公开(公告)号：EP0761075A1

公开(公告)日：1997-03-12

申请号：EP95918476.0

申请日：1995-05-25

Applicant: James Cook University of North Queensland

Inventor： SUEHRCKE, Harry ,  LOVISA, Noel, Wilhelmus

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/119 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10053 ,  H05K2201/1059

Abstract: An electrical socket is formed in a printed circuit board (PCB) using standard automated PCB production techniques. The socket (20) comprises a respective three legged slotted aperture (22) for each pin (11) of a male plug. The slotted aperture (22) defines two cantilevered portions (23) which receive a respective pin (11) in a slot defined therebetween. The slot is of slightly narrower width than the corresponding pin (11), but the cantilevered portions (23) are resiliently movable to enable the slot to receive and frictionally retain the pin therein. Plated contact surfaces are formed on either side of the slot to make physical and electrical contact with the pin. A modified socket (40) includes an integrally formed isolation switch. The cantilevered portions (41) extend beyond the point where the pin (11) is inserted therebetween. The distal ends of the cantilevered portions (41) are provided with respective contact surfaces (43, 44) which are normally spaced apart, but come into contact to close the switch when the cantilevered portions (41) are splayed apart by the insertion of a pin therebetween. Alternatively, contacts (32) on the cantilevered portions may be arranged to come into contact with corresponding contacts (33) on the circuit board.

公开(公告)号：EP0650318B1

公开(公告)日：1996-12-27

申请号：EP94402328.2

申请日：1994-10-18

Applicant: SUMITOMO WIRING SYSTEMS, LTD.

Inventor： Nakanishi, Ryuji, c/o Sumitomo Wiring Systems Ltd.

IPC: H05K9/00

CPC classification number: H05K9/0039 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/0262 ,  H05K1/118 ,  H05K1/142 ,  H05K1/144 ,  H05K2201/048 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/09263 ,  H05K2201/097 ,  Y10T29/49124

公开(公告)号：EP0606104A3

公开(公告)日：1995-05-17

申请号：EP94101526.5

申请日：1989-12-13

Applicant: KYUSHU HITACHI MAXELL, LTD.

Inventor： Chiyajo, Masanobu ,  Kuroki, Toshio ,  Sakata, Eiji

IPC: H01M2/10 ,  H01M10/46 ,  B26B19/28 ,  H05K1/18

CPC classification number: H05K1/18 ,  B26B19/286 ,  B26B19/3853 ,  B26B19/3873 ,  H01M2/1055 ,  H01M2/20 ,  H01M2/34 ,  H01M10/46 ,  H05K1/0292 ,  H05K1/0293 ,  H05K1/117 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/094 ,  H05K2201/10037 ,  H05K2201/10295 ,  H05K2201/10606 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/175 ,  H05K2203/176

Abstract: A rechargeable type small electric appliance including a rechargeable battery (5) supplied by a charging circuit (6), both within a casing (1), having a battery outlet covered by a lid (14) is described. Means are provided for preventing operation of the charging circuit whilst it is open. In one embodiment this is by relative positioning of the power supply socket and the lid so as to prevent simultaneous charging and opening of the lid, whilst in other embodiments it is by physical integration of the power supply socket and the lid, or location of a power supply switch which must be "OFF" in order to remove the lid.

公开(公告)号：EP0649272A1

公开(公告)日：1995-04-19

申请号：EP94202880.4

申请日：1994-10-05

Applicant: PHILIPS ELECTRONICS N.V.

Inventor： Weekamp, Johannus Wilhelmus, Int. Octrooibureau ,  Brandsma, Johannes, Int. Octrooibureau

IPC: H05K1/18

CPC classification number: B65D73/0021 ,  B65D73/0028 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/326 ,  H05K3/363 ,  H05K2201/049 ,  H05K2201/09081 ,  H05K2201/10393 ,  H05K2201/10636 ,  H05K2201/10681 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T29/49169 ,  Y10T29/49218

Abstract: Method of manufacturing a flexible fastening member, flexible fastening member and object provided with such a fastening member, support provided with an object and with such a fastening member, and packaging provided with a number of such fastening members.
The invention relates to a method of manufacturing a flexible fastening member (19) comprising a foil (1) for fastening an object (15) thereto, characterized by making at least two generally U-shaped incisions (5) which are spaced apart, which define a central portion (23) between them, and which are directed oppositely to another, the open ends of the U-shapes facing away from another so as to create two mutually opposed tags (11), and by bending the foil (1) along two parallel bending lines (13), each line being situated at the open end of a U-shaped incision (5) so as to obtain a generally U-shaped member (19) whose base is said central portion (23), and to obtain the tags (11) as extensions of the legs (25) of said U-shaped member and situated at one side of the plane (20) defined by the central portion (23), the legs (25) being situated at the other side of said plane (20).
The invention also relates to a fastening member obtained by the method, an object provided with such a fastening member, a support provided with an object and such a fastening member, and a packaging provided with a number of such fastening members.

Abstract translation: 制造柔性紧固件的方法，具有这种紧固件的柔性紧固件和物体，设置有物体的支撑件和这种紧固件，以及设置有多个这种紧固件的包装件。 本发明涉及一种制造柔性紧固件（19）的方法，所述柔性紧固件（19）包括用于将物体（15）紧固到其上的箔（1），其特征在于制备至少两个间隔开的大致为U形的切口（5）， 在它们之间限定一个中心部分（23），并且它们相对于另一个定位，所述U形的开放端部背向另一个，从而形成两个相互相对的标签（11），并且通过弯曲所述箔片（1） 沿着两个平行弯曲线（13），每条线位于U形切口（5）的开口端，以便获得其基部是所述中心部分（23）的大致U形的构件（19），以及 为了获得作为所述U形构件的腿部（25）的延伸部的标签（11），并且位于由中心部分（23）限定的平面（20）的一侧，腿部（25）位于 所述平面（20）的另一侧。 本发明还涉及通过该方法获得的紧固构件，设置有这种紧固构件的物体，设置有物体的支撑件和这种紧固构件以及设置有多个这种紧固构件的包装。

公开(公告)号：EP0531185B1

公开(公告)日：1995-04-12

申请号：EP92402275.9

申请日：1992-08-12

Applicant: VALEO VISION

Inventor： Segaud, Daniel

IPC: B60Q1/26 ,  F21Q1/00 ,  H05K1/00 ,  H01L25/075

CPC classification number: B60Q1/2696 ,  F21S43/14 ,  F21S43/15 ,  H01L25/13 ,  H01L2924/0002 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/09081 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00

公开(公告)号：EP0465692B1

公开(公告)日：1994-06-08

申请号：EP90113079.9

申请日：1990-07-09

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Kasowski, Hermann, Dipl.-Ing.(FH) ,  Schönberger, Eduard, Dipl.-Ing.(FH) ,  Schmidt, Heinz, Dipl.-Ing.(FH)

IPC: H05K7/14

CPC classification number: H05K7/1428 ,  H05K1/0215 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/10189 ,  H05K2201/1059

公开(公告)号：EP0478320A3

公开(公告)日：1993-06-30

申请号：EP91308771.4

申请日：1991-09-26

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shimizu, Seizaburo, c/o Intellectual Property Div. ,  Sasaki, Osamu, c/o Intellectual Property Div. ,  Yoshizumi, Akira, c/o Intellectual Property Div. ,  Ohta, Hideo, c/o Intellectual Property Div.

IPC: H05K3/04 ,  H05K3/20 ,  H05K3/42

CPC classification number: H05K3/10 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/041 ,  H05K3/20 ,  H05K3/4084 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2203/0108 ,  H05K2203/0156 ,  H05K2203/0195 ,  H05K2203/085 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T29/532 ,  Y10T156/107 ,  Y10T156/109

Abstract: There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns (8) are transferred onto a thermoplastic resin (7), without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate (5) having protruding patterns (4) which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil (6) used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil (6) and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns (4) of the original plate (5) against a thermoplastic resin (7) with the copper foil (6) interposed therebetween to transfer portions of the copper foil (6) in contact with the protruding patterns (4) onto the surface of the thermoplastic resin (7), thereby forming the circuit patterns (8).

Abstract translation: 公开了一种制造印刷电路板的方法，其中精细的铜电路图案（8）被转印到热塑性树脂（7）上，而不会像减法那样产生大量的铜溶解的废液。 制造印刷电路板的方法包括以下步骤：制造具有与要形成的电路图案相同形状的突出图案（4）的印刷电路原版（5），其厚度至少等于 使用的铜箔（6），其均由与铜箔（6）接触的平坦或突出的弯曲表面和与平坦或突出的弯曲表面不同的侧表面构成，并且在压力下加热突出图案 （5）的热塑性树脂（7）与铜箔（6）之间插入其中以将与突出图案（4）接触的铜箔（6）的部分转印到 热塑性树脂（7），从而形成电路图案（8）。

公开(公告)号：EP0531185A1

公开(公告)日：1993-03-10

申请号：EP92402275.9

申请日：1992-08-12

Applicant: VALEO VISION

Inventor： Segaud, Daniel

IPC: B60Q1/26 ,  F21Q1/00 ,  H05K1/00 ,  H01L25/075

CPC classification number: B60Q1/2696 ,  F21S43/14 ,  F21S43/15 ,  H01L25/13 ,  H01L2924/0002 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/09081 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00

Abstract: L'élément de support équipé d'un circuit électronique à composants multiples, notamment pour feu de signalisation automobile, comporte des lanières (42) séparées les unes des autres par des fentes (43), une pluralité desdits composants multiples (3) étant montée sur chacune desdites lanières (42).
Cet élément est réalisé par découpe de manière à constituer des lanières se raccordant à au moins une racine de l'élément de support (4).
Application véhicules automobiles.

Abstract translation: 配备有具有多个组件的电子电路的支撑结构，特别是用于机动车辆的信号灯（指示器）的电子电路包括通过狭缝（43）彼此分离的条带（42），多个所述多个部件（3）被安装 在每个所述条（42）上。 通过切割来生产该结构，以形成连接到支撑结构（4）的至少一个根部的条带。 适用于机动车辆。

公开(公告)号：EP0083265B1

公开(公告)日：1985-09-11

申请号：EP82402290.9

申请日：1982-12-14

Applicant: SOCAPEX

Inventor： Bricaud, Hervé ,  Olive, Jean-Louis

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/5385 ,  H01L23/4985 ,  H01L23/5383 ,  H01L2224/16 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/189 ,  H05K3/303 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/10666 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613

公开(公告)号：EP2135839B1

公开(公告)日：2018-11-21

申请号：EP09006279.5

申请日：2009-05-08

Applicant: Garmin Switzerland GmbH

Inventor： Kulach, Christopher J. ,  MacDonald, Paul R.

IPC: B81B7/00

CPC classification number: B81B7/0054 ,  B81B2201/0235 ,  B81B2207/096 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/09081 ,  H05K2201/10151

Abstract: A system for improving the performance of a microelectromechanical systems (MEMS) device that is housed in a package and implemented on a printed circuit board (PCB) comprises a footprint, an isolation channel, and a bridge. A portion of the isolation channel is removed to mechanically isolate the MEMS device.