公开(公告)号：EP1156708A3

公开(公告)日：2003-10-29

申请号：EP01111146.5

申请日：2001-05-10

Applicant: Harting Elektro-optische Bauteile GmbH & Co. KG.

Inventor： Kragl, Hans, Dr. ,  Hohmann, Rolf

IPC: H05K3/10 ,  H05K3/04 ,  H05K3/46 ,  H05K1/02

CPC classification number: G02B6/43 ,  G02B6/42 ,  H01L23/13 ,  H01L23/5385 ,  H01L2224/48091 ,  H05K1/0272 ,  H05K1/0274 ,  H05K3/045 ,  H05K3/107 ,  H05K3/4614 ,  H05K3/4638 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/167 ,  H01L2924/00014

Abstract: Es wird eine Leiterplatte (5) beschrieben, die aus mindestens zwei in Abformtechnik hergestellten Leiterplatten-Einzellagen (10) aus Kunststoff besteht, die jeweils eine erste und eine zweite Funktionsseite aufweisen sowie mindestens eine mikrostrukturierte Positioniergestaltung (16) auf der ersten und auf der zweiten Funktionsseite und mindestens einen mikrostrukturierten, mit einer Metallisierung (18) versehenen Leitergraben (12) auf einer der Funktionsseiten. Auf diese Weise ist mit geringem Aufwand die Herstellung von Leiterplatten mit hoher Packungsdichte möglich.

公开(公告)号：EP1129511B1

公开(公告)日：2003-03-19

申请号：EP99960853.2

申请日：1999-11-02

Applicant: Tyco Electronics Logistics AG

Inventor： LEEMAN, Reginald ,  HOUTTEMAN, Bernard ,  EMBO, Georges ,  ACKE, Edgard

IPC: H01R13/646 ,  H01R12/16 ,  H05K3/34

CPC classification number: H01R24/50 ,  H01R9/0515 ,  H01R12/707 ,  H01R24/38 ,  H01R2103/00 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: The invention relates to an electric component for printed boards, especially an HF coaxial connector. According to the invention, the housing (1) of the component is fixed on the printed board (7) by way of solder joints between the SMD soldered connections provided on the bottom part (6) of said housing and respective soldered connections on the printed circuit. Said housing (1) has several solderable bolts (11) on its bottom part (6) for additionally fixing the housing to the printed circuit board (7). Said bolts engage with the continuous contacting bolt holes (12) assigned to them on the circuit board (7) and are soldered in said bolts.

公开(公告)号：EP1284501A1

公开(公告)日：2003-02-19

申请号：EP02016354.9

申请日：1996-11-07

Applicant: FUJITSU LIMITED

Inventor： Yoneda, Yoshiyuki, Fujitsu Limited ,  Tsuji, Kazuto, Fujitsu Limited ,  Orimo, Seiichi, Fujitsu Limited ,  Sakoda, Hideharu, Fujitsu Limited ,  Nomoto, Ryuji, Fujitsu Limited ,  Onodera, Masanori, Fujitsu Limited ,  Kasai, Junichi, Fujitsu Limited

IPC: H01L23/31 ,  H01L21/68

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device includes a chip (111), and a resin package (112, 151, 314) sealing the chip, the resin package having resin projections (117, 154, 318) located on a mount-side surface of the resin package. Metallic films (113, 155, 315) are respectively provided to the resin projections. Connecting parts (118, 101, 163, 245, 313, 341, 342) electrically connect electrode pads of the chip and the metallic films.

Abstract translation: 一种器件包括芯片（111）和密封芯片的树脂封装（112,151,314），树脂封装具有位于树脂封装的安装侧表面上的树脂突起（117,154,318）。 金属膜（113,155,315）分别设置在树脂突起上。 连接部件（118,101,163,245,313,341,342）电连接芯片的电极焊盘和金属膜。

公开(公告)号：EP1187259A3

公开(公告)日：2002-06-12

申请号：EP01307481.0

申请日：2001-09-03

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Yuasa, Eriko ,  Kato, Shinshu

IPC: H01R9/24 ,  B60R16/02

CPC classification number: H05K1/0256 ,  H01H2085/208 ,  H01R9/2458 ,  H01R2201/26 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  Y10S439/949

Abstract: An electrical connection box for use in a vehicle has bus bars (10, 11) in a casing with upstanding connection tabs (10a, 11a) which are alongside and spaced from each other. Insulation resin embeds the tabs while leaving exposed projecting portions. A connector (20) attached to the casing has a housing (21) containing terminals (7, 8) respectively engaged with the projecting portions of the tabs. The resin material provides a recess (15) located between the tabs (10a, 11a) and the housing of said connector (20) has a partition wall (22) of insulating material which lies between the terminals (7, 8) and extends into the recess (15), to prevent leak current between the terminals.

公开(公告)号：EP1186031A1

公开(公告)日：2002-03-13

申请号：EP00938553.5

申请日：2000-05-11

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： VAN PUYMBROECK, Jozef

IPC: H01L23/13 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L23/13 ,  B29L2031/3493 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K2201/09045 ,  H05K2201/09845 ,  Y02P70/613 ,  H01L2924/00

Abstract: A substrate (S) with at least two metallized polymer bumps (PS), especially a polymer stud grid array, is configured in such a way that the polymer bumps (PS) have at least one step (ST) and at least one elevation (E). The geometry of the solder bumps (PS) ensures that the soldered connections to the wiring (V) are secure and guarantees reproducible layer thickness for the solder (L).

公开(公告)号：EP1075782A1

公开(公告)日：2001-02-14

申请号：EP99947066.9

申请日：1999-04-27

Applicant: Telefonaktiebolaget L M Ericsson (Publ)

Inventor： HOLMBERG, Per ,  ERIKSSON, Lars

IPC: H05K9/00 ,  G12B17/02

CPC classification number: H05K9/0092 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/12 ,  H05K3/1275 ,  H05K2201/09018 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2203/0534

Abstract: The invention relates to an electrically conductive unit (1) extending by means of electrically conductive paths (10, 29), which are directly or indirectly applied onto a case (2), for creating a screening against electromagnetic radiation and/or for the draining of electrical currents.

公开(公告)号：EP1034091A1

公开(公告)日：2000-09-13

申请号：EP98936818.8

申请日：1998-07-02

Applicant: Lear Automotive Dearborn, Inc.

Inventor： MAUE, H., Winston ,  REICH, Ronald, K. ,  MORGAN, Robert, G. ,  RODDY, Timothy, S.

IPC: B60R16/02

CPC classification number: B60R16/0215 ,  B60R16/0207 ,  B60R16/0238 ,  B60R16/0239 ,  H01H2011/0081 ,  H01H2011/065 ,  H01H2300/01 ,  H01R9/2466 ,  H01R12/59 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/182 ,  H05K2201/0187 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10053

Abstract: The preferred embodiment apparatus employs an interior trim panel (23) and an electrical harness (25) for use in an automative vehicle. In one aspect of the present invention, the interior trim panel has a generally rigid substrate (27) covered by an aesthetically pleasing covering material (29). In another aspect of the present invention, an electrical harness (25) is provided with integrally created switch contacts (71; 73; 91; 101) and integrally created connector terminals (271). The invention includes an electrical harness (25) made by injection molding a catalytic platable polymeric resin (41) in a first injection mold. Next, a second shot of a non-catalytic polymeric resin (43) is injection molded over portions of the catalytic platable polymeric resin (41) in a second mold. The surfaces of catalytic platable polymeric resin (41) which remain exposed after overmolding of non-catalytic polymeric resin (43) define multiple circuits (45). An adhesion promoter is applied to these exposed circuit areas and then these exposed surfaces are plated with an electroless copper which is attracted to the catalyst in catalytic platable resin (41). The polymeric resins are preferably selected from those having a relatively high heat deflection temperature. The non-catalytic polymeric resin (43) acts as an insulator while the raised and plated portions of catalytic platable polymeric resin (41) act as electricity carrying, conductive circuits or traces (45).

公开(公告)号：EP0782765B1

公开(公告)日：2000-06-28

申请号：EP95934106.6

申请日：1995-09-22

Applicant: SIEMENS N.V. ,  INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW

Inventor： HEERMAN, Marcel ,  WILLE, Joost ,  VAN PUYMBROECK, Jozef ,  ROGGEN, Jean ,  BEYNE, Eric ,  VAN HOOF, Rita

IPC: H01L23/13 ,  H01L23/498

CPC classification number: H01L24/81 ,  B29L2031/3493 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/027 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H01L2224/45099 ,  H01L2924/00

Abstract: The new structure comprises: an injection moulded three-dimensional substrate (S) made from an electrically insulating polymer; two-dimensionally configured polymer bumps (PS) formed during the injection-moulding process on the underside of the substrate (S); external connections (AA) formed on the polymer bumps (PS) by solderable end surfaces; conducting paths (LZ) at least on the underside of the substrate (S) to connect the external connections (AA) to inner connections (IA1); and at least one chip (C1) mounted on the substrate (S) with connections (CA1) which are electro-conductively linked to the inner connections. The novel structure, which is suitable for single-, few- or multi-chip modules, combines the advantages of a Ball Grid Array with those of MID (Moulded Interconnection Devices) technology, and the manufacture and metallization of the polymer bumps (PS) can be done within the framework of the process steps needed for MID technology and at minimal additional cost.

Abstract translation: 聚合物螺柱网格阵列具有电绝缘聚合物的三维基底（S），平坦表面设有聚合物柱（PS），每个具有外部末端（AA）。 电导体路径将外部端子耦合到连接到安装在基板上的半导体芯片（C1）的端子的内部端子（IA1）。 县。 聚合物螺柱的模制和金属化是使用模制互连装置技术实现的，而不需要额外的步骤。

公开(公告)号：EP1005703A1

公开(公告)日：2000-06-07

申请号：EP98951303.1

申请日：1998-08-18

Applicant: Siemens S.A.

Inventor： HEERMAN, Marcel ,  VAN PUYMBROECK, Jozef

IPC: H01L21/48 ,  H01L23/13

CPC classification number: H05K3/403 ,  B29L2031/3493 ,  H01L21/486 ,  H01L23/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K3/027 ,  H05K3/045 ,  H05K3/062 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/09118 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: According to the invention, teeth (Z) are incorporated into a three-dimensional, injection-moulded substrate (S) during the injection moulding process, said teeth being located in the outer edge area and/or in the area of a recess. A metallic coating (M) is then applied to the substrate (S). Extremely finely structured electrically conductive cross connections are produced when said metal coating (M) is removed in the area of the teeth (Z), especially after the teeth (Z) have been ground down or cut off.

Abstract translation: 。根据本发明，齿（Z）被结合到注射模制过程中的三维，注塑成型的基板（S），所述齿位于所述外边缘区域和/或在一个凹部的面积。 然后将金属涂层（M）施加到基板（S）。 极其细微结构化的导电交叉连接产生当所述金属涂层（M）在齿（Z）的区域被移除，爱尤其是齿（Z）之后已被磨掉或切断。

公开(公告)号：EP0742681A3

公开(公告)日：1998-03-04

申请号：EP96480042.9

申请日：1996-04-04

Applicant: International Business Machines Corporation

Inventor： Isaacs, Phillip ,  Swain, Miles

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K7/1452 ,  H05K1/0271 ,  H05K1/0284 ,  H05K3/0058 ,  H05K3/301 ,  H05K2201/09045 ,  H05K2201/10689 ,  H05K2201/2009

Abstract: A circuit card having module strain relief and heat sink support is provided. The circuit card comprises a printed circuit board having a front and a back, a module mounted to the front of the printed circuit board, and a stiffening structure mounted to the back of the printed circuit card directly opposite from the module to provide rigidity to the printed circuit board. The module has a plurality of electrical leads making electrical connection with the printed circuit board and anchoring the module to the printed circuit board. The stiffening structure is coextensive with the plurality of electrical leads along the printed circuit board, and is of sufficient thickness and strength to resist flexure of an area of the printed circuit board in contact with the stiffening structure in response to shock and vibration applied to the module.

Abstract translation: 具有模块应变消除的电路卡包括具有正面和背面的印刷电路板以及在所有侧面上封闭的单个模块。 它具有与印刷电路板电连接并将模块直接锚定到印刷电路板前部的一系列电连接。 加强结构为印刷电路板提供刚性，该印刷电路板安装到印刷电路卡背面的与安装在电路卡前面的模块正对面的部分接触。 加强结构与电连接共同延伸，具有足够的厚度和强度，以抵抗印刷电路板与加强结构接触的部分的弯曲，以响应于施加到模块的冲击和振动。 散热器与模块接触。 间隔装置在第一端处附接到散热器并且在与第一端相对的第二端附接到加强结构，以用于向散热器提供支撑。