公开(公告)号：EP2079289A3

公开(公告)日：2010-05-19

申请号：EP08171766.2

申请日：2008-12-16

Applicant: Fujitsu Limited

Inventor： Morita, Yoshihiro

IPC: H05K1/03 ,  H05K1/02 ,  H01L23/14 ,  H01L23/66

CPC classification number: H05K1/0366 ,  H01L2924/0002 ,  H05K1/0237 ,  H05K2201/029 ,  H05K2201/09236 ,  H01L2924/00

Abstract: A printed wiring board includes a main body (23), a plurality of glass fiber yarns (24, 26, 27) disposed in parallel with each other with a predetermined width, a pair of first wirings (16) disposed in parallel with the glass fiber yarns, a pair of second wirings (17) disposed in parallel with the glass fiber yarns, and a pair of connection wirings for connecting the first and the second wiring while being orthogonal to the glass fiber yarns, wherein the glass fiber yarns are separated at the same space as the width of the glass fiber yarns, and the center line of the first wiring and the second wiring are separated at a space of (space between the center lines of the adjacent glass fiber yarns × 1/2 + space between the center lines of the adjacent glass fiber yarns × N (N is an integer of at least 0 (zero)).

公开(公告)号：EP2180769A1

公开(公告)日：2010-04-28

申请号：EP09173553.0

申请日：2009-10-20

Applicant: Evertechno Co., Ltd. ,  Choi, Gyoung Duck

Inventor： Choi, Gyoung Duck ,  Son, Byeong Sik

IPC: H05K1/02 ,  H01P3/02

CPC classification number: H05K1/0245 ,  H05K1/0393 ,  H05K3/281 ,  H05K2201/09236 ,  H05K2201/09318

Abstract: Provided is a flexible printed circuit board (FPCB) for a large capacity signal transmission medium that may maintain an impedance suitable for accurately transmitting a large capacity signal such as a low-voltage differential signaling (LVDS) signal and may also have an excellent flexibility. A copper foil large capacity signal wire includes a plurality of first pads (312) and a plurality of second pads (314) that are spaced apart from each other at predetermined intervals (L) and are alternately provided, to receive a large capacity signal from a television main board and to transmit the received large capacity signal to a display device. The first pad has a positive phase and the second pad has a negative phase. A copper foil ground layer (320) is attached at a distance from the copper foil large capacity signal layer to ground the large capacity signal that is transmitted to and is returned from the display device. An insulating layer (330) is attached between the copper foil large capacity signal wire and the copper ground layer to insulate between the copper foil large capacity signal wire and the cooper foil ground layer. A width of each of the first pad and the second pad of the copper foil large capacity signal wire has a range of 40 to 400µm, an interval between the first pad and the second pad has a range of 40 to 450µm, a thickness of each of the first pad, the second pad, and the copper foil ground layer has a range of 17 to 40µm, and a thickness of the insulating layer has a range of 10 to 170µm, so that the first pad and the second pad may be controlled to be 80 to 110 Ω impedance.

Abstract translation: 提供了一种用于大容量信号传输介质的柔性印刷电路板（FPCB），其可以保持适于精确传输诸如低压差分信号（LVDS）信号的大容量信号的阻抗，并且还可以具有优异的灵活性。 铜箔大容量信号线包括以预定间隔（L）彼此间隔开的多个第一焊盘（312）和多个第二焊盘（314），并且被交替地设置以从 电视主板，并将接收的大容量信号发送到显示装置。 第一焊盘具有正相位，第二焊盘具有负相位。 铜箔接地层（320）在与铜箔大容量信号层相隔一定距离处被连接，以将从传输到显示装置并从显示装置返回的大容量信号接地。 在铜箔大容量信号线和铜接地层之间安装绝缘层（330），以在铜箔大容量信号线和铜箔接地层之间绝缘。 铜箔大容量信号线的第一焊盘和第二焊盘中的每一个的宽度具有40至400μm的范围，第一焊盘和第二焊盘之间的间隔具有40至450μm的范围，每个的厚度 所述第一焊盘，所述第二焊盘和所述铜箔接地层的厚度为17〜40μm，所述绝缘层的厚度为10〜170μm的范围，从而能够控制所述第一焊盘和所述第二焊盘 为80〜110©阻抗。

公开(公告)号：EP2179634A1

公开(公告)日：2010-04-28

申请号：EP08795313.9

申请日：2008-08-13

Applicant: Force 10 Networks, Inc.

Inventor： GOERGEN, Joel, R. ,  HUNT, Greg

IPC: H05K3/42 ,  H05K1/02

CPC classification number: H05K3/429 ,  H05K1/0216 ,  H05K1/0237 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165

Abstract: A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru- holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.

Abstract translation: 一个高速路由器背板游离缺失盘。 路由器背板上使用多个信号层，每个夹在一对数字接地层之间的差分信号对。 通孔用于将差分信号对连接到外部元件。 要通过对减小了路由的复杂性，至少一些所述差分信号对路线的通过，沿其路径的某个地方，到不同的信号层。 至少一些通孔和通孔的钻以减少的导电短线长度部分的孔。 的孔的钻孔部分包括从第一轮廓到第二轮廓的过渡，以减少从所述钻孔的端部的射频反射。

公开(公告)号：EP1909544A3

公开(公告)日：2009-12-23

申请号：EP07117380.1

申请日：2007-09-27

Applicant: NITTO DENKO CORPORATION

Inventor： Hu, Szu-Han ,  Ho, Voon Yee ,  Yamazaki, Hiroshi ,  McCaslin, Martin John

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0221 ,  H05K1/117 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2203/0733

Abstract: A wired circuit board has a plurality of insulating layers (2), a conductive layer (3) having a signal wiring (4) extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal (5A,5B) provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer (6) having a ground wiring covered with the insulating layers and formed to surround the signal wiring (15,13) in a perpendicular direction to the longitudinal direction, and a ground connecting terminal (8) provided on a longitudinal end of the ground wiring (14,7) and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.

Abstract translation: 布线电路基板具有多个绝缘层（2），具有在长度方向上延伸的信号布线（4）的导电层（3），该信号布线由绝缘层覆盖，信号连接端子（5A，5B） 设置在信号布线的纵向端部并且从绝缘层暴露;以及接地层（6），其具有被绝缘层覆盖的接地布线并且被形成为沿着与信号布线（15,13）垂直的方向围绕信号布线 以及设置在接地布线（14,7）的纵向端并从绝缘层露出的接地连接端子（8）。 信号连接端子和接地连接端子形成在多个绝缘层中的相同绝缘层的上表面上。

公开(公告)号：EP1901593A3

公开(公告)日：2009-07-29

申请号：EP07016073.4

申请日：2007-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Lim, Myong-Bin ,  Lee, Jae-Han ,  Son, Sun-kyu ,  Hwang, In-Yong

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0216 ,  G02F1/13452 ,  H05K1/025 ,  H05K1/189 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: A signal transfer member for a liquid crystal display (LCD) apparatus includes a power line for receiving power from an external source and for driving a semiconductor chip disposed on the transfer member or the display apparatus. The power line is bent so as to incorporate a serpentine structure, which enables the length of the power line to be easily adjusted and results in the line being longer than a power line formed with a relatively straight structure. Accordingly, the length of the power line can be adjusted to take into account the respective impedances of the chip and the external source so as to suppress electromagnetic waves in the power line. This prevents the creation of noise, distortion of signals, damage to the semiconductor chip, and disconnection of the input interconnection thereof that are caused by the electromagnetic waves, so that product yields are thereby improved.

公开(公告)号：EP2027818A1

公开(公告)日：2009-02-25

申请号：EP07745048.4

申请日：2007-06-11

Applicant: Olympus Medical Systems Corp.

Inventor： SATO, Sunao ,  WAKABAYASHI, Katsuhiro ,  MIZUNUMA, Akiko ,  FUJIMURA, Takanao ,  SAWADA, Yukihiko ,  IMAHASHI, Takuya ,  ADACHI, Hideo

IPC: A61B8/12

CPC classification number: A61B8/12 ,  A61B1/0051 ,  A61B1/015 ,  A61B1/042 ,  A61B8/4416 ,  A61B8/445 ,  A61B8/4455 ,  A61B2562/028 ,  A61B2562/222 ,  G01S7/52079 ,  G01S15/892 ,  H05K1/147 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/10083

Abstract: Disclosed herein is to allow a reduction in diameter of an ultrasound probe and an ultrasound endoscope and allow reliable and easy electrical connection of signal lines extending from ultrasound transducers. A transducer wiring pad group 102 provided in a distal end portion of an ultrasound transducer printed circuit board 101 provided with signal patterns that transmit and receive signals to and from a plurality of ultrasound transducers, a flexible printed circuit board wiring pad group 108 arranged in a longitudinal axis direction of the ultrasound transducer printed circuit board 101, a second signal pattern group 106 that is connected between the transducer wiring pad group 102 and the flexible printed circuit board wiring pad group 108 and bends at substantially 90 degrees in the middle thereof, and a relay flexible printed circuit board 121 that is connected to the flexible printed circuit board wiring pad group 108 and changes a direction of a signal pattern into the longitudinal axis direction are provided.

Abstract translation: 本文公开了允许减小超声波探头和超声波内窥镜的直径，并允许从超声换能器延伸的信号线的可靠且容易的电连接。 设置在超声波换能器印刷电路板101的远端部分中的传感器布线垫组102，其设置有向多个超声波换能器发送信号和从多个超声换能器接收信号的信号图案;柔性印刷电路板布线垫组108， 超声波换能器印刷电路板101的纵轴方向，连接在振子布线垫组102和柔性印刷电路基板配线垫组108之间的第二信号图案组106，其中部大致成90度弯曲， 提供连接到柔性印刷电路板布线焊盘组108并将信号图案的方向改变为纵轴方向的继电器柔性印刷电路板121。

公开(公告)号：EP1729556A3

公开(公告)日：2008-11-26

申请号：EP06010732.3

申请日：2006-05-24

Applicant: EUROCOPTER

Inventor： Imbert, Nicolas ,  Chuc, Charles

IPC: H05K7/14 ,  H01R12/06 ,  H01R12/16

CPC classification number: H05K7/1459 ,  H01R12/52 ,  H01R31/005 ,  H05K1/0289 ,  H05K1/14 ,  H05K1/148 ,  H05K7/1441 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09972

Abstract: La présente invention est relative à un dispositif (20) d'interconnexion de faisceaux électriques qui comporte plusieurs cartes (34 à 38) embrochables de brassage et de connexion des faisceaux électriques ; le dispositif comporte en outre un circuit imprimé "principal" (28, 28b) équipé de connecteurs ou "slots" (29 à 33) conçus et agencés pour recevoir les cartes embrochables, ce circuit imprimé comportant plusieurs pistes (46) parallèles permettant chacune de mettre au même potentiel deux pistes (61 à 63, 68) ou ébauches (70 à 72) de pistes respectivement prévues sur deux cartes embrochables distinctes embrochées dans les connecteurs du circuit imprimé principal, chacune de ces pistes (46) parallèles étant en contact avec une broche (50, 150) respective de plusieurs connecteurs du circuit imprimé principal.

公开(公告)号：EP1698016B1

公开(公告)日：2008-09-03

申请号：EP04815964.4

申请日：2004-12-23

Applicant: MOLEX INCORPORATED

Inventor： BRUNKER, David, L.

IPC: H01P1/04

CPC classification number: H05K1/0219 ,  H01P3/02 ,  H05K1/024 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2201/09236

Abstract: A reduced-cross-sectional area, triad transmission line is formed by plating or metallizing surface area of a substrate, along the edge of a slot cut through the substrate. The cross-sectional area of such conductors that faces each other is reduced, reducing the signal coupling between them when they are carrying high-frequency signals. An intervening ground plane between them is provided by metallization on the slot bottom that is held at ground potential.

公开(公告)号：EP1959280A2

公开(公告)日：2008-08-20

申请号：EP07254768.0

申请日：2007-12-10

Applicant: OpNext Japan, Inc.

Inventor： Takamatsu, Hisashi ,  Yamashita, Takeshi ,  Kuwano, Hideyuki ,  Kagaya, Osamu ,  Arima, Hiroyuki

IPC: G02B6/42 ,  H05K9/00

CPC classification number: G02B6/4201 ,  G02B6/4271 ,  G02B6/4277 ,  G02B6/4279 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09663 ,  H05K2201/10121 ,  H05K2201/10446

Abstract: An optical transmitter module is described. The optical transmitter module includes a lead pin for electrically connecting the inside and outside of a housing, and a flexible printed circuit board connected to the lead pin. The flexible printed circuit board has a signal pattern and two ground conductor patterns to be connected to an optical modulation element, a laser terminal pattern to be connected to a semiconductor laser, a Peltier terminal pattern to be connected to a Peltier element, and two covering conductive layers in addition to a layer on which such patterns are formed. The covering conductive layers cover all the patterns except for the signal pattern.

Abstract translation: 描述光发射机模块。 光发射机模块包括用于电连接壳体的内部和外部的引导销和连接到引脚的柔性印刷电路板。 柔性印刷电路板具有要连接到光调制元件的信号图案和两个接地导体图案，要连接到半导体激光器的激光端子图案，要连接到珀耳帖元件的珀耳帖端子图案，以及两个覆盖 除了形成这种图案的层之外的导电层。 覆盖导电层覆盖除了信号图案之外的所有图案。

公开(公告)号：EP1629391B1

公开(公告)日：2008-05-07

申请号：EP04785700.8

申请日：2004-05-20

Applicant: Intel Corporation

Inventor： BENHAM, John, c/o Intel Corporation ,  CRITCHLOW, John ,  LIANG, Tao

IPC: G06F13/40

CPC classification number: G06F13/4086 ,  H01P5/185 ,  H05K1/0239 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10189

Abstract: A compact electromagnetic coupler for use with digital transmission system is described. In one embodiment, the apparatus includes a first transmission structure, including a portion having a geometry. A second transmission structure having the geometry and positioned proximate the portion of the first transmission line structure having the geometry to form a compact electromagnetic coupler with the first transmission structure a geometry of the electromagnetic coupler to enable placement within a footprint of a standard card connector. The compact electromagnetic coupler so formed enables reconstruction of the logical state and timing of a signal transmitted along the first transmission structure.