公开(公告)号：EP2729595A1

公开(公告)日：2014-05-14

申请号：EP12730564.7

申请日：2012-06-29

申请人： Atotech Deutschland GmbH

发明人： HÜLSMANN, Thomas ,  CLICQUE, Arno ,  TEWS, Dirk ,  KLOPPISCH, Mirko ,  LIONG, Andry

IPC分类号： C23C22/52 ,  H05K3/38 ,  C23F1/18

CPC分类号： B05D3/102 ,  B05D1/02 ,  B05D1/32 ,  C23C22/52 ,  C23F1/18 ,  H05K3/28 ,  H05K3/385 ,  Y10T428/265

摘要： The present invention relates to a method for increasing the adhesion of organic resist materials on copper or copper alloy surfaces. The copper or copper alloy surface is contacted with an aqueous adhesion promoting solution comprising at least one organic acid, a peroxide compound and optionally one or more substances selected from the group consisting of urea, derivatives thereof and water-soluble polymers.

公开(公告)号：EP2711977A1

公开(公告)日：2014-03-26

申请号：EP12185004.4

申请日：2012-09-19

申请人： Atotech Deutschland GmbH

发明人： Beck, Thomas ,  Steinberger, Gerhard ,  Walter, Andreas

IPC分类号： H01L21/60 ,  H01L23/485

CPC分类号： H01L24/14 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05583 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/10145 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/11821 ,  H01L2224/11822 ,  H01L2224/11823 ,  H01L2224/11825 ,  H01L2224/11901 ,  H01L2224/13005 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/13673 ,  H01L2224/13676 ,  H01L2224/16507 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/3841 ,  H01L2924/01074 ,  H01L2924/01015 ,  H01L2924/01005 ,  H01L2924/01042 ,  H01L2924/20751 ,  H01L2924/2076 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2224/05552

摘要： The present invention relates to a method for forming a copper pillar on a semiconducting substrate, the copper pillar having an underbump metallization area comprising a metal less noble than copper and optionally a solder bump on the top portion, and having a layer of a second metal selected from tin, tin alloys, silver, and silver alloys deposited onto the side walls of said copper pillar. A layer of a first metal which is more noble than copper is deposited onto the entire outer surface of the copper pillar prior to deposition of the second metal layer. The layer of a second metal then has at least a reduced number of undesired pin-holes and serves as a protection layer for the underlying copper pillar.

摘要翻译： 本发明涉及一种用于在半导体衬底上形成铜柱的方法，所述铜柱具有底部金属化区域，所述底部衬底金属化区域包括比铜高的金属和在顶部上的任选的焊料凸块，并且具有第二金属层 选自沉积在所述铜柱的侧壁上的锡，锡合金，银和银合金。 在沉积第二金属层之前，在铜柱的整个外表面上沉积比铜更贵的第一金属层。 然后，第二金属层至少具有减少数量的不期望的针孔，并且用作下面的铜柱的保护层。

公开(公告)号：EP2698449A1

公开(公告)日：2014-02-19

申请号：EP12180227.6

申请日：2012-08-13

申请人： Atotech Deutschland GmbH

发明人： Niemann, Sandra ,  Schafsteller, Britta Dr. ,  Schulz, Jenny ,  Habig, Ellen ,  Brunner, Dr. Heiko ,  Kohlmann, Lars ,  Rückbrod, Sven

IPC分类号： C23C18/54

CPC分类号： C23C18/54

摘要： The present invention relates to a cyanide-free aqueous immersion-type plating bath for deposition of gold, comprising gold ions, at least one complexing agent, sulfite ions, thiosulfate ions, and at least one ureylene polymer additive. The gold layer deposited from the plating bath according to the present invention shows a lemon-yellow colour and a sufficient wettability for tin based solder materials.

摘要翻译： 本发明涉及一种用于沉积金的无氰化合物浸渍型电镀液，其包含金离子，至少一种络合剂，亚硫酸根离子，硫代硫酸根离子和至少一种乙烯基聚合物添加剂。 根据本发明从镀浴沉积的金层显示柠檬黄色和对锡基焊料材料具有足够的润湿性。

公开(公告)号：EP2611950A1

公开(公告)日：2013-07-10

申请号：EP11760829.9

申请日：2011-07-08

申请人： Atotech Deutschland GmbH

发明人： PREISSER, Robert, F.

IPC分类号： C25D3/38 ,  C25D5/00 ,  C25D7/12 ,  C25D21/02 ,  H01L21/288 ,  H01L21/768

CPC分类号： C25D3/38 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D21/02 ,  H01L21/2885 ,  H01L21/76898 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1461 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/32145 ,  H01L2924/00 ,  H01L2924/014

摘要： Process of electrodepositing a metal in a high aspect ratio via in a silicon substrate to form a through-silicon-via (TSV), utilizing an electrolytic bath including a redox mediator, in an electrolytic metal plating system including a chuck adapted to hold the silicon substrate and to heat the silicon substrate to a first temperature, a temperature control device to maintain temperature of the electrolytic bath at a second temperature, in which the first temperature is maintained in a range from about 30° C. to about 60° C. and the second temperature is maintained at a temperature (a) at least 5° C. lower than the first temperature and (b) in a range from about 15° C. to about 35° C.

公开(公告)号：EP2603064A1

公开(公告)日：2013-06-12

申请号：EP11192516.0

申请日：2011-12-08

申请人： Atotech Deutschland GmbH

发明人： Tews, Dr. Dirk ,  Zee, Adrian ,  Hülsmann, Thomas ,  Kim, Kwonil

IPC分类号： H05K3/38 ,  H05K3/06

CPC分类号： H05K3/389 ,  H05K3/067 ,  H05K3/384 ,  H05K2203/0361 ,  H05K2203/073 ,  H05K2203/0793

摘要： The present invention relates to a method for manufacture of multilayer printed circuit boards and articles formed thereby, especially IC substrates. The method utilizes a copper-tin alloy layer coated with at least one silane binding agent to provide adhesion between a copper surface and a resin layer after lamination. This method leads to an enhanced adhesive strength, improved mechanical and thermal stress resistance as well as humidity resistance of multilayer printed circuit boards and IC substrates.

摘要翻译： 本发明涉及制造多层印刷电路板和由此形成的制品，特别是IC衬底的方法。 该方法利用涂覆有至少一种硅烷粘合剂的铜 - 锡合金层以在层压之后提供铜表面与树脂层之间的粘合。 该方法导致粘合强度提高，多层印刷电路板和IC基板的机械和热应力耐受性以及耐湿性提高。

公开(公告)号：EP2581470A1

公开(公告)日：2013-04-17

申请号：EP11184919.6

申请日：2011-10-12

申请人： Atotech Deutschland GmbH

发明人： Hirsekorn, Isabel-Roda ,  Wegricht, Jens ,  Kilian, Dr. Arnd

IPC分类号： C23C18/44

CPC分类号： C23C18/44 ,  C23C18/1637

摘要： The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and an organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.

摘要翻译： 本发明涉及用于无电沉积钯和/或钯合金的水性镀浴组合物以及使用这种水性镀浴组合物的方法。 含水电镀液包含钯离子源，还原剂，不含磷的氮化络合剂和包含1至5个膦酸酯残基的有机稳定剂。 如果含水电镀浴包含铜离子，则含水电镀浴和方法特别有用。

公开(公告)号：EP2576867A1

公开(公告)日：2013-04-10

申请号：EP11723436.9

申请日：2011-05-31

申请人： Atotech Deutschland GmbH

发明人： MURANUSHI, Yoshihisa ,  MATSUMOTO, Hideki ,  INUZUKA, Masahiro

IPC分类号： C23F1/18

CPC分类号： H05K3/22 ,  C23F1/18 ,  C25D3/38 ,  C25D5/48 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/32134 ,  H01L21/7684 ,  H05K3/067 ,  H05K3/107 ,  H05K3/18

摘要： The present invention is concerned with improved means for etching circuit structures on printed circuit board or wafer substrates of copper or copper alloys in a manner effectively removing unwanted copper from such circuit structures leaving behind a smooth copper surface applying an etching solution containing an Fe(ll) / Fe(lll) redox system and sulfur containing organic additives. It is an advantage of the present invention that the solution can also applied for plating of copper prior to etching.

公开(公告)号：EP2244542B1

公开(公告)日：2013-03-27

申请号：EP09158711.3

申请日：2009-04-24

申请人： Atotech Deutschland GmbH

发明人： Sparing, Christian ,  Huelsmann, Thomas ,  Brooks, Patrick ,  Clicque, Arno

IPC分类号： H05K3/38 ,  H05K3/46

CPC分类号： H05K3/389 ,  H05K3/385 ,  H05K2201/2063 ,  H05K2203/0315

公开(公告)号：EP2449149B1

公开(公告)日：2012-12-19

申请号：EP10728680.9

申请日：2010-07-05

申请人： Atotech Deutschland GmbH

发明人： HOFMANN, Udo ,  DONSBACH, Hermann ,  UNGER, Jörg ,  KRENZEL, Volker

IPC分类号： C23C22/17 ,  C23C22/83 ,  C23C18/12

CPC分类号： C23C22/17 ,  C23C22/83 ,  C23C2222/10

公开(公告)号：EP2506690A1

公开(公告)日：2012-10-03

申请号：EP11160014.4

申请日：2011-03-28

申请人： Atotech Deutschland GmbH

发明人： Matejat, Kai-Jens ,  Lamprecht, Sven ,  Ewert, Ingo

IPC分类号： H05K3/24 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K3/3473 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/11424 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0341 ,  H05K2203/054 ,  H05K2203/0577 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

摘要： Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate (102) including a permanent resin layer (103) on top of at least one contact area (101) and a temporary resin layer (104) on top of the permanent resin layer, ii) contact the entire substrate area including the at least one contact area with a solution suitable to provide a conductive layer (106) on the substrate surface and iii) electroplate a metal or metal alloy layer (107) onto the conductive layer.

摘要翻译： 描述了在基板上形成金属或金属合金层的方法，包括以下步骤：i）在至少一个接触区域（101）的顶部和临时树脂（101）之上提供包括永久性树脂层（103）的基板（102） 层（104），ii）使包括至少一个接触区域的整个基板区域与适于在基板表面上提供导电层（106）的溶液接触，以及iii）电镀金属或金属 合金层（107）到导电层上。