公开(公告)号：EP3419392A1

公开(公告)日：2018-12-26

申请号：EP17894504.4

申请日：2017-09-11

申请人： Shenzhen Infiled Electronics Co., Ltd

发明人： LIU, Qiuhe ,  GUO, Yang ,  HU, Rihao

IPC分类号： H05K3/00 ,  G09F9/33

CPC分类号： H05K1/0281 ,  F21V19/005 ,  F21Y2115/10 ,  H05K1/0277 ,  H05K1/0284 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10522

摘要： The present invention discloses a device for bending sheets. The device includes at least two abutting members which are respectively defined as a first abutting member and a second abutting member. The sheet comprises a first outside surface and a second outside surface opposite to the first outside surface. The first abutting member is fixedly connected to the second outside surface of the sheet. The second abutting member attached to the second outside surface of the sheet is rotatably connected to the first abutting member. The first abutting member and the second abutting member are rotatably connected together and capable of being locked with each other so as to obtain a desired curvature of the sheet, which hardly damages the sheet.

公开(公告)号：EP3288348A4

公开(公告)日：2018-05-02

申请号：EP15890019

申请日：2015-11-09

申请人： HANSOL TECHNICS INC

发明人： BOO JAE-HO ,  CHOI CHI-YOUNG

IPC分类号： H01Q1/38 ,  H05K1/11 ,  H05K3/00

CPC分类号： H01Q1/38 ,  H01Q1/243 ,  H05K1/032 ,  H05K1/119 ,  H05K3/0014 ,  H05K3/06 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09018 ,  H05K2203/0759

摘要： The present invention relates to a curved-type rigid board and a manufacturing method thereof. According to the present invention, it is possible to maximize space utilization in a portable terminal by easily applying a three-dimensional antenna to the portable terminal by means of a curved-type rigid board having a curved state with a certain curvature.

公开(公告)号：EP3036473A4

公开(公告)日：2017-07-26

申请号：EP14837781

申请日：2014-08-22

申请人： MOLEX LLC ,  MCGOWAN DANIEL B ,  PICINI MICHAEL C

发明人： MCGOWAN DANIEL B ,  PICINI MICHAEL C

IPC分类号： F21S2/00 ,  F21Y115/10 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H05K1/05 ,  H05K1/11

CPC分类号： F21K9/20 ,  F21K9/30 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/05 ,  H05K1/117 ,  H05K1/183 ,  H05K3/0026 ,  H05K3/12 ,  H05K2201/09018 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

摘要： A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

摘要翻译： 发光二极管（LED）模块包括导电的基座并且选择性地覆盖有绝缘层。 基座可以包括连接凸缘和发光区域。 在绝缘涂层上提供迹线，并且可以用来将位于发光区域上的LED连接到连接法兰上的焊盘。 连接凸缘可以从基座偏移角度和/或位置，并且可以构造成提供适合以极化方式与连接器配合的接触形状。 底座可以成形以提供所需的功能。

公开(公告)号：EP3010315A1

公开(公告)日：2016-04-20

申请号：EP14189248.9

申请日：2014-10-16

申请人： Nokia Technologies OY

发明人： Cotton, Darryl Paul James ,  Robinson, Adam ,  Andrew, Piers

IPC分类号： H05K1/02

CPC分类号： B81B7/0054 ,  B81B2201/0278 ,  B81B2201/0292 ,  H05K1/0283 ,  H05K1/167 ,  H05K2201/09018 ,  H05K2201/09109 ,  H05K2201/09263 ,  H05K2201/10151

摘要： An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes; at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.

摘要翻译： 一种装置和方法，其中所述方法包括：可变形基板; 弯曲的支撑结构，其构造成支撑电阻式传感器的至少一部分，其中所述电阻式传感器包括设置在所述电极之间的第一电极，第二电极和电阻式传感器材料; 至少一个支撑件被构造成将弯曲的支撑结构与可变形基板隔开，使得当可变形的基板变形时，弯曲的支撑结构不会以相同的方式变形; 其中所述电阻传感器位于所述弯曲的支撑结构上，以便当所述可变形基板变形时限制所述电阻式传感器的变形。

公开(公告)号：EP2435755B1

公开(公告)日：2016-03-30

申请号：EP10721762.2

申请日：2010-05-11

申请人： OSRAM GmbH

发明人： BERTRAM, Ralph ,  FROST, Tobias ,  HERBOLD, Christian ,  STRAUSS, Steffen

IPC分类号： F21S4/00

CPC分类号： F21V29/70 ,  F21S4/20 ,  F21V3/061 ,  F21V3/062 ,  F21V7/005 ,  F21V7/22 ,  F21V23/02 ,  F21V29/004 ,  F21V29/20 ,  F21V29/506 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2201/10106

公开(公告)号：EP2435755A1

公开(公告)日：2012-04-04

申请号：EP10721762.2

申请日：2010-05-11

申请人： OSRAM AG

发明人： BERTRAM, Ralph ,  FROST, Tobias ,  HERBOLD, Christian ,  STRAUSS, Steffen

IPC分类号： F21S4/00

CPC分类号： F21V29/70 ,  F21S4/20 ,  F21V3/061 ,  F21V3/062 ,  F21V7/005 ,  F21V7/22 ,  F21V23/02 ,  F21V29/004 ,  F21V29/20 ,  F21V29/506 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2201/10106

摘要： The invention relates to an illumination module (2) having at least one flexible, particularly ribbon-shaped, carrier (4) for several heat sources, including light sources (6), wherein the carrier is intended to be bent across at least part of its width. The illumination device is provided with a curved base (9) and at least one illumination module, wherein the illumination module is flatly attached to the base with its widthwise curved part, at least sectionally.

摘要翻译： 照明模块可以包括用于多个热源的至少一个柔性载体，包括光源，其中所述载体设置成在其宽度的至少一部分上弯曲。

公开(公告)号：EP1446000B1

公开(公告)日：2011-11-09

申请号：EP03388026.1

申请日：2003-04-25

申请人： Sony Ericsson Mobile Communications AB

发明人： Fagrenius, Gustav ,  Bengtsson, Henrik ,  Andersson, Niklas ,  Palmqvist, Fredrik

IPC分类号： H05K9/00

CPC分类号： H05K9/0032 ,  H05K3/341 ,  H05K2201/09018 ,  H05K2201/1028 ,  H05K2201/10371 ,  H05K2201/10916 ,  Y02P70/613

公开(公告)号：EP1949771B1

公开(公告)日：2009-05-13

申请号：EP06831001.0

申请日：2006-10-24

申请人： ASTRIUM SAS

发明人： DESAGULIER, Christian

IPC分类号： H05K3/02 ,  H05K3/24 ,  C25D5/00 ,  C25D5/08 ,  C25D7/06 ,  H01Q1/38 ,  H01Q3/46 ,  H05K1/09 ,  H05K3/00 ,  H05K3/12

CPC分类号： H05K1/00 ,  C25D5/02 ,  C25D5/06 ,  H01Q15/141 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/027 ,  H05K3/125 ,  H05K3/241 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/09018 ,  H05K2203/013 ,  H05K2203/0195 ,  Y10T29/49126 ,  Y10T29/49128

摘要： The invention relates to a method for producing a non-developable surface printed circuit and to the thus obtained printed circuit. According to said invention, each electrically conductive pattern (7) of a printed circuit (2) comprises a base (7E), which is arranged on the non-developable surface (6) and obtained by projecting an electrically conductive varnish, and a coating (7R), which is arranged on said base (7E) and made of an electrically well conductive material by means of buffer electrolysis.

公开(公告)号：EP1852003A1

公开(公告)日：2007-11-07

申请号：EP06709342.7

申请日：2006-02-20

申请人： ASTRIUM SAS

发明人： DESAGULIER, Christian ,  LACOMBE, Alain ,  ESMILLER, Bruno

IPC分类号： H05K3/06 ,  H05K3/00 ,  H01Q1/38 ,  H01Q15/14 ,  H01Q15/16

CPC分类号： H05K3/061 ,  H01Q1/38 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/013 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The invention concerns a method which consists in coating uniformly the non-developable surface (6) with an electrically conductive material (9), which is in turn coated, by spraying, with a pattern (10) of polymerizable protective material, said pattern being polymerized as it is being formed, and then selectively eliminating, through the openings (10.8) of said pattern (10), the portions of said electrically conductive material (9) which do not cover said electrically conductive patterns.

公开(公告)号：EP1445998B1

公开(公告)日：2007-10-24

申请号：EP03388024.6

申请日：2003-04-25

申请人： Sony Ericsson Mobile Communications AB

发明人： Fagrenius, Gustav ,  Bengtsson, Henrik ,  Sandevi, Tommy ,  Hermann, Frederik Per ,  Andersson, Niklas ,  Meynert, Hans

IPC分类号： H05K9/00

CPC分类号： H05K9/003 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/341 ,  H05K2201/09018 ,  H05K2201/10371 ,  Y02P70/613