公开(公告)号：EP1956876A4

公开(公告)日：2011-05-11

申请号：EP06832552

申请日：2006-11-13

Applicant: MURATA MANUFACTURING CO

Inventor： MEGURO TORU ,  WADA RYUICHIRO ,  SAITO YOSHIFUMI

IPC: H05K3/28 ,  H01L23/14 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/28 ,  H01L21/4807 ,  H01L21/481 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/243 ,  H05K2201/0195 ,  H05K2201/099 ,  Y10T428/24917 ,  Y10T428/24926

公开(公告)号：EP1887845A4

公开(公告)日：2010-08-11

申请号：EP06780769

申请日：2006-06-28

Applicant: IBIDEN CO LTD

Inventor： KAWAMURA YOICHIRO ,  SAWA SHIGEKI ,  TANNO KATSUHIKO ,  TANAKA HIRONORI ,  FUJII NAOAKI

IPC: H05K3/34 ,  H01L21/48 ,  H01L23/498

CPC classification number: H05K3/3478 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

公开(公告)号：EP1761115A3

公开(公告)日：2009-02-18

申请号：EP06018262.3

申请日：2006-08-31

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Arai, Koji Shinko Electric Industries Co. Ltd. ,  Kikuchi, Tomofumi Shinko Electric Ind. Co. Ltd ,  Maruyama, Atsushi Shinko Electric Ind. Co. Ltd. ,  Wakabayashi, Hideyuki Shinko Electric Ind. Co. Ltd

IPC: H05K1/11

CPC classification number: H05K3/243 ,  H01L2224/13 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0191 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/0571 ,  H05K2203/1476

Abstract: The invention is characterized in a printed wiring board (50) having a wiring pattern (14) including a pad (20) for mounting a solder ball (26) as a connection terminal, wherein
the pad (20) is constituted by laminating a conductive layer constituting the wiring pattern (14A), a lower layer plating layer (16), and an upper layer plating layer (18) in this order;
an immediate vicinity region (34) surrounding the pad (20) is constituted by laminating the conductive layer (14B), at least the lower layer plating layer in the lower layer plating layer and the higher layer plating layer (16), and a solder resist layer (22) in the order;
a thickness of the upper layer plating layer is a thickness negligible in comparison with respective thicknesses of the lower layer plating layer and the upper layer plating layer; and
a height of an upper face of the pad (20) does not exceed a height of an upper face of the immediate vicinity region (34).

公开(公告)号：EP1729337A3

公开(公告)日：2008-09-10

申请号：EP06252847.6

申请日：2006-06-01

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Otsuka, Takashi

IPC: H01L21/70 ,  H01L23/28 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K3/284 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/1316 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49171 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic device includes a substrate (23) on which foot patterns (24A,24B) and a solder resist (25) are provided such that the foot patterns (24A,24B) are exposed from opening portions (27A,27B) in the solder resist (25), packaging parts (20A,20B) mounted on the substrate (23) by solder (26), and a sealing resin (29) formed on the substrate (23) to seal the packaging parts (20A,20B), wherein a part (running-on portions 26A,26B) of the solder (26) is constructed to run on an upper surface of the solder resist (25) under the packaging parts (20A,20B).

公开(公告)号：EP1814370A1

公开(公告)日：2007-08-01

申请号：EP05811438.0

申请日：2005-12-02

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： WATANABE, Masaki, Matsushita Eletric Industrial Co., Ltd.

IPC: H05K3/34 ,  H01L21/60 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/3452 ,  H01L2224/16225 ,  H05K1/114 ,  H05K3/0005 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/0588 ,  Y10T29/49144

Abstract: The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board (1), soldering lands (2a), (2b), (2c), and (2d) for connecting solder balls are disposed in lattice. Central point (B) of through-hole (3) is set eccentric to the side of soldering land (2a) at the same potential as through-hole (3), remote from intersection (A) formed by diagonal line (200ab) linking soldering lands (2a) and (2b) and diagonal line (200cd) linking soldering lands (2c) and (2d).

Abstract translation: 本发明通过使用通孔常规尺寸提供了一种能够安装BGA或窄终端间隔的其它IC封装的印刷电路板。 在印刷电路板（1），焊料焊接区（2A），（2B），（2c）和（2d）的用于连接的焊料球的一个主表面被布置在晶格内。 中心点的贯通孔（3）被设定偏心焊国家（2a）的侧面处于相同的电位为通孔（3）中，远离交点（A）而形成由对角线（200AB）的（B）的连接 焊料焊接区（2a）和（2b）和对角线（200CD）连接的焊料焊接区（2c）和（2d）的。

公开(公告)号：EP1740029A1

公开(公告)日：2007-01-03

申请号：EP06012641.4

申请日：2006-06-20

Applicant: OMRON CORPORATION

Inventor： Higasa, Koichi, c/o Omron Corporation ,  Sumimoto, Yoshiyuki, c/o Omron Corporation ,  Yoshioka, Daisuke, c/o Omron Corporation

IPC: H05K3/34

CPC classification number: H05K3/3452 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A circuit substrate (1) on which bubbles generated between a pad electrode (22) and a land (11A) can be eliminated is disclosed. Resists (13A,13B) are provided at any one of ends of a land (11A) on a circuit substrate. Solder paste (12A) is printed on the land (11A), and an electronic component (2) (MOSFET or the like) is placed and heated on the same. When the solder paste is melted, an electrode (22) of the electronic component comes into contact with the resists (13) on the circuit substrate. A gap is created by the resists between the land and the electrode of the electronic component. Since the melted solder paste does not wet the resists, bubbles generated in the solder escape to the end of the land through the gap.

Abstract translation: 公开了可以消除在焊盘电极（22）和焊盘（11A）之间产生的气泡的电路基板（1）。 抗蚀剂（13A，13B）设置在电路基板上的焊盘（11A）的任一端。 将焊膏（12A）印刷在焊盘（11A）上，并且将电子部件（2）（MOSFET等）放置并加热。 当焊膏熔化时，电子部件的电极（22）与电路基板上的抗蚀剂（13）接触。 由电子部件的焊盘和电极之间的抗蚀剂产生间隙。 由于熔融的焊膏不会使抗蚀剂湿润，所以在焊料中产生的气泡通过间隙逸出到焊盘的端部。

公开(公告)号：EP1708551A1

公开(公告)日：2006-10-04

申请号：EP05256980.3

申请日：2005-11-11

Applicant: Mitsumi Electric Co., Ltd.

Inventor： Otani, Koji, c/o Mitsumi Electric Co., Ltd.

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: A land part (152) where a connection part (132) of an electronic part is soldered, includes a head end part (161). The head end part includes an inclination part (162). The inclination part may be formed by an end side. The end side may make a designated angle from an end line of the connection part of the electronic part.

Abstract translation: 焊接电子部件的连接部（132）的陆部（152）包括头端部（161）。 头端部包括倾斜部（162）。 倾斜部分可以由端部侧面形成。 端部可以从电子部件的连接部分的端部线形成指定角度。

公开(公告)号：EP0996322B1

公开(公告)日：2005-12-28

申请号：EP99308015.9

申请日：1999-10-12

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Harada, Hiroshi ,  Terashima, Kiminori

IPC: H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3452 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10984 ,  H05K2203/042 ,  Y02P70/613

公开(公告)号：EP1135011A3

公开(公告)日：2003-05-14

申请号：EP01400690.2

申请日：2001-03-15

Applicant: SONY CORPORATION

Inventor： Kazuhiro, Itou

IPC: H05K3/34

CPC classification number: H05K3/3452 ,  H05K3/3447 ,  H05K2201/099

Abstract: The invention provides a printed-wiring board (10) that is capable of preventing the lift-off phenomenon without changing the related process for fabricating related printed-wiring boards. A printed-wiring board (10) of the present invention has the structure in which land portions (3a, 3b) are formed on both sides (front side and back side) of a board (2), a through hole (4) is formed through the board (2), and an electrically conducting layer (5) is formed on the inside peripheral surface of the through hole (4) by means of plating to connect between the above-mentioned land portions (3a, 3b) of a wiring pattern, wherein the entire surface of the land part (3a) including the opening circumference of the through hole (4) is covered with an insulating layer (6a) that covers the other part of the wiring pattern on the component side and on the other hand the land part (3b) is not covered with an insulating layer (6) and remains exposed on the soldering side.

公开(公告)号：EP1135011A2

公开(公告)日：2001-09-19

申请号：EP01400690.2

申请日：2001-03-15

Applicant: SONY CORPORATION

Inventor： Kazuhiro, Itou

IPC: H05K3/34

CPC classification number: H05K3/3452 ,  H05K3/3447 ,  H05K2201/099

Abstract: The invention provides a printed-wiring board (10) that is capable of preventing the lift-off phenomenon without changing the related process for fabricating related printed-wiring boards. A printed-wiring board (10) of the present invention has the structure in which land portions (3a, 3b) are formed on both sides (front side and back side) of a board (2), a through hole (4) is formed through the board (2), and an electrically conducting layer (5) is formed on the inside peripheral surface of the through hole (4) by means of plating to connect between the above-mentioned land portions (3a, 3b) of a wiring pattern, wherein the entire surface of the land part (3a) including the opening circumference of the through hole (4) is covered with an insulating layer (6a) that covers the other part of the wiring pattern on the component side and on the other hand the land part (3b) is not covered with an insulating layer (6) and remains exposed on the soldering side.

Abstract translation: 本发明提供一种印刷线路板（10），其能够在不改变用于制造相关印刷线路板的相关工艺的情况下防止剥离现象。 本发明的印刷电路板（10）具有在基板（2）的两侧（正面和背面）上形成着陆部（3a，3b），通孔（4）为 （2）形成的导电层（5），并且通过电镀在通孔（4）的内周表面上形成导电层（5），以将上述接地部分（3a，3b） 其中包括所述通孔（4）的开口周边的所述接合部（3a）的整个表面被覆盖所述部件侧上的所述配线图案的所述另一部分和所述 另一方面，焊盘部分（3b）未被绝缘层（6）覆盖并保持暴露在焊接侧。