公开(公告)号：WO2019241208A1

公开(公告)日：2019-12-19

申请号：PCT/US2019/036493

申请日：2019-06-11

申请人： TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS JAPAN LIMITED

发明人： CASTRO, Abram ,  CHAUDHRY, Usman ,  GARCIA, Joe Adam ,  CHOWDHURY, Mahmud Halim

IPC分类号： H01L21/56 ,  H01L23/495 ,  H05K5/00

摘要： An apparatus and method for providing an artificial standoff (38) to the bottom of leads (12) on a QFN device (40) sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).

公开(公告)号：WO2017117537A1

公开(公告)日：2017-07-06

申请号：PCT/US2016/069510

申请日：2016-12-30

申请人： TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS JAPAN LIMITED

发明人： LIN, Yong ,  ZHANG, Rongwei ,  COOK, Benjamin, Stassen ,  CASTRO, Abram

IPC分类号： H01L21/50 ,  H01L21/98 ,  H01L27/12

CPC分类号： H01L21/50 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2021/60277 ,  H01L2224/2919 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48996 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/80856 ,  H01L2224/83192 ,  H01L2224/8392 ,  H01L2224/83951 ,  H01L2224/8502 ,  H01L2224/85051 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2224/45099 ,  H01L2924/0665

摘要： In described examples, a method (400) includes applying a die attach material to a die pad of an integrated circuit (410). The die attach material is employed as a bonding material to the die pad. The method (400) includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material (420). The method (400) includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad (430).

摘要翻译： 在所描述的示例中，方法（400）包括将管芯附着材料施加到集成电路（410）的管芯焊盘上。 芯片附着材料被用作芯片焊盘的结合材料。 该方法（400）包括经由管芯附接材料（420）将集成电路管芯安装到集成电路的管芯焊盘。 方法（400）包括在出现在集成电路管芯和集成电路的管芯焊盘的界面处的管芯附着材料上印刷粘附沉积材料，以减轻集成电路管芯和管芯焊盘（430）之间的分层。 / p>

公开(公告)号：WO2016049649A1

公开(公告)日：2016-03-31

申请号：PCT/US2015/052706

申请日：2015-09-28

申请人： TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS JAPAN LIMITED

发明人： COOK, Benjamin, Stassen ,  HERBSOMMER, Juan, Alejandro ,  LIN, Yong ,  ZHANG, Rongwei ,  CASTRO, Abram ,  ROMIG, Matthew, David

IPC分类号： H01L21/50 ,  H01L23/485 ,  B33Y10/00

CPC分类号： H01L23/4952 ,  H01L21/2885 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4867 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49572 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/0612 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1511 ,  H01L2924/1711 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665

摘要： In described examples, a method (100) of lead frame surface modification includes providing (101) at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additive ly deposited (102) including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured (103) to remove the liquid carrier so that a substantially solid ink residue remains.

摘要翻译： 在所描述的示例中，引线框架表面改性的方法（100）包括提供（101）至少一个预制金属引线框架或封装基板（基板）单元，该单元包括具有管芯焊盘的基底金属和围绕 芯片垫。 包括在固化步骤中形成固体的固体的固体或前体的物质或除去液体载体的烧结步骤的油墨被包括在（i）区域中的至少一个区域 和（ii）在至少第一接触区域（第一接触区域）的一个区域。 油墨被烧结或固化（103）以除去液体载体，使得残留基本上固体的油墨残余物。

公开(公告)号：WO2016033229A1

公开(公告)日：2016-03-03

申请号：PCT/US2015/047019

申请日：2015-08-26

申请人： TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS JAPAN LIMITED

发明人： CASTRO, Abram

IPC分类号： H01L33/62

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066

摘要： A flip chip light emitting diode (LED) package (200) includes an LED die (220) having a first substrate (221), a p-type region (222) and an n-type region (224) including an active layer (223) in between, a metal contact on the p-type region (anode contact) (226), and a metal contact on the n-type region (cathode contact) (227). A package substrate (240) or lead frame includes a dielectric material (240a) that has a first metal through via (first metal post) (240b) and second metal through via (second metal post) (240c) spaced apart from one another and embedded in the dielectric material. A first metal pad (241) is on a bottom side of the first metal post, and a second metal pad (242) is on a bottom side of the second metal post. An interconnect metal paste or metal ink residual (metal residual) is between the anode contact and first metal post and between the cathode contact and the second metal post.

摘要翻译： 倒装芯片发光二极管（LED）封装（200）包括具有第一衬底（221），p型区域（222）和n型区域（224）的LED管芯（220），所述p型区域包括有源层 223），p型区域（阳极接触）（226）上的金属接触和n型区域（阴极接触）（227）上的金属接触。 封装衬底（240）或引线框架包括具有彼此间隔开的第一金属通孔（第一金属柱）（240b）和第二金属通孔（第二金属柱）（240c））的电介质材料（240a），以及 嵌入电介质材料。 第一金属焊盘（241）位于第一金属柱的底侧，第二金属焊盘（242）位于第二金属柱的底侧。 在阳极接触和第一金属柱之间以及阴极接触件和第二金属柱之间，互连金属浆料或金属油墨残留物（金属残留物）。