公告)号:WO2011072375A1

    公开(公告)日:2011-06-23

    申请号:PCT/CA2010/001958

    申请日:2010-12-16

    CPC classification number: H01L33/0095 H01L33/0079

    Abstract: A composite patterning device includes a stiff first layer having a Young's modulus in a first range, a flexible second layer having a Young's modulus in a second range, a fluidic layer interposed between the first and second layers and having a Young's modulus in a variable range, and a relief pattern in the second layer. The device can be used for establishing conformal contact between the relief pattern in the second layer and a contact surface of a host substrate with attached elements. Then, a magnetic field is applied to the device so as to increase the Young's modulus of the fluidic layer to be similar to that of second layer after which a force is applied to the contact surface so as to release and remove the elements from the host substrate by withdrawing the device.

    Abstract translation: 复合图案形成装置包括在第一范围内具有杨氏模量的刚性第一层,在第二范围内具有杨氏模量的柔性第二层,介于第一和第二层之间并具有可变范围的杨氏模量的流体层 ,以及第二层中的浮雕图案。 该装置可用于建立第二层中的浮雕图案与主体基板与附接元件的接触表面之间的共形接触。 然后,向该装置施加磁场,以使流体层的杨氏模量与第二层的杨氏模量相似,之后将力施加到接触表面,以便从主体上释放和去除元件 底物通过抽出装置。

    PACKAGE FOR LIGHT EMITTING AND RECEIVING DEVICES
    5.
    发明申请
    PACKAGE FOR LIGHT EMITTING AND RECEIVING DEVICES 审中-公开
    用于发光和接收装置的包装

    公开(公告)号:WO2011082497A1

    公开(公告)日:2011-07-14

    申请号:PCT/CA2011/050006

    申请日:2011-01-10

    Abstract: A package includes one or more lighting devices having electrical contact points, a substrate for supporting the lighting devices, a plurality of electrically conductive traces defined on the substrate so as to provide electrical contacts in close proximity to contact points of the lighting devices, a planarization or encapsulation layer applied on the substrate so as to cover at least the conductive traces thereon, and a conductive layer deposited over the contact points on each of the lighting devices and the electrical contacts of the conductive traces so as to electrically interconnect the respective devices and traces to provide a circuit path for supply of electrical drive power to the lighting devices via the conductive traces.

    Abstract translation: 包装包括一个或多个具有电接触点的照明装置,用于支撑照明装置的基板,限定在基板上的多个导电迹线,以便提供紧靠照明装置的接触点的电触头,平坦化 或封装层,以便至少覆盖其上的导电迹线,以及沉积在每个照明装置上的接触点和导电迹线的电触点上的导电层,以便电连接相应的器件和 轨迹以提供用于经由导电迹线向照明装置提供电驱动电力的电路路径。

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