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公开(公告)号：WO2013125086A1
公开(公告)日：2013-08-29
申请号：PCT/JP2012/075412
申请日：2012-10-01
Applicant: 日立化成株式会社
CPC classification number: C09J11/06 , B23K35/3613 , B23K35/3618 , B23K35/362 , C08K5/092 , C09J163/00 , H01L21/563 , H01L23/295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/03825 , H01L2224/0401 , H01L2224/051 , H01L2224/05111 , H01L2224/05116 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05575 , H01L2224/0558 , H01L2224/056 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11825 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13575 , H01L2224/1358 , H01L2224/136 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17181 , H01L2224/271 , H01L2224/27416 , H01L2224/27436 , H01L2224/27848 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73104 , H01L2224/81011 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81895 , H01L2224/81907 , H01L2224/831 , H01L2224/83191 , H01L2224/83203 , H01L2224/83855 , H01L2224/83862 , H01L2224/9205 , H01L2224/92122 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H05K3/305 , H05K3/3436 , H05K2201/0367 , H05K2201/10977 , Y02P70/613 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2224/8385 , H01L2924/00 , C08L63/00 , H01L2224/27 , H01L2924/01047 , H01L2924/01082 , H01L2924/01083 , H01L2924/01029 , H01L2224/11 , H01L2924/0001
Abstract: エポキシ樹脂、硬化剤及び下記式（１）で表される基を有する化合物を含有する、半導体用接着剤。［式中、Ｒ １ は、電子供与性基を示す。］
Abstract translation: 提供一种含有环氧树脂，固化剂和具有式（1）所示基团的化合物的半导体粘合剂。 [式中，R1表示给电子基团]
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公开(公告)号：WO2013125685A1
公开(公告)日：2013-08-29
申请号：PCT/JP2013/054541
申请日：2013-02-22
Applicant: 日立化成株式会社
IPC: H01L21/60 , C09J11/06 , C09J163/00 , H01L21/56
CPC classification number: H01L21/56 , B23K35/3612 , B23K35/3618 , C08K5/092 , C09J11/06 , C09J163/00 , C09J2463/00 , H01L21/563 , H01L23/293 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2021/60 , H01L2224/03825 , H01L2224/0401 , H01L2224/051 , H01L2224/05111 , H01L2224/05116 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05575 , H01L2224/0558 , H01L2224/056 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11825 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13575 , H01L2224/1358 , H01L2224/136 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/16146 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17181 , H01L2224/271 , H01L2224/27416 , H01L2224/27436 , H01L2224/27848 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8121 , H01L2224/81447 , H01L2224/81815 , H01L2224/81895 , H01L2224/81907 , H01L2224/831 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9205 , H01L2224/9211 , H01L2224/92122 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/06 , H01L2924/10253 , H01L2924/00 , H01L2224/16145 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/0665 , H01L2924/00012 , H01L2924/014 , H01L2224/27 , H01L2924/01047 , H01L2924/01082 , H01L2924/01083 , H01L2924/01029 , H01L2224/11
Abstract: 半導体チップ及び配線回路基板のそれぞれの接続部が互いに電気的に接続された半導体装置、又は、複数の半導体チップのそれぞれの接続部が互いに電気的に接続された半導体装置の製造方法であって、上記接続部の少なくとも一部を、下記式（１－１）又は（１－２）で表される基を有する化合物を含有する半導体用接着剤を用いて封止する工程を備える、半導体装置の製造方法。［式中、Ｒ １ は電子供与性基を示し、複数存在するＲ １ は互いに同一でも異なっていてもよい。］
Abstract translation: 提供了一种半导体器件的制造方法，其中半导体芯片和布线电路板的各个连接部分彼此电连接，或者对于半导体器件，其中多个半导体芯片的各个连接部分是电气的 相互连接。 半导体的制造方法包括使用包含由式（1-1）或式（1-2）表示的基团的化合物的半导体用粘合剂来密封连接部的至少一部分的工序。 [式（1-1）和（1-2）中，R1表示给电子基团，多个R 1可以相同也可以不同。
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公开(公告)号：WO2013125087A1
公开(公告)日：2013-08-29
申请号：PCT/JP2012/075414
申请日：2012-10-01
Applicant: 日立化成株式会社
IPC: C09J163/00 , C09J7/00 , C09J11/06 , H01L21/60
CPC classification number: H01L23/293 , C08K5/092 , C09J11/06 , C09J163/00 , H01L21/56 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/03825 , H01L2224/0401 , H01L2224/051 , H01L2224/05111 , H01L2224/05116 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05575 , H01L2224/0558 , H01L2224/056 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11825 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13575 , H01L2224/1358 , H01L2224/136 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17181 , H01L2224/271 , H01L2224/27416 , H01L2224/27436 , H01L2224/27848 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73104 , H01L2224/81011 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81895 , H01L2224/81907 , H01L2224/831 , H01L2224/83191 , H01L2224/83203 , H01L2224/8349 , H01L2224/83862 , H01L2224/9205 , H01L2224/92122 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/10253 , H05K3/305 , H05K3/3436 , H05K2201/0367 , H05K2201/10977 , Y02P70/613 , H01L2924/0665 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2924/00 , H01L2224/27 , H01L2924/01047 , H01L2924/01082 , H01L2924/01083 , H01L2924/01029 , H01L2224/11
Abstract: エポキシ樹脂、硬化剤及び下記式（１－１）又は（１－２）で表される基を有する化合物からなるフラックス剤を含有する、半導体用接着剤。 ［式中、Ｒ １ は電子供与性基を示し、複数存在するＲ １ は互いに同一でも異なっていてもよい。］
Abstract translation: 提供一种包含环氧树脂，固化剂和助熔剂的半导体用粘合剂，其包含具有式（1-1）或式（1-2）所示基团的化合物。 [式中，R1表示给电子基，多个R 1可以相同也可以不同。
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