专利检索 ap:("先端光子公司") AND inv:"管野元太" 第 1 页

1.

发明授权
基台和密封完毕的半导体元件以及它们的制作方法有权

公开(公告)号：CN104380460B

公开(公告)日：2017-07-28

申请号：CN201380030921.6

申请日：2013-07-05

申请人： 先端光子公司

发明人： 宋学良 , 佐藤望 , 管野元太 , 牧野瑶子

IPC分类号： H01L23/13 , H01L21/60 , H01L23/31 , H01L23/498 , H01L21/56 , H01L25/03 , H01L25/065

CPC分类号： H01L24/17 , H01L21/561 , H01L23/13 , H01L23/3114 , H01L23/3121 , H01L23/3135 , H01L23/49805 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L2224/03334 , H01L2224/0401 , H01L2224/04042 , H01L2224/05552 , H01L2224/05644 , H01L2224/05647 , H01L2224/05669 , H01L2224/06155 , H01L2224/13144 , H01L2224/16105 , H01L2224/16108 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1714 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48137 , H01L2224/48157 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48496 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48997 , H01L2224/4911 , H01L2224/49175 , H01L2224/73207 , H01L2224/73265 , H01L2224/81193 , H01L2224/85395 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/85466 , H01L2224/8592 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06551 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15159 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2224/03 , H01L2224/85 , H01L2924/00 , H01L2224/48455 , H01L2924/00012 , H01L2224/4554

摘要： 本发明提供一种能容易与主基板上的IC连接的、具备半导体元件(104)的基台(100)。本发明的一个实施方式的基台(100)包括基板(101)、电极(102)、(103)、半导体元件(104)、Au引线(105)和金凸起(106)、(107)。电极(102)、(103)、半导体元件(104)、Au引线(105)和金凸起(106)、(107)由树脂(108)在基板(101)上密封。在电极(103)上并且在Au引线(105)上利用球焊形成金凸起(107)后，对其利用划片加以切断而露出侧面。露出了的面作为基台(100)的侧面电极发挥作用。

2.

发明公开
基台和密封完毕的半导体元件以及它们的制作方法有权

公开(公告)号：CN104380460A

公开(公告)日：2015-02-25

申请号：CN201380030921.6

申请日：2013-07-05

申请人： 先端光子公司

发明人： 宋学良 , 佐藤望 , 管野元太 , 牧野瑶子

IPC分类号： H01L23/13 , H01L21/60 , H01L23/31 , H01L23/498 , H01L21/56 , H01L25/03 , H01L25/065

CPC分类号： H01L24/17 , H01L21/561 , H01L23/13 , H01L23/3114 , H01L23/3121 , H01L23/3135 , H01L23/49805 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L2224/03334 , H01L2224/0401 , H01L2224/04042 , H01L2224/05552 , H01L2224/05644 , H01L2224/05647 , H01L2224/05669 , H01L2224/06155 , H01L2224/13144 , H01L2224/16105 , H01L2224/16108 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1714 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48137 , H01L2224/48157 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48496 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48997 , H01L2224/4911 , H01L2224/49175 , H01L2224/73207 , H01L2224/73265 , H01L2224/81193 , H01L2224/85395 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/85466 , H01L2224/8592 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06551 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15159 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2224/03 , H01L2224/85 , H01L2924/00 , H01L2224/48455 , H01L2924/00012 , H01L2224/4554

摘要： 本发明提供一种能容易与主基板上的IC连接的、具备半导体元件(104)的基台(100)。本发明的一个实施方式的基台(100)包括基板(101)、电极(102)、(103)、半导体元件(104)、Au引线(105)和金凸起(106)、(107)。电极(102)、(103)、半导体元件(104)、Au引线(105)和金凸起(106)、(107)由树脂(108)在基板(101)上密封。在电极(103)上并且在Au引线(105)上利用球焊形成金凸起(107)后，对其利用划片加以切断而露出侧面。露出了的面作为基台(100)的侧面电极发挥作用。