公开(公告)号：EP0645948B1

公开(公告)日：1996-12-11

申请号：EP94306928.6

申请日：1994-09-21

Applicant: AT&T Corp.

Inventor： Degani, Yinon ,  Dudderar, Thomas Dixon ,  Woods, William Lonzo, Jr.

IPC: H05K3/34 ,  B23K3/06

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L2224/13111 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/1225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0379 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/0545 ,  Y02P70/613

公开(公告)号：EP0550432B1

公开(公告)日：1996-01-03

申请号：EP90915908.9

申请日：1990-10-17

Applicant: International Business Machines Corporation

Inventor： BEHUN, John, R. ,  CALL, Anson, J. ,  CAPPO, Frances, F. ,  COLE, Marie, S. ,  HOEBENER, Karl, G. ,  KLINGEL, Bruno, T. ,  MILLIKEN, John, C.

IPC: H01L21/98

CPC classification number: H01L25/50 ,  G01R31/04 ,  G01R31/2886 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/014

Abstract: Disclosed is a connector structure on a substrate (10) which includes at least one first solder portion (16) on the surface of the substrate; at least one second solder portion (18) connected to each of the at least one first solder portions; and an epoxy layer (20) disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.

公开(公告)号：EP0430240B1

公开(公告)日：1995-07-05

申请号：EP90122853.6

申请日：1990-11-29

Applicant: THE FURUKAWA ELECTRIC CO., LTD. ,  HARIMA CHEMICALS, INC.

Inventor： Fuse, Kenichi ,  Fukunaga, Takao ,  Kohno, Masanao ,  Irie, Hisao

IPC: H05K3/34 ,  B23K35/34

CPC classification number: H05K3/3484 ,  B23K35/34 ,  H05K3/3473 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/125

公开(公告)号：EP0274915B1

公开(公告)日：1992-06-24

申请号：EP87311538.0

申请日：1987-12-31

Applicant: FORD MOTOR COMPANY LIMITED ,  FORD FRANCE SOCIETE ANONYME ,  FORD-WERKE AKTIENGESELLSCHAFT

Inventor： Baker, Jay DeAvis

IPC: H05K3/34

CPC classification number: B23K35/262 ,  B23K1/203 ,  B23K35/268 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2924/00013 ,  H01R43/02 ,  H01R43/205 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/29099

公开(公告)号：EP0229850B1

公开(公告)日：1992-06-10

申请号：EP86904381.0

申请日：1986-07-16

Applicant: Nippon Telegraph and Telephone Corporation

Inventor： OSAKI, Takaaki ,  MATSUI, Norio ,  EGAWA, Yutaka ,  SASAKI, Shinichi

IPC: H01L21/60 ,  H01L23/48 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/13 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/3436 ,  H05K3/4053 ,  H05K2201/0394 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A laminated structure is formed by providing metal layers having wettability relative to solder at least on both sides and by inserting at least one layer of a metal which can control the diffusion of the solder between them. The terminals for connection between the substrates having structure in which a pair of solder bumps are adhered onto both surfaces of the laminated structure, and a method of producing the same are given.

公开(公告)号：EP0396484A2

公开(公告)日：1990-11-07

申请号：EP90480051.3

申请日：1990-03-27

Applicant: International Business Machines Corporation

Inventor： Behun, John Richard ,  Miller, William Robert ,  Newman, Bert Harrison ,  Yankowski, Edward Louis

IPC: H05K3/34 ,  H01L21/48

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H05K3/3478 ,  H05K2201/0379 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0557 ,  Y02P70/613 ,  Y10T29/49149

Abstract: A low cost process for fabricating solder column intercon­nections for an electronic package is described. The process includes the steps of filling an array of pin holes in a pin mold (14) with a lead/tin solder, which array of pin holes is in substantial registration with the array of conductive pads (12) on one side of a chip carri­er (2); heating the lead/tin solder in the pin mold such that the solder becomes molten and coalesces with the array of conductive pads of the chip carrier, thereby forming an array of miniature pins (4) bonded to the array of conductive pads of the chip carrier; joining circuit components to the other side of the chip carrier; and reflowing an eutectic lead/tin solder paste screened to the corresponding array of conductive pads of a circuit board to bond the free ends of the array of miniature pins of the carrier to the corresponding array of conductive pads, thereby forming the solder column connections be­tween the chip carrier and the circuit board. The process is suitable for mass production of reliable, high-density electrical inter-connections between a chip carrier and a supporting circuit board.

Abstract translation: 描述了用于制造用于电子封装的焊料柱互连的低成本工艺。 该方法包括以下步骤：用引脚/锡焊料在引脚模具（14）中填充针孔阵列，该引脚阵列与芯片的一侧上的导电焊盘阵列（12）基本上对齐， 载体（2）; 加热引脚模具中的引线/锡焊料，使得焊料变得熔化并与芯片载体的导电焊盘的阵列聚结，由此形成结合到芯片载体的导电焊盘阵列的微型引脚（4）的阵列 ; 将电路组件连接到芯片载体的另一侧; 并且将一个共晶的铅/锡焊膏回流到电路板的相应的导电焊盘阵列上，以将载体的微型引脚阵列的自由端结合到相应的导电焊盘阵列上，从而形成焊料柱连接 芯片载体和电路板。 该工艺适用于批量生产芯片载体和支撑电路板之间可靠的高密度电连接。

公开(公告)号：EP0177042A3

公开(公告)日：1988-08-17

申请号：EP85112539

申请日：1985-10-03

Applicant: HITACHI, LTD.

Inventor： Satoh, Ryohei ,  Oshima, Muneo ,  Tanaka, Minoru ,  Murata, Akira ,  Sakaguchi, Suguru ,  Hirota, Kazuo

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2203/0108 ,  H05K2203/033 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

Abstract: In connecting an electronic circuit part such as a semiconductor (1) or other part to a substrate (2) for mounting the part with solder (6), the solder is composed of a high-melting-point solder portion which is subjected working such as rolling and heat treatment in order to break the cast structure thereof, and a smaller volume of low-melting-point solder portions. The high-melting-point solder portion is connected to both the electronic circuit substrate and the electronic circuit part through the low-point-melting solder portions. This method enables interconnection between objects to be connected without impairing the high ductility and toughness of the high-melting-point solder which is subjected to working and heat treatment. This soldering method ensures highly relialable manufacture of miniaturized high density circuits, such as LSI.

公开(公告)号：EP2849216B1

公开(公告)日：2018-10-24

申请号：EP13787864.1

申请日：2013-04-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KISHI, Arata ,  MUNAKATA, Hironori ,  MOTOMURA, Koji ,  MARUO, Hiroki

IPC: H01L21/60 ,  H05K3/34 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

公开(公告)号：EP2927949A4

公开(公告)日：2016-07-06

申请号：EP13859529

申请日：2013-10-29

Applicant: KYOCERA CORP

Inventor： KANCHIKU TSUYOSHI

IPC: H01L23/10 ,  H01R13/405 ,  H05K5/06

CPC classification number: H05K5/0217 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H01R13/405 ,  H05K5/069 ,  H05K2201/10984 ,  H05K2201/10992 ,  H01L2924/00

Abstract: An electronic component housing container includes a container body housing an electronic component inside a cavity constituted by a bottom plate (1) and a side wall (2) which surrounds a center region of the bottom plate (1), and an input-output terminal (3). The input-output terminal (3) includes an insulation member (5), a pin terminal (4), and a ring-like member (6). The insulation member (5) is bonded to a periphery of an opening of a through hole (2a) provided in the side wall (2) so as to close the through hole (2a). The pin terminal (4) has a flange portion (4a) protruding from an outer peripheral surface of the pin terminal, and is pierced through the insulation member (5), and the flange portion (4a) is bonded to the insulation member (5). The ring-like member (6), through which the pin terminal (4) passes, is bonded to the outer peripheral surface of the pin terminal (4) and to the insulation member (5), on an opposite side to a surface of the insulation member (4) to which the flange portion (4a) is bonded. Problems arising in the bonding portion of the insulation member (5) due to a force applied to the tip of the pin terminal (4) are alleviated.

公开(公告)号：EP2927949A1

公开(公告)日：2015-10-07

申请号：EP13859529.3

申请日：2013-10-29

Applicant: Kyocera Corporation

Inventor： KANCHIKU, Tsuyoshi

IPC: H01L23/04

CPC classification number: H05K5/0217 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H01R13/405 ,  H05K5/069 ,  H05K2201/10984 ,  H05K2201/10992 ,  H01L2924/00

Abstract: An electronic component housing container includes a container body housing an electronic component inside a cavity constituted by a bottom plate (1) and a side wall (2) which surrounds a center region of the bottom plate (1), and an input-output terminal (3). The input-output terminal (3) includes an insulation member (5), a pin terminal (4), and a ring-like member (6). The insulation member (5) is bonded to a periphery of an opening of a through hole (2a) provided in the side wall (2) so as to close the through hole (2a). The pin terminal (4) has a flange portion (4a) protruding from an outer peripheral surface of the pin terminal, and is pierced through the insulation member (5), and the flange portion (4a) is bonded to the insulation member (5). The ring-like member (6), through which the pin terminal (4) passes, is bonded to the outer peripheral surface of the pin terminal (4) and to the insulation member (5), on an opposite side to a surface of the insulation member (4) to which the flange portion (4a) is bonded. Problems arising in the bonding portion of the insulation member (5) due to a force applied to the tip of the pin terminal (4) are alleviated.

Abstract translation: 电子部件容纳容器包括：容纳体，其容纳由底板（1）和围绕底板（1）的中心区域的侧壁（2）构成的空腔内的电子部件;以及输入输出端子 （3）。 输入输出端子（3）包括绝缘构件（5），销端子（4）和环状构件（6）。 绝缘构件（5）结合到设置在侧壁（2）中的通孔（2a）的开口的周边，以封闭通孔（2a）。 销端子（4）具有从销端子的外周面突出的凸缘部（4a），穿过绝缘部件（5），凸缘部（4a）与绝缘部件（5） ）。 销端子（4）通过的环状部件（6）在销端子（4）的外周面和绝缘部件（5）的相对侧 与凸缘部分（4a）接合的绝缘构件（4）。 由于施加到销端子（4）的尖端的力，在绝缘构件（5）的接合部分产生的问题得到缓解。