公开(公告)号：WO2020118300A1

公开(公告)日：2020-06-11

申请号：PCT/US2019/065242

申请日：2019-12-09

申请人： TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS JAPAN LIMITED

发明人： ZHANG, Rongwei ,  GUPTA, Vikas

IPC分类号： H01L21/50 ,  H01L23/48

摘要： In a described example, a packaged device (100) includes a substrate (101) having a device mounting surface with conductive lands (103) having a first thickness spaced from one another on the device mounting surface. A first polymer layer (105) is disposed on the device mounting surface between the conductive lands (103) having a second thickness equal to the first thickness. The conductive lands (103) have an outer surface not covered by the first polymer layer (105). A second polymer layer (107) is disposed on the first polymer layer (105), the outer surface of the conductive lands (103) not covered by the second polymer layer (107). Conductive nanoparticle material (109) is disposed on the outer surface of the conductive lands (103). A third polymer layer (111) is disposed on the second polymer layer (107) between the conductive nanoparticle material (109) on the conductive lands (103). At least one semiconductor device die (121) is mounted to the third polymer layer (111) having electrical terminals (123) bonded to the conductive nanoparticle material (109).

公开(公告)号：WO2017117537A1

公开(公告)日：2017-07-06

申请号：PCT/US2016/069510

申请日：2016-12-30

申请人： TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS JAPAN LIMITED

发明人： LIN, Yong ,  ZHANG, Rongwei ,  COOK, Benjamin, Stassen ,  CASTRO, Abram

IPC分类号： H01L21/50 ,  H01L21/98 ,  H01L27/12

CPC分类号： H01L21/50 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2021/60277 ,  H01L2224/2919 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48996 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/80856 ,  H01L2224/83192 ,  H01L2224/8392 ,  H01L2224/83951 ,  H01L2224/8502 ,  H01L2224/85051 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2224/45099 ,  H01L2924/0665

摘要： In described examples, a method (400) includes applying a die attach material to a die pad of an integrated circuit (410). The die attach material is employed as a bonding material to the die pad. The method (400) includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material (420). The method (400) includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad (430).

摘要翻译： 在所描述的示例中，方法（400）包括将管芯附着材料施加到集成电路（410）的管芯焊盘上。 芯片附着材料被用作芯片焊盘的结合材料。 该方法（400）包括经由管芯附接材料（420）将集成电路管芯安装到集成电路的管芯焊盘。 方法（400）包括在出现在集成电路管芯和集成电路的管芯焊盘的界面处的管芯附着材料上印刷粘附沉积材料，以减轻集成电路管芯和管芯焊盘（430）之间的分层。 / p>

公开(公告)号：WO2016049649A1

公开(公告)日：2016-03-31

申请号：PCT/US2015/052706

申请日：2015-09-28

申请人： TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS JAPAN LIMITED

发明人： COOK, Benjamin, Stassen ,  HERBSOMMER, Juan, Alejandro ,  LIN, Yong ,  ZHANG, Rongwei ,  CASTRO, Abram ,  ROMIG, Matthew, David

IPC分类号： H01L21/50 ,  H01L23/485 ,  B33Y10/00

CPC分类号： H01L23/4952 ,  H01L21/2885 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4867 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49572 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/0612 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1511 ,  H01L2924/1711 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665

摘要： In described examples, a method (100) of lead frame surface modification includes providing (101) at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additive ly deposited (102) including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured (103) to remove the liquid carrier so that a substantially solid ink residue remains.

摘要翻译： 在所描述的示例中，引线框架表面改性的方法（100）包括提供（101）至少一个预制金属引线框架或封装基板（基板）单元，该单元包括具有管芯焊盘的基底金属和围绕 芯片垫。 包括在固化步骤中形成固体的固体的固体或前体的物质或除去液体载体的烧结步骤的油墨被包括在（i）区域中的至少一个区域 和（ii）在至少第一接触区域（第一接触区域）的一个区域。 油墨被烧结或固化（103）以除去液体载体，使得残留基本上固体的油墨残余物。