公开(公告)号：WO2013009640A2

公开(公告)日：2013-01-17

申请号：PCT/US2012/045811

申请日：2012-07-06

Applicant: SKYWORKS SOLUTIONS, INC. ,  ZHANG, Guohao ,  MODI, Hardik, Bhupendra ,  HOANG, Dinhphuoc, Vu

Inventor： ZHANG, Guohao ,  MODI, Hardik, Bhupendra ,  HOANG, Dinhphuoc, Vu

IPC: H03F1/56 ,  H03F3/24

CPC classification number: H03F1/56 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/48227 ,  H01L2924/10329 ,  H01L2924/13051 ,  H01L2924/1421 ,  H01L2924/19042 ,  H01L2924/19105 ,  H03F1/3205 ,  H03F1/565 ,  H03F3/19 ,  H03F3/21 ,  H03F3/245 ,  H03F3/601 ,  H03F2200/165 ,  H03F2200/171 ,  H03F2200/318 ,  H03F2200/411 ,  H03F2200/451 ,  Y10T29/4913

Abstract: This disclosure relates to a harmonic termination circuit that is separate from a load line. In one embodiment, the load line is configured to match an impedance at the power amplifier output at a fundamental frequency of the power amplifier output and the harmonic termination circuit is configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. According to certain embodiments, the load line and the harmonic termination circuit can be electrically coupled to the power amplifier output external to a power amplifier die via different output pins of the power amplifier die.

Abstract translation: 本公开涉及与负载线分离的谐波终端电路。 在一个实施例中，负载线被配置成匹配在功率放大器输出的基频处的功率放大器输出处的阻抗，并且谐波终端电路被配置为在对应于功率放大器输出的谐波频率的相位处终止。 根据某些实施例，负载线路和谐波终端电路可以通过功率放大器管芯的不同输出引脚电耦合到功率放大器管芯外部的功率放大器输出。

公开(公告)号：WO2013188712A1

公开(公告)日：2013-12-19

申请号：PCT/US2013/045742

申请日：2013-06-13

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： CHEN, Howard, E. ,  GUO, Yifan ,  HOANG, Dinhphuoc, Vu ,  JANANI, Mehran ,  KO, Tin, Myint ,  LEHTOLA, Philip, John ,  LOBIANCO, Anthony, James ,  MODI, Hardik, Bhupendra ,  NGUYEN, Hoang, Mong ,  OZALAS, Matthew, Thomas ,  PETTY-WEEKS, Sandra, Louise ,  READ, Matthew, Sean ,  RIEGE, Jens, Albrecht ,  RIPLEY, David, Steven ,  SHAO, Hongxiao ,  SHEN, Hong ,  SUN, Weimin ,  SUN, Hsiang-Chih ,  WELCH, Patrick, Lawrence ,  ZAMPARDI, Peter, J., Jr. ,  ZHANG, Guohao

IPC: H03F1/30 ,  H03F3/189

CPC classification number: H03F1/0205 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4864 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L21/8249 ,  H01L21/8252 ,  H01L22/14 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/522 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L27/0605 ,  H01L27/0623 ,  H01L27/092 ,  H01L29/0684 ,  H01L29/0821 ,  H01L29/0826 ,  H01L29/1004 ,  H01L29/20 ,  H01L29/205 ,  H01L29/36 ,  H01L29/66242 ,  H01L29/66863 ,  H01L29/737 ,  H01L29/7371 ,  H01L29/812 ,  H01L29/8605 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/665 ,  H01L2223/6655 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48611 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48811 ,  H01L2224/48816 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49176 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85411 ,  H01L2224/85416 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/565 ,  H03F3/187 ,  H03F3/19 ,  H03F3/195 ,  H03F3/21 ,  H03F3/213 ,  H03F3/245 ,  H03F3/347 ,  H03F3/45 ,  H03F3/60 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2200/48 ,  H03F2200/555 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3x10 16 cm -3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.

Abstract translation: 功率放大器模块包括功率放大器，其包括具有集电极的GaAs双极晶体管，邻接集电极的基极和发射极，该集电极在与基极的接合处具有至少约3×10 16 cm -3的掺杂浓度，集电极 还具有至少一种其中掺杂浓度从基底增加的第一分级; 以及由功率放大器驱动的RF传输线，RF传输线包括在导电层上的导电层和精整电镀，精加工镀层包括金层，接近金层的钯层和靠近金层的扩散阻挡层 钯层，扩散阻挡层包括镍，并且其厚度小于0.9GHz处的镍的趋肤深度。 模块的其他实施例与其相关方法和组件一起提供。

公开(公告)号：WO2013071152A2

公开(公告)日：2013-05-16

申请号：PCT/US2012/064509

申请日：2012-11-09

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： ZHANG, Guohao ,  MODI, Hardik, Bhupendra ,  JOSHI, Jaydutt, Jagdish ,  VIJAYAKUMAR, Bhuvaneshwaran ,  HOANG, Dinhphuoc, Vu

CPC classification number: H03F3/72 ,  H01L23/66 ,  H01L25/00 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/1305 ,  H01L2924/19041 ,  H01L2924/19105 ,  H03F1/0227 ,  H03F1/0277 ,  H03F1/56 ,  H03F3/195 ,  H03F3/211 ,  H03F3/245 ,  H03F2200/222 ,  H03F2200/318 ,  H03F2200/387 ,  H03F2200/411 ,  H03F2200/429 ,  H03F2203/7209 ,  H03F2203/7221 ,  H03F2203/7236 ,  H04B1/0458 ,  H04W52/02 ,  H01L2924/00

Abstract: Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.

Abstract translation: 公开了用于改善倒装芯片配置中实现的射频功率放大器的功率附加效率和线性度的设备和方法。 在一些实施例中，可以提供谐波终端电路以便与被配置为在基频处提供阻抗匹配的输出匹配网络分开。 谐波终端电路可以被配置为在与功率放大器输出的谐波频率对应的相位处终止。 独立的基本匹配网络和谐波终端电路的这种配置允许分别调谐每一个，从而改善诸如功率附加效率和线性的性能参数。

公开(公告)号：WO2020061400A1

公开(公告)日：2020-03-26

申请号：PCT/US2019/052064

申请日：2019-09-20

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： HOANG, Dinhphuoc, Vu ,  DARVEAUX, Robert, Francis

IPC: H01L23/552 ,  H01L23/29 ,  H01L23/485

Abstract: An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 pm for electromagnetic signals having frequencies in a kilohertz range.

公开(公告)号：WO2014011808A1

公开(公告)日：2014-01-16

申请号：PCT/US2013/049977

申请日：2013-07-10

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： CHEN, Howard, E. ,  READ, Matthew, Sean ,  NGUYEN, Hoang, Mong ,  LOBIANCO, Anthony, James ,  ZHANG, Guohao ,  HOANG, Dinhphuoc, Vu

IPC: H01L23/66

CPC classification number: G06F17/5072 ,  H01L21/561 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.

Abstract translation: 本公开的方面涉及确定构成封装模块的RF隔离结构的一部分的跑道的布局以及所得到的RF隔离结构。 可以识别可以调整（例如，变窄）和/或移除赛道的位置，而不会显着降低RF隔离结构的EMI性能。 在某些实施例中，可以移除跑道的一部分以产生断路，和/或可以在选定的区域中使跑道的一部分变窄。