公开(公告)号：EP2108239A1

公开(公告)日：2009-10-14

申请号：EP07858029.7

申请日：2007-12-21

Applicant: BASF SE

Inventor： LOCHTMAN, Rene ,  KACZUN, Jürgen ,  WAGNER, Norbert ,  PFISTER, Jürgen

IPC: H05K3/04 ,  H05K3/24

CPC classification number: H05K3/207 ,  H05K1/095 ,  H05K3/046 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0528 ,  H05K2203/107

Abstract: The invention relates to a method for producing electrically conductive surfaces on an electrically non-conductive substrate, comprising the following steps: a) transferring a dispersion containing particles suitable for electroless coating and/or electrocoating from a carrier to the substrate by irradiating the carrier with a laser, b) at least partially drying and/or curing the dispersion transferred to the substrate to form a base layer, c) electroless coating and/or electrocoating of the base layer.

公开(公告)号：EP2095434A2

公开(公告)日：2009-09-02

申请号：EP07849429.1

申请日：2007-12-11

Applicant: Koninklijke Philips Electronics N.V.

Inventor： PEETERS, Martinus P. J. ,  MERCIER, Virginie

IPC: H01L33/00 ,  H05K1/02

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/647 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0347 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2224/05599

Abstract: Proposed is a lighting device (100), comprising LEDs (130) mounted on a transparent substrate (110), provided with a transparent electrically conductive layer (120) and a contact pad (140). The contact pad has a second part (142), extending away from a first part (141), for further reducing the current density in the conductive layer (120). This is advantageous for making the lighting device robust to large power dissipation, especially under high current testing conditions. Moreover, as the voltage drop over transparent conductive layer is reduced, the efficiency of the lighting device is increased.

公开(公告)号：EP1923489A3

公开(公告)日：2009-05-27

申请号：EP08152454.8

申请日：1999-09-14

Applicant: Ibiden Co., Ltd.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A multilayer printed circuit board (5010) comprises a core board (5030) and, as constructed on both sides thereof, a buildup wiring layer obtainable by building up an interlayer resin insulating layer (5050, 5150) and a conductor layer (5058, 5158) alternately with said conductor layers (5058, 5158) being interconnected by via holes (5160). The via holes (5060, 5160) are formed immediately over plated-through holes (5036) in the manner of plugging the through holes (5016) in the core board (5030). In a process for manufacturing the multilayer printed circuit board (5010), the through holes (5016) are pierced by laser light to be not larger than 200 µm in diameter.

公开(公告)号：EP0804061B1

公开(公告)日：2009-05-13

申请号：EP96907729.6

申请日：1996-03-29

Applicant: IBIDEN CO, LTD.

Inventor： YASUE, Toshihiko ,  HIRAMATSU, Yasuji ,  YANO, Hideki ,  ISHITANI, Yoshifumi ,  KAWAMURA, Yoichiro ,  MURASE, Hideki ,  SUZUKI, Ayumi ,  KAWADE, Masato

IPC: H05K3/46

CPC classification number: H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

Abstract: A multilayered printed wiring board having a smooth surface, which can be improved in resolution, interlayer insulating property, or thermal shock resistance without lowering its peel strength even if its insulating resin layer is thin. In the printed wiring board in which the conductor circuits of upper and lower layers are electrically insulated from each other by means of the insulating resin layer, the insulating layer is constituted of a composite layer composed of a lower layer made of a heat-resistant resin which is hardly soluble in an acid or oxidizing agent and an upper layer made of a bonding agent for electroless plating composed of a heat-resistant resin and, as necessary, a recessed section formed between conductor circuits of the lower layer is filled with a resin to the level corresponding to the surfaces of the conductor circuits.

公开(公告)号：EP2033501A1

公开(公告)日：2009-03-11

申请号：EP07765353.3

申请日：2007-06-11

Applicant: BASF SE

Inventor： LOCHTMAN, Rene ,  KACZUN, Jürgen ,  SCHNEIDER, Norbert ,  PFISTER, Jürgen ,  WAGNER, Norbert ,  HENTSCHEL, Dieter

IPC: H05K3/10 ,  H05K3/24

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K2201/0347 ,  H05K2203/025 ,  H05K2203/0257 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/097 ,  H05K2203/107

Abstract: Method for producing electrically conductive, structured or whole-area surfaces on a carrier, in which a first step involves applying a structured or whole-area base layer to the carrier with a dispersion containing electrically conductive particles in a matrix material, a second step involves at least partly curing or drying the matrix material, a third step involves uncovering the electrically conductive particles by at least partly breaking up the matrix, and a fourth step involves forming a metal layer on the structured or whole-area base layer by means of electroless or electrolytic coating.

公开(公告)号：EP2015624A2

公开(公告)日：2009-01-14

申请号：EP08018753.7

申请日：1998-10-12

Applicant: Ibiden Co., Ltd.

Inventor： Asai, Motoo ,  Shimada, Kenichi ,  Noda, Kouta ,  Kariya, Takashi Ibiden Co., Ltd. ,  Segawa, Hiroshi Ibiden Co., Ltd.

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/38

CPC classification number: B32B3/00 ,  H05K3/0094 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer.
Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.

Abstract translation: 多层印刷线路板由设置有通孔的基板和通过插入层间绝缘树脂层而形成在基板上的布线板，该通孔具有粗糙的内表面并填充有填料， 通孔中的填充物的暴露部分被覆盖有通孔覆盖导体层，并且形成在其上方的通孔连接到通孔覆盖导体层。 在通孔和填料之间不剥离，该布线板在通孔和内层电路之间具有令人满意的连接可靠性，并提供高密度布线。

公开(公告)号：EP1949772A1

公开(公告)日：2008-07-30

申请号：EP06799516.7

申请日：2006-10-18

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

Inventor： HACKERT, Jürgen ,  TRANTER, Paul ,  MAAS, Joost, Hubert

IPC: H05K3/12

CPC classification number: H05K3/24 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/182 ,  H05K3/246 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/0709 ,  H05K2203/0723

Abstract: The invention provides method for preparing a conductive device comprising the steps of: (a) providing a non-conductive substrate layer; (b) modifying the surface of the non-conductive substrate layer by means of a laser beam treatment; (c) applying a pattern of an ink on a surface of the substrate layer, which ink comprises a first metal; (d) depositing a second metal on the ink pattern obtained in step (c); and (e) applying a third metal on the second metal by means of electrodeposition. The invention further provides a conductive device obtainable by said method.

公开(公告)号：EP1926784A2

公开(公告)日：2008-06-04

申请号：EP06793112.1

申请日：2006-08-31

Applicant: BASF SE

Inventor： SCHNEIDER, Norbert ,  LIPPERT, Gerald ,  LOCHTMAN, Rene ,  MAAS, Heiko ,  PFISTER, Jürgen ,  SOBOTKA, Bettina ,  WAGNER, Norbert

IPC: C09D5/24

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate containing an organic binder component, a metal component with different metals and/or metal particle shapes, and a solvent component. The invention further relates to methods for producing said dispersion, methods for creating an optionally structured metal layer with the aid of the dispersion, the obtained substrate surfaces, and the use thereof.

公开(公告)号：EP1923488A2

公开(公告)日：2008-05-21

申请号：EP08152453.0

申请日：1999-09-14

Applicant: Ibiden Co., Ltd.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: C25D5/18

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A process for manufacturing a multilayer printed circuit board comprises a step for providing openings in an interlayer insulating layer (4002), and a step for filling up the openings with a plating metal to construct via holes (4007) and, at the same time, build up an upper-layer conductor layer (4005). The electroplating is performed using an aqueous solution containing a metal ion and 0.1 to 1.5 mmol/L of at least one additive selected from the group consisting of thioureas, cyanides and polyalkylene oxides as a plating solution.

Abstract translation: 一种制造多层印刷电路板的方法包括在层间绝缘层（4002）中提供开口的步骤，以及用电镀金属填充开口以构造通孔（4007）的步骤，同时， 建立上层导体层（4005）。 使用含有金属离子的水溶液和0.1〜1.5mmol / L的选自硫脲，氰化物和聚环氧烷作为电镀液的至少一种添加剂进行电镀。

公开(公告)号：EP1845762A1

公开(公告)日：2007-10-17

申请号：EP06712598.9

申请日：2006-01-30

Applicant: IBIDEN CO., LTD.

Inventor： WU, Youhong

IPC: H05K3/46

CPC classification number: H05K1/115 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: [Problems] To provide a multi-layer printed wiring board without decrease in connection reliability by forming a filled via right above a filled via of a small radius.
[Means of Solving the Problems] During a heat cycle, the stress applied to a filled via 60 formed on cover plated layers 36a and 36d is larger than the stress applied to a filled via 160 formed on the second interlayer resin insulation layer 150. Therefore, the bottom diameter d 1 of the filled via 60 is made larger than the bottom diameter d2 of the filled via 160 formed right above the filled via 60.

Abstract translation: 通过在小半径的填充通路的正上方形成填充通路，可以提供不降低连接可靠性的多层印刷布线板。 [解决问题的手段]在热循环期间，施加到形成在盖镀层36a和36d上的填充通孔60的应力大于施加到形成在第二层间树脂绝缘层150上的填充通孔160的应力。因此 ，填充通孔60的底部直径d 1大于填充通孔60正上方形成的填充通孔160的底部直径d 2。