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    Light and heat resistant circuit board apparatus and method
    11.
    发明公开
    Light and heat resistant circuit board apparatus and method 审中-公开
    Licht- undwärmebeständigeLeiterplattenvorrichtung und Verfahren

    公开(公告)号：EP2490513A2

    公开(公告)日：2012-08-22

    申请号：EP12155780.5

    申请日：2012-02-16

    申请人： Essence Solar Solutions Ltd.

    发明人： Halahmi, Izhar ,  Helfan, Ron ,  Hasin, Slava

    IPC分类号： H05K1/05 ,  H05K1/03 ,  H05K3/38

    CPC分类号： H05K1/053 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/056 ,  H05K3/386 ,  H05K3/388 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2203/0315 ,  Y10T29/49124

    摘要： A light and heat resistant circuit board apparatus LHRPCB, comprising: at least one thermally conductive material (TCM) layer (20) adapted to serve as a mechanical and thermal substrate for the LHRPCB; at least one layer (30) of electrically isolating material (EIM) configurable on respective TCM layers, the at least one EIM layer being resistant to UV radiation; at least one electrically conducting (ECL) layer (35) configurable above the at least one TCM layer and adapted to be patterned and to selectively conduct electrical current; at least one heat and UV radiation resistant bonding (HUVRBL) layer (25) appliable between respective ECL, TCM, and EIM layers; and at least one electronic component (45,51) mountable upon the at least one ECL layer, wherein the LHRPCB is adapted to be exposed to light and heat for an extended period.

    摘要翻译： 一种耐热耐热电路板装置LHRPCB，包括：至少一个适于用作LHRPCB的机械和热衬底的导热材料（TCM）层（20）; 至少一层电绝缘材料（EIM）的层（30），其可配置在相应的TCM层上，所述至少一个EIM层耐UV辐射; 至少一个导电（ECL）层（35），其可配置在所述至少一个TCM层上方并且适于被图案化并选择性地导通电流; 至少一个耐辐射和耐紫外线的结合（HUVRBL）层（25）可应用于相应的ECL，TCM和EIM层之间; 以及至少一个可安装在所述至少一个ECL层上的电子部件（45,51），其中所述LHRPCB适于暴露于光和热持续一段时间。