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    STRAIN DECOUPLED SENSOR
    15.
    发明公开
    STRAIN DECOUPLED SENSOR 有权
    应变解耦传感器

    公开(公告)号：EP2800721A1

    公开(公告)日：2014-11-12

    申请号：EP13700783.7

    申请日：2013-01-04

    Applicant: Atlantic Inertial Systems Limited

    Inventor： FELL, Christopher Paul

    IPC: B81B7/00 ,  G01C19/5684

    CPC classification number: G01C19/5783 ,  B81B3/0021 ,  B81B7/0048 ,  B81B2201/0242 ,  G01C19/5684

    Abstract: A sensor comprises a substrate 16 and a sensor element 20 anchored to the substrate 16, the substrate 16 and sensor element 20 being of dissimilar materials and having different coefficients of thermal expansion, the sensor element 20 and substrate 16 each having a generally planar face arranged substantially parallel to one another, the sensor further comprising a spacer 26, the spacer 26 being located so as to space at least part of the sensor element 20 from at least part of the substrate 16, wherein the spacer 26 is of considerably smaller area than the area of the smaller of face of the substrate 16 and that of the sensor element 20.

    Abstract translation: 传感器包括基底（16）和固定到基底（16）的传感器元件（20），基底（16）和传感器元件（20）具有不同的材料并且具有不同的热膨胀系数，传感器元件 所述传感器进一步包括间隔物（26），所述间隔物（26）被定位成使得至少部分所述传感器元件（20）与所述基底 ），其中间隔物（26）的面积比基底（16）的表面和传感器元件（20）的表面中的较小表面的面积小得多。

    Multi-axis integrated MEMS inertial sensing device on single packaged chip
    16.
    发明公开
    Multi-axis integrated MEMS inertial sensing device on single packaged chip 审中-公开
    智能手机MEMS-Trägheitsmessungsvorrichtungauf Chip mitEinzelgehäuse

    公开(公告)号：EP2759802A2

    公开(公告)日：2014-07-30

    申请号：EP14152747.3

    申请日：2014-01-27

    Applicant: MCube, Inc.

    Inventor： Lee, Terrence ,  Zhang, Wenhua ,  Sridharamurthy, Sudheer ,  Shingo, Yoneoka

    IPC: G01C19/5783 ,  G01P1/02

    CPC classification number: G01C19/56 ,  B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/5783 ,  G01P1/003 ,  G01P15/02 ,  G01P15/18 ,  G01P2015/0871 ,  G01P2015/088

    Abstract: A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor's temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.

    Abstract translation: 多轴集成MEMS惯性传感器装置。 该设备可以在单个芯片上包含一个集成的3轴陀螺仪和3轴加速度计，创建一个6轴惯性传感器设备。 通过将加速度计装置添加到陀螺仪装置的中心，该结构在空间上有效地利用了芯片的设计区域。 设计架构可以是几何形状的矩形或方形形状，这样可以利用整个芯片区域，并在一定的区域内最大化传感器尺寸。 MEMS集中在封装中，这有利于传感器的温度性能。 此外，集成多轴惯性传感器装置的电接合焊盘可以配置在矩形芯片布局的四个角中。 该配置保证了设计的对称性和芯片面积的有效利用。

    Arrangement of several MEMS sensors
    18.
    发明公开
    Arrangement of several MEMS sensors 审中-公开
    布置多个MEMS传感器

    公开(公告)号：EP2258654A3

    公开(公告)日：2013-11-27

    申请号：EP10164187.6

    申请日：2010-05-27

    Applicant: Honeywell International Inc.

    Inventor： Withanawasam, Lakshman

    IPC: B81B7/02

    CPC classification number: B81B7/02 ,  B81B2201/0242 ,  B81B2201/0292

    Abstract: An integrated sensor device is provided. The integrated sensor device comprises a first substrate (210) including a surface portion and a second substrate (240) coupled to the surface portion of the first substrate in a stacked configuration, wherein a cavity (230) is defined between the first substrate and the second substrate. The integrated sensor device also comprises one or more micro-electro-mechanical systems (MEMS) (220) sensors located at least partially in the first substrate, wherein the MEMS sensor communicates with the cavity. The integrated sensor device further comprises one or more additional sensors (250).

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