公开(公告)号：EP2816589A3

公开(公告)日：2015-06-03

申请号：EP14181484.8

申请日：2009-03-19

Applicant: ATI Technologies ULC

Inventor： Topacio, Roden ,  Zbrzezny, Adam

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/562 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2203/043 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.

公开(公告)号：EP2680678A1

公开(公告)日：2014-01-01

申请号：EP11861583.0

申请日：2011-03-29

Applicant: Dowa Metals & Mining Co., Ltd.

Inventor： OSANAI, Hideyo ,  TAKAHASHI, Takayuki ,  IDEGUCHI, Satoru ,  KOTANI, Hirotaka

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/053 ,  B22D19/0081 ,  B22D19/04 ,  H01L21/481 ,  H01L21/4871 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/022 ,  H05K2201/09136 ,  H05K2201/2009 ,  H05K2203/128 ,  Y10T428/12618 ,  Y10T428/2457 ,  Y10T428/2462 ,  Y10T428/24942 ,  H01L2924/00

Abstract: A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

Abstract translation: 金属/陶瓷接合基板包括：陶瓷基板; 直接结合在陶瓷基板的一侧的金属板; 金属基板直接结合到陶瓷基板的另一侧; 所述加强构件具有比所述金属基板高的强度的强化构件，所述加强构件配置成从所述金属基板的两个端面之一延伸到所述另一端面，而不会中断所述金属基板延伸 在金属基板与陶瓷基板的接合面与其相对面之间。

公开(公告)号：EP2019572B1

公开(公告)日：2012-02-01

申请号：EP08013359.8

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu ,  Kawabata, Kenichi

IPC: H05K3/00 ,  H01L23/538

CPC classification number: H05K3/0052 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/09136 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/0169 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49124 ,  H01L2224/82 ,  H01L2924/00

Abstract: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).

公开(公告)号：EP2269216A1

公开(公告)日：2011-01-05

申请号：EP09721759.0

申请日：2009-03-19

Applicant: ATI Technologies ULC

Inventor： TOPACIO, Roden ,  ZBRZEZNY, Adam

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/562 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2203/043 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.

公开(公告)号：EP2066160A2

公开(公告)日：2009-06-03

申请号：EP08168277.5

申请日：2008-11-04

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Taguchi, Yuichi ,  Chino, Teruaki ,  Oi, Kiyoshi

IPC: H05K3/46

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A wiring board (10) adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers (11, 13, 15) are stacked one on top of another with an insulating layer (12, 14) interposed therebetween and are interconnected through via holes (VH1, VH2) formed in the insulating layers, respectively. A plurality of openings (TH) are formed through the structure in a region (R2) where a wiring is not formed, extending through the structure in a thickness direction thereof. Further, solder resist layers (16, 17) are formed on the outermost wiring layers, respectively, and exposing pad portions (11P, 15P) defined in desired locations in the outermost wiring layers.

Abstract translation: 适于安装电子部件的布线板（10）具有这样的结构形式，其中多个布线层（11,13,15）彼此上下堆叠并且隔着绝缘层（12,14） 并通过形成在绝缘层中的通孔（VH1，VH2）分别互连。 在没有形成布线的区域（R2）中穿过该结构形成多个开口（TH），该开口（TH）在其厚度方向上延伸穿过该结构。 此外，分别在最外层的布线层上形成阻焊层（16,17），并且在最外层的布线层中的暴露焊盘部分（11P，15P）被限定在期望的位置上。

公开(公告)号：EP3456160A2

公开(公告)日：2019-03-20

申请号：EP17728449.4

申请日：2017-05-10

Applicant: Linxens Holding

Inventor： MORGENTHALER, Frédéric ,  KALCK, Sébastien

IPC: H05K1/11 ,  H05K3/20 ,  G06K19/077 ,  H01L23/498 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/202 ,  G06K19/07718 ,  G06K19/07743 ,  H01L23/49838 ,  H01L23/49855 ,  H05K1/11 ,  H05K1/117 ,  H05K3/0097 ,  H05K3/32 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/10287 ,  H05K2203/1545

公开(公告)号：EP3358615A1

公开(公告)日：2018-08-08

申请号：EP16850843.0

申请日：2016-07-27

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

Inventor： KATO, Hiromasa ,  KITAMORI, Noboru

IPC: H01L23/13 ,  H01L23/12 ,  H01L23/36 ,  H05K1/02

CPC classification number: C04B35/584 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/88 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49861 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0011 ,  H05K3/0061 ,  H05K2201/09136

Abstract: The present invention provides a silicon nitride circuit board in which metal plates are attached on front and rear sides of a silicon nitride substrate having a three-point bending strength of 500 MPa or higher, with attachment layers interposed therebetween, wherein assuming that a thickness of the metal plate on the front side is denoted by t1, and a thickness of the metal plate on the rear side is denoted by t2, at least one of the thicknesses t1 and t2 is 0.6 mm or larger, a numerical relation: 0.10 ≤ |t1 - t2| ≤ 0.30 mm is satisfied, and warp amounts of the silicon nitride substrate in a long-side direction and a short-side direction both fall within a range from 0.01 to 1.0 mm. Due to above configuration, TCT properties of the silicon nitride circuit board can be improved even if the thicknesses of the front and rear metal plates are large.

公开(公告)号：EP3340291A1

公开(公告)日：2018-06-27

申请号：EP16206797.9

申请日：2016-12-23

Applicant: Infineon Technologies AG

Inventor： Bayerer, Reinhold

IPC: H01L23/10 ,  H01L23/16 ,  H01L23/367 ,  H01L23/433 ,  H05K1/02

CPC classification number: H05K7/14 ,  H01L23/10 ,  H01L23/16 ,  H01L23/3735 ,  H01L23/4006 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0271 ,  H05K1/18 ,  H05K3/284 ,  H05K5/0239 ,  H05K7/2039 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/09018 ,  H05K2201/09136 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/1105 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: One aspect relates to a method for producing an electronic module assembly. In that method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly comprises at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature.

公开(公告)号：EP3157606A4

公开(公告)日：2018-04-04

申请号：EP15809576

申请日：2015-06-17

Applicant: CATHPRINT AB

Inventor： KAELLBAECK BENGT ,  BAGAIAN TIBERIU ,  ROKOSCH TOBIAS

IPC: A61M25/00 ,  A61B5/00 ,  A61B5/0215 ,  G01L7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: A61M25/00 ,  A61B5/0215 ,  A61B5/6852 ,  A61B2562/166 ,  A61M2025/0002 ,  G01L7/00 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/09136 ,  H05K2201/10151 ,  H05K2201/2009

Abstract: The invention relates to a conductor assembly comprising a resilient tubular outer casing (1) with a flexible printed circuit board (6) in the outer casing's interior. On the circuit board a sensor (3) is arranged. A cavity (8a-c) in the outer casing adjacent to the sensor is filled with a rigid filling material (9). Where the rigid filling material extends in the lengthwise direction of the tubular outer casing (1) at least from one side of the sensor to the opposite side of the sensor. This means that the sensor will not be affected when the conductor assembly is bent or otherwise affected mechanically. The conductor assembly's outer casing (1) comprises an opening (7a-c) to a cavity (8a-c) in the outer casing in connection to the sensor, through which a filling material can be supplied in liquid form. Typically the conductor assembly includes two cavities (8a-b) in the outer casing on the side of the flexible circuit board (6) where the sensor is mounted, the two cavities being on either side of the sensor, and a third cavity (8c) in the outer casing on the side of the flexible circuit board (6) which is opposite to the sensor. In an advantageous embodiment the extension of at least one cavity (8a-c) in the outer casing is limited by bumps (4a-f) on either side of the cavity thus defining the cavity. Injected filler material propagation is governed by these bumps to the relevant space. Typically, the conductor assembly is a catheter or part of a catheter.

公开(公告)号：EP2460393B1

公开(公告)日：2017-10-11

申请号：EP10803777.1

申请日：2010-07-28

Applicant: ATI Technologies ULC

Inventor： LEUNG, Andrew ,  TOPACIO, Roden ,  MARTINEZ, Liane ,  LOW, Yip Seng

IPC: H05K3/00 ,  H01L23/12 ,  H01L23/488 ,  H05K1/02 ,  H05K3/10

CPC classification number: H01L23/49822 ,  B32B37/02 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/00 ,  H01L21/4857 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T156/10 ,  H01L2224/05599