Abstract:
The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.
Abstract:
A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.
Abstract:
An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes; at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.
Abstract:
Flexible, fabric-encapsulated light arrays particularly suitable for use in clothing are disclosed. The light arrays are light-emitting diode (LED) arrays disposed on flexible printed circuit boards (PCBs). The flexible PCBs include substantially sinusoidal metal contact traces, along which the LEDs are attached at an angle preselected to minimize stresses in the expected directions of bending. The PCBs may also include enlarged metal contact pads and a coverlay arrangement to prevent delamination. The light arrays are contained within pockets that may be made of conductive fabric in order to form a Faraday cage. Systems and methods are also disclosed that use local and wide-area controllers to send words, images, and video to the light arrays substantially in real time.
Abstract:
There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.
Abstract:
An apparatus and method wherein the apparatus includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.
Abstract:
Die Erfindung betrifft einen elektrischen Verbinder mit einer Trägerfolie (2), auf der zumindest eine nicht verzweigte elektrische Leiterbahn (3) angeordnet ist. Dabei ist vorgesehen, dass die Leiterbahn (3) zwischen ihren Endabschnitten (4, 6) zumindest einen U- oder V-förmigen Abschnitt (5) aufweist, wobei zwischen den sich gegenüberliegenden Schenkeln (7, 8) des Abschnittes (5) ein erster Einschnitt (11) in die Trägerfolie (2) eingebracht ist.
Abstract:
A hearing aid is provided comprising a microphone, a signal processor for processing an incoming audio signal to compensate a hearing loss of a user of the hearing aid, a speaker that is connected to an output of the signal processor to provide a sound signal to a user, a transceiver connected to the signal processor for wireless data communication interconnected with an antenna for emission and reception of an electromagnetic field, an electrical circuitry comprising at least one of the signal processor, the transceiver, interconnecting transmission lines, antenna structures and/or further electrical components, the electrical circuitry extending over an area of a support substrate. The hearing aid further comprises a resonant element being provided within the near field of the electrical circuitry to terminate and dissipate unwanted electromagnetic radiation from at least a part of the area. The resonant element implements a notch filter filtering the unwanted electromagnetic radiation and may be positioned outside any signal paths of the electrical circuitry.