公开(公告)号：WO2014011808A1

公开(公告)日：2014-01-16

申请号：PCT/US2013/049977

申请日：2013-07-10

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： CHEN, Howard, E. ,  READ, Matthew, Sean ,  NGUYEN, Hoang, Mong ,  LOBIANCO, Anthony, James ,  ZHANG, Guohao ,  HOANG, Dinhphuoc, Vu

IPC: H01L23/66

CPC classification number: G06F17/5072 ,  H01L21/561 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.

Abstract translation: 本公开的方面涉及确定构成封装模块的RF隔离结构的一部分的跑道的布局以及所得到的RF隔离结构。 可以识别可以调整（例如，变窄）和/或移除赛道的位置，而不会显着降低RF隔离结构的EMI性能。 在某些实施例中，可以移除跑道的一部分以产生断路，和/或可以在选定的区域中使跑道的一部分变窄。

公开(公告)号：WO2018067578A1

公开(公告)日：2018-04-12

申请号：PCT/US2017/054953

申请日：2017-10-03

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： CHEN, Howard, E. ,  DARVEAUX, Robert, Francis ,  NGUYEN, Hoang, Mong

IPC: H01L23/66 ,  H01L23/28 ,  H01L23/48 ,  H01L25/07

Abstract: A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Abstract translation: 披露了一种封装的射频设备，其包括被配置为接收一个或多个部件的封装衬底，该封装衬底包括第一侧和第二侧。 可以在封装衬底的第一侧上实施屏蔽封装，屏蔽封装包括第一电路和第一包覆模制结构，屏蔽封装配置成为第一电路的至少一部分提供射频屏蔽。 可以在封装衬底的第二侧上实施一组通孔连接，该组通孔连接在封装衬底的第二侧上限定安装体积。 该装置可以包括在安装体积内实施的部件和基本上包封一个或多个部件或一组模具连接的第二包覆成型结构。

公开(公告)号：WO2013188712A1

公开(公告)日：2013-12-19

申请号：PCT/US2013/045742

申请日：2013-06-13

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： CHEN, Howard, E. ,  GUO, Yifan ,  HOANG, Dinhphuoc, Vu ,  JANANI, Mehran ,  KO, Tin, Myint ,  LEHTOLA, Philip, John ,  LOBIANCO, Anthony, James ,  MODI, Hardik, Bhupendra ,  NGUYEN, Hoang, Mong ,  OZALAS, Matthew, Thomas ,  PETTY-WEEKS, Sandra, Louise ,  READ, Matthew, Sean ,  RIEGE, Jens, Albrecht ,  RIPLEY, David, Steven ,  SHAO, Hongxiao ,  SHEN, Hong ,  SUN, Weimin ,  SUN, Hsiang-Chih ,  WELCH, Patrick, Lawrence ,  ZAMPARDI, Peter, J., Jr. ,  ZHANG, Guohao

IPC: H03F1/30 ,  H03F3/189

CPC classification number: H03F1/0205 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4864 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L21/8249 ,  H01L21/8252 ,  H01L22/14 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/522 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L27/0605 ,  H01L27/0623 ,  H01L27/092 ,  H01L29/0684 ,  H01L29/0821 ,  H01L29/0826 ,  H01L29/1004 ,  H01L29/20 ,  H01L29/205 ,  H01L29/36 ,  H01L29/66242 ,  H01L29/66863 ,  H01L29/737 ,  H01L29/7371 ,  H01L29/812 ,  H01L29/8605 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/665 ,  H01L2223/6655 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48611 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48811 ,  H01L2224/48816 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49176 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85411 ,  H01L2224/85416 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/565 ,  H03F3/187 ,  H03F3/19 ,  H03F3/195 ,  H03F3/21 ,  H03F3/213 ,  H03F3/245 ,  H03F3/347 ,  H03F3/45 ,  H03F3/60 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2200/48 ,  H03F2200/555 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3x10 16 cm -3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.

Abstract translation: 功率放大器模块包括功率放大器，其包括具有集电极的GaAs双极晶体管，邻接集电极的基极和发射极，该集电极在与基极的接合处具有至少约3×10 16 cm -3的掺杂浓度，集电极 还具有至少一种其中掺杂浓度从基底增加的第一分级; 以及由功率放大器驱动的RF传输线，RF传输线包括在导电层上的导电层和精整电镀，精加工镀层包括金层，接近金层的钯层和靠近金层的扩散阻挡层 钯层，扩散阻挡层包括镍，并且其厚度小于0.9GHz处的镍的趋肤深度。 模块的其他实施例与其相关方法和组件一起提供。

公开(公告)号：WO2013009637A3

公开(公告)日：2013-01-17

申请号：PCT/US2012/045806

申请日：2012-07-06

Applicant: SKYWORKS SOLUTIONS, INC. ,  AGARWAL, Anil, K. ,  VU HOANG, Dinhphuoc ,  CHEN, Howard, E. ,  LOBIANCO, Anthony, James ,  READ, Matthew, Sean ,  NGUYEN, Hoang, Mong ,  ZHANG, Guohao

Inventor： AGARWAL, Anil, K. ,  VU HOANG, Dinhphuoc ,  CHEN, Howard, E. ,  LOBIANCO, Anthony, James ,  READ, Matthew, Sean ,  NGUYEN, Hoang, Mong ,  ZHANG, Guohao

IPC: H04B1/00 ,  H05K9/00

Abstract: Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding- wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement.