公开(公告)号：WO2012058074A2

公开(公告)日：2012-05-03

申请号：PCT/US2011/056957

申请日：2011-10-19

Applicant: RAMBUS INC. ,  FRANZON, Paul, Damian ,  WILSON, John

Inventor： FRANZON, Paul, Damian ,  WILSON, John

IPC: H01L23/10 ,  H01L23/28 ,  H01L23/48

CPC classification number: H01L24/05 ,  H01L23/48 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05098 ,  H01L2224/05186 ,  H01L2224/08145 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00013 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/053 ,  H01L2924/00

Abstract: A semiconductor package is disclosed. The semiconductor package includes a first semiconductor device having a first contactless signaling interface; and a second semiconductor device. The second semiconductor device has a second contactless signaling interface to electrically communicate with the first contactless signaling interface. The second semiconductor device is formed with a gap disposed proximate the second contactless signaling interface.

Abstract translation: 公开了半导体封装。 半导体封装包括具有第一非接触式信令接口的第一半导体器件; 和第二半导体器件。 第二半导体器件具有用于与第一非接触式信令接口电通信的第二非接触信令接口。 第二半导体器件形成有靠近第二非接触信号接口设置的间隙。

公开(公告)号：WO2014125861A2

公开(公告)日：2014-08-21

申请号：PCT/JP2014/050655

申请日：2014-01-16

Applicant: オリンパス株式会社

Inventor： 齊藤　晴久 ,  只木　芳隆 ,  右田　千裕

IPC: H01L21/60 ,  H01L27/14

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L27/14636 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05096 ,  H01L2224/05098 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05576 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/11622 ,  H01L2224/11826 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13013 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13551 ,  H01L2224/13552 ,  H01L2224/1356 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13666 ,  H01L2224/13669 ,  H01L2224/13684 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81009 ,  H01L2224/8109 ,  H01L2224/81092 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/8138 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81466 ,  H01L2224/81469 ,  H01L2224/81484 ,  H01L2224/81903 ,  H01L2224/831 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2224/11825 ,  H01L2924/014

公开(公告)号：WO2012058074A3

公开(公告)日：2012-07-12

申请号：PCT/US2011056957

申请日：2011-10-19

Applicant: RAMBUS INC ,  FRANZON PAUL DAMIAN ,  WILSON JOHN

Inventor： FRANZON PAUL DAMIAN ,  WILSON JOHN

IPC: H01L23/10 ,  H01L23/28 ,  H01L23/48

CPC classification number: H01L24/05 ,  H01L23/48 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05098 ,  H01L2224/05186 ,  H01L2224/08145 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00013 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/053 ,  H01L2924/00

Abstract: A semiconductor package is disclosed. The semiconductor package includes a first semiconductor device having a first contactless signaling interface; and a second semiconductor device. The second semiconductor device has a second contactless signaling interface to electrically communicate with the first contactless signaling interface. The second semiconductor device is formed with a gap disposed proximate the second contactless signaling interface.

Abstract translation: 公开了一种半导体封装。 该半导体封装包括具有第一非接触式信令接口的第一半导体器件; 和第二半导体器件。 第二半导体器件具有第二非接触式信令接口以与第一非接触式信令接口电连通。 第二半导体器件形成有靠近第二非接触式信号传输接口设置的间隙。