公开(公告)号：EP2742784B1

公开(公告)日：2014-12-03

申请号：EP12778423.9

申请日：2012-08-30

Applicant: Koninklijke Philips N.V.

Inventor： DINGEMANS, Antonius Petrus Marinus

IPC: H05K3/20 ,  H05K1/02 ,  H05K3/00 ,  H01L25/075 ,  F21S4/00 ,  F21K99/00

CPC classification number: H05K3/303 ,  F21K9/90 ,  F21V21/002 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0283 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/202 ,  H05K13/046 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49144 ,  H01L2924/00

Abstract: There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

Abstract translation: 提供了一种用于制造部件互连板（150）的方法，所述部件互连板（150）包括当安装在部件板上时向至少一个部件（114）提供电路的导体结构，所述方法包括：提供具有第一 提供具有用于限定所述部件板的焊接区域（125）的第二预定图案的阻焊片（112），通过将所述阻焊片层压在所述导体片的顶部上而形成子组件（120） 将焊料施加到所述子组件上，将所述至少一个部件放置在所述子组件上，执行焊接，以及将所述子组件层压到衬底（130）上。 阻焊片还被布置成用作导体片的载体。

公开(公告)号：EP2493032A3

公开(公告)日：2014-03-26

申请号：EP12168804.8

申请日：2007-04-10

Applicant: ADC GmbH

Inventor： Hammond, JR., Bernard ,  Murray, David P. ,  George, Ian R.

IPC: H01R24/64 ,  H01R13/6466

CPC classification number: H01R13/6466 ,  H01R4/2429 ,  H01R13/6477 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a crosstalk compensation arrangement for reducing crosstalk at the jack. The circuit board also includes arrangements that reduce return loss at the jack.

公开(公告)号：EP2642837A1

公开(公告)日：2013-09-25

申请号：EP12160338.5

申请日：2012-03-20

Applicant: Chang, Jacky ,  Wu, Shou-Bao ,  Lu, Chao-Fu ,  Ting, Chien-Chun ,  Ho, Yi-Shueh ,  Lin, Eric ,  Liu, Song-Jhe

Inventor： Chang, Jacky ,  Lin, Eric ,  Liu, Song-Jhe

IPC: H05K3/14

CPC classification number: H05K3/14 ,  B24C3/322 ,  B29C59/00 ,  B29C59/10 ,  B29C59/16 ,  B29C2059/027 ,  H05K1/0284 ,  H05K3/381 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2203/0548 ,  H05K2203/1344

Abstract: A conductive pattern film substrate and manufacturing method for combining two anisotropic materials, namely a patterned body and a film layer, without assistance from an intermediate layer. The method includes producing a thermal spraying source for performing a heating operation on a film material to prepare the film material for thermal spraying or semi-thermal spraying and thereby decompose the film material into film particles; and spraying the film particles to a pattern layer disposed on the body and having the pattern by the thermal spraying source to form the film layer having the film particle on the pattern layer, thereby enabling the body to embody electrical characteristics of the pattern.

Abstract translation: 一种导电图案薄膜基片和用于组合两种各向异性材料（即，图案体和薄膜层）的制造方法，无需中间层的帮助。 该方法包括制备用于对薄膜材料进行加热操作的热喷涂源，以制备用于热喷涂或半热喷涂的薄膜材料，从而将薄膜材料分解成薄膜颗粒; 并将薄膜颗粒喷射到设置在主体上的图案层，并且通过热喷涂源形成图案，以在图案层上形成具有薄膜颗粒的薄膜层，从而使得本体能够体现图案的电特性。

公开(公告)号：EP2513953A4

公开(公告)日：2013-09-18

申请号：EP10842518

申请日：2010-12-15

Applicant: TRUSTEES OF THE UNIVERSITYOF ILLINOIS BOARD OF ,  UNIV PENNSYLVANIA

Inventor： ROGERS JOHN A ,  KIM DAE-HYEONG ,  LITT BRIAN ,  VIVENTI JONATHAN ,  MOSS JOSHUA D ,  CALLANS DAVID J

IPC: H01L21/20 ,  A61B5/00 ,  A61B5/05 ,  A61B8/12 ,  A61N1/05 ,  A61N1/36

CPC classification number: A61N1/36 ,  A61B5/0422 ,  A61B5/076 ,  A61B5/6867 ,  A61B2562/02 ,  A61B2562/066 ,  A61B2562/12 ,  A61B2562/164 ,  A61N1/0472 ,  A61N1/05 ,  A61N1/0587 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3192 ,  H01L24/24 ,  H01L24/50 ,  H01L24/82 ,  H01L24/86 ,  H01L27/1218 ,  H01L29/78603 ,  H01L29/7869 ,  H01L2221/6835 ,  H01L2221/68386 ,  H01L2224/24137 ,  H01L2224/793 ,  H01L2224/86203 ,  H01L2224/8685 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0283 ,  H05K1/147 ,  H05K3/323 ,  H05K2201/09263 ,  H01L2924/00

公开(公告)号：EP2519083A1

公开(公告)日：2012-10-31

申请号：EP10839014.7

申请日：2010-07-16

Applicant: Nippon Mektron, Limited

Inventor： KAJIYA Atsushi ,  YOSHIHARA Hidekazu ,  ITANI Toru

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/032 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/22 ,  H05K3/429 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/09263 ,  H05K2203/1105

Abstract: The present invention is to provide a flexible circuit board and a method for production thereof, which are high in connection reliability, and in which the flexible circuit board is formed with a bent portion and can be deformed in a flexible manner, and in which even if deformation is repeated, or if there is heat dissipation from electronic parts, or if fine wiring is formed, exfoliation and breakage of a wiring layer will not occur.
The present invention resides in a flexible circuit board which has: an insulating film 2 made of a thermoplastic resin; a wiring layer 3 formed on said insulating film 2; and an insulating layer 4 made of a thermoplastic resin and formed on said wiring layer 3; and which characterized in that said flexible circuit board 1 is formed in at least one place thereof with a bent portion having a radius of curvature R (mm); and said flexible circuit board 1 is constructed such that it is deformable in a state in which the radius of curvature R (mm) of said bent portion is maintained.

公开(公告)号：EP2513953A1

公开(公告)日：2012-10-24

申请号：EP10842518.2

申请日：2010-12-15

Applicant: The Board Of Trustees Of The UniversityOf Illinois ,  The Trustees Of The University Of Pennsylvania

Inventor： ROGERS, John, A. ,  KIM, Dae-Hyeong ,  LITT, Brian ,  VIVENTI, Jonathan ,  MOSS, Joshua, D. ,  CALLANS, David, J.

IPC: H01L21/20 ,  A61B5/00 ,  A61B5/05 ,  A61B8/12

CPC classification number: A61N1/36 ,  A61B5/0422 ,  A61B5/076 ,  A61B5/6867 ,  A61B2562/02 ,  A61B2562/066 ,  A61B2562/12 ,  A61B2562/164 ,  A61N1/0472 ,  A61N1/05 ,  A61N1/0587 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3192 ,  H01L24/24 ,  H01L24/50 ,  H01L24/82 ,  H01L24/86 ,  H01L27/1218 ,  H01L29/78603 ,  H01L29/7869 ,  H01L2221/6835 ,  H01L2221/68386 ,  H01L2224/24137 ,  H01L2224/793 ,  H01L2224/86203 ,  H01L2224/8685 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0283 ,  H05K1/147 ,  H05K3/323 ,  H05K2201/09263 ,  H01L2924/00

Abstract: Provided herein are biomedical devices and methods of making and using biomedical devices for sensing and actuation applications. For example, flexible and/or stretchable biomedical devices are provided including electronic devices useful for establishing in situ conformal contact with a tissue in a biological environment. The invention includes implantable electronic devices and devices administered to the surfaces(s) of a target tissue, for example, for obtaining electrophysiology data from a tissue such as cardiac, brain tissue or skin.

公开(公告)号：EP2493273A1

公开(公告)日：2012-08-29

申请号：EP10824714.9

申请日：2010-08-04

Applicant: Fujikura, Ltd.

Inventor： YAMAMOTO Satoshi ,  HIRANO Hiroyuki ,  SUZUKI Takanao

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01L21/486 ,  H01L23/3107 ,  H01L23/49827 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/09701 ,  H01L2924/1461 ,  H05K1/113 ,  H05K3/101 ,  H05K2201/09263 ,  H05K2201/09836 ,  H05K2201/10545 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. Each of the through-hole interconnections includes a first conductive portion, provided at a position corresponding to the electrode of the first device, on the first main surface, and a second conductive portion, provided at a position corresponding to the electrode of the second device, on the second main surface, each electrode of the first device is electrically connected to the first conductive portion, each of the electrodes of the second device is electrically connected to the second conductive portion, and each of the through-hole interconnections includes a linear portion vertically extending from at least one of the first main surface and the second main surface.

Abstract translation: 本发明提供一种器件封装结构，其特征在于，包括：内插基片，具有基板和形成在从第一主面朝向第二主面的贯穿基板的多个贯通孔内形成的多个通孔布线，所述第一主面 作为基板的一个主表面，第二主表面是其另一个主表面; 第一装置，其包括多个电极，并且被布置成使得这些电极面向第一主表面; 以及第二装置，其包括多个电极，其布置不同于第一装置的每个电极的布置，并且被布置成使得这些电极面对第二主表面。 每个通孔互连包括在第一主表面上设置在与第一装置的电极相对应的位置处的第一导电部分和设置在与第二装置的电极对应的位置处的第二导电部分 在第二主表面上，第一器件的每个电极电连接到第一导电部分，第二器件的每个电极电连接到第二导电部分，并且每个通孔互连件包括线性 部分从第一主表面和第二主表面中的至少一个垂直延伸。

公开(公告)号：EP1901593B1

公开(公告)日：2012-03-07

申请号：EP07016073.4

申请日：2007-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Lim, Myong-Bin ,  Lee, Jae-Han ,  Son, Sun-kyu ,  Hwang, In-Yong

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0216 ,  G02F1/13452 ,  H05K1/025 ,  H05K1/189 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10136 ,  H05K2201/10681

公开(公告)号：EP2330528A2

公开(公告)日：2011-06-08

申请号：EP10172139.7

申请日：2010-08-06

Applicant: NCR Corporation

Inventor： McNicoll, Grant ,  Walker, Ian ,  Harrow, Charles

IPC: G06F21/00

CPC classification number: G06F21/86 ,  G06F21/75 ,  G06Q20/4012 ,  H05K1/0275 ,  H05K1/11 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/063

Abstract: A secure circuit board assembly (10) is provided. The secure circuit board assembly (10) comprises: a control board (12) including a cryptographic processor (30); a spacer portion (14) mounted on the control board (12); and a lid (16) mounted on the spacer portion (14). The control board (12), the spacer portion (14), and the lid (16) collectively provide a secure enclosed chamber in which the cryptographic processor (30) is mounted. The spacer portion (14) provides protection against side-on attacks against the cryptographic processor (30).

Abstract translation: 提供可靠的电路板组件（10）。 该安全电路板组件（10）包括：包括密码处理器（30）的控制板（12）; 安装在控制板（12）上的隔离部分（14）; 和安装在隔离部分（14）上的盖子（16）。 控制板（12），隔离部分（14）和盖（16）共同提供安全密封处理器（30）安装在其中的安全封闭室。 间隔部分（14）提供防止对密码处理器（30）的侧面攻击的保护。

公开(公告)号：EP2309521A1

公开(公告)日：2011-04-13

申请号：EP09171375.0

申请日：2009-09-25

Applicant: Arcus Elektrotechnik Alois Schiffmann GmbH

Inventor： Wild, Manuel ,  Lasinger, Fritz

IPC: H01C1/16 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01C1/16 ,  H05K1/0286 ,  H05K1/141 ,  H05K1/142 ,  H05K1/167 ,  H05K3/0052 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09263 ,  H05K2201/09963 ,  H05K2201/10303 ,  H05K2201/10363

Abstract: Es wird eine Widerstandsbaugruppe angegeben, die insbesondere für Mittelspannungs- und Hochspannungsanwendungen geeignet ist. Die Baugruppe weist einen isolierenden, langgestreckten Träger (10) mit zwei gegenüberliegenden Hauptflächen (11, 12) auf. Auf der einen Hauptfläche (11) ist eine erste Widerstandsanordnung (20) vorgesehen, während eine zweite Widerstandsanordnung (30) auf der anderen Hauptfläche (12) vorgesehen ist, die sich beide über die Länge des Trägers (10) erstrecken. Der Träger (10) besitzt eine Vielzahl von integrierten, abtrennbaren Modulen (14), die jeweils miteinander verbunden sind und miteinander verbundene Teile der beiden Widerstandsanordnungen (20) und (30) tragen. An den jeweiligen Enden der Module (14) sind Verbindungsanschlüsse (A - D) für die erste und die zweite Widerstandsanordnung (20, 30) vorgesehen.

Abstract translation: 电阻组件（100）具有隔离和细长的载体（10），其具有两个相对的相对的面。 电阻装置（20）设置在载体的一个表面上，主面在载体的长度上延伸。 载体具有多个集成和分离的模块（14）。