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    Solder void reduction on circuit boards
    34.
    发明公开
    Solder void reduction on circuit boards 有权
    电路板上的焊料空洞减少

    公开(公告)号：EP2086298A1

    公开(公告)日：2009-08-05

    申请号：EP08150847.5

    申请日：2008-01-30

    Applicant: Research In Motion Limited

    Inventor： Khan, Atiq

    IPC: H05K3/34

    CPC classification number: H05K3/3452 ,  H05K3/0094 ,  H05K3/3457 ,  H05K2201/09481 ,  H05K2203/1394

    Abstract: There is disclosed a method, system, and screen for reducing solder voids on circuit boards. In an embodiment, there is provided a method of reducing solder voids on a circuit board, comprising: locating via holes provided at a conductive landing pad; and covering at least some of the via holes with a coating, whereby gases from the covered via holes are prevented from expanding and forming voids. In another embodiment, the method further comprises covering the location of at least some of the via holes in a pattern of strips, whereby more of the via holes may be covered by the coating while reducing areas of the conductive landing pad covered by the coating. In another embodiment, the coating and removal process may be performed at the same time as when all other areas of the circuit board are coated and removed, such that a separate manufacturing step is not required.

    Abstract translation: 公开了用于减少电路板上的焊料空隙的方法，系统和屏幕。 在一个实施例中，提供了一种减少电路板上的焊料空隙的方法，包括：定位设置在导电着陆焊盘处的通孔; 并用涂层覆盖至少一些通孔，由此防止来自被覆通孔的气体膨胀并形成空隙。 在另一个实施例中，该方法还包括以条带图案覆盖至少一些通孔的位置，由此更多的通孔可以被涂层覆盖，同时减少由涂层覆盖的导电连接焊盘的区域。 在另一个实施例中，可以在电路板的所有其他区域被涂覆和去除的同时执行涂覆和去除工艺，从而不需要单独的制造步骤。

    CIRCUIT BOARD AND CONNECTION SUBSTRATE
    35.
    发明公开
    CIRCUIT BOARD AND CONNECTION SUBSTRATE 审中-公开
    LEITERPLATTE UND VERBINDUNGSSUBSTRAT

    公开(公告)号：EP2007176A1

    公开(公告)日：2008-12-24

    申请号：EP07736883.5

    申请日：2007-03-14

    Applicant: Sumitomo Bakelite Company, Ltd.

    Inventor： CHUMA, Toshiaki, c/o Akita Sumitomo Bake Co., Ltd. ,  INABA, Makoto, c/o Akita Sumitomo Bake Co., Ltd.

    IPC: H05K1/14

    CPC classification number: H05K1/148 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481

    Abstract: There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.

    Abstract translation: 提供了一种电路板，其包括分别设置有第一和第二导体焊盘的间隔的第一和第二电路基板; 以及连接基板，包括从一侧或另一侧突出的第一导体柱和第二导体柱; 所述连接基板设置成覆盖所述第一和第二电路基板的一部分，并在其间桥接; 第一导体柱和第一导体焊盘以及第二导体柱和第二导体焊盘彼此相对设置; 电路板还包括在熔融金属涂层时形成的连接器部分，其预先形成在第一导体柱和第一导体焊盘中的至少一个的表面上，并且在第二部分中的至少一个的表面上形成 导体柱和第二导体垫; 第一和第二电路基板和连接基板通过连接器部分电连接。

    SURFACE ILLUMINATOR
    36.
    发明公开
    SURFACE ILLUMINATOR 审中-公开
    FLÄCHENBELEUCHTUNGSVORRICHTUNG

    公开(公告)号：EP1895229A1

    公开(公告)日：2008-03-05

    申请号：EP06757128.1

    申请日：2006-06-07

    Applicant: MINEBEA Co., Ltd.

    Inventor： SATOH, makoto c/o Minebea Co., Ltd. ,  OHNO, yasuo c/o Minebea Co., Ltd.

    IPC: F21V8/00 ,  F21V19/00 ,  F21V29/00 ,  G02B6/00 ,  G02F1/13357 ,  F21Y101/02

    CPC classification number: G02B6/0085 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K3/42 ,  H05K2201/0209 ,  H05K2201/09481 ,  H05K2201/0959 ,  H05K2201/10106

    Abstract: [PROBLEMS] To promote thinning of a surface illuminator while realizing higher and more uniform luminance by dissipating heat from a point light source more efficiently. [MEANS FOR SOLVING PROBLEMS] A heat dissipation path is constituted to transmit heat generated from a point light source (3) to a metallic heat dissipation plate (5a) through an electrode terminal (3a) of the point light source (3), a land portion (12) on the front surface (10F) of an FPC (10), a through hole (16) of a conductor pattern (14) and a high heat conduction resin (18). The path for efficiently dissipating heat from the conductor pattern (14) of the FPC (10) to the metallic heat dissipation plate (5a) is widened and a direct heat dissipation area is also secured sufficiently. Especially, even when a large current LED is employed in the point light source (3), sufficient heat dissipation effect can be attained. Since the degree of freedom of the wiring pattern and outline of the FPC (10) is not different from that of conventional FPCs, the request for thinning the surface illuminator can be met sufficiently.

    Abstract translation: [问题]通过更有效地从点光源散发热量来促进表面照明器的变薄，同时实现更高和更均匀的亮度。 解决问题的手段散热路径被构造成通过点光源（3）的电极端子（3a）将从点光源（3）产生的热量传递到金属散热板（5a）， FPC（10）的前表面（10F）上的接地部分（12），导体图案（14）的通孔（16）和高导热树脂（18）。 从FPC（10）的导体图案（14）向金属散热板（5a）有效地散热的路径被加宽，并且还充分确保直接散热区域。 特别地，即使在点光源（3）中使用大电流LED，也可以获得充分的散热效果。 由于FPC（10）的布线图形和轮廓的自由度与传统的FPC不同，因此可以充分满足对表面照明器的薄化要求。

    SHEET-FORM CONNECTOR AND PRODUCTION METHOD AND APPLICATION THEREFOR
    39.
    发明公开
    SHEET-FORM CONNECTOR AND PRODUCTION METHOD AND APPLICATION THEREFOR 有权
    HERSTELLUNGSVERFAHREN UND ANWENDUNGDAFÜR的表格

    公开(公告)号：EP1503216A1

    公开(公告)日：2005-02-02

    申请号：EP03758872.0

    申请日：2003-10-24

    Applicant: JSR Corporation

    Inventor： Sato, Katsumi JSR Corporation ,  Inoue, Kazuo JSR Corporation

    IPC: G01R1/073 ,  H01R11/01 ,  H01L21/66

    CPC classification number: G01R1/07314 ,  G01R1/06711 ,  G01R1/06733 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R11/01 ,  H01R12/523 ,  H05K1/116 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2203/0733 ,  H01L2924/00

    Abstract: Disclosed herein are a sheet-like connector that electrode structures each having a front-surface electrode part small in diameter can be formed, a stable electrically connected state can be surely achieved even to a circuit device, on which electrodes have been formed at a small pitch, and the electrode structures are prevented from falling off from an insulating sheet to achieve high durability, and a production process and applications thereof.
    The sheet-like connector of the invention has an insulating sheet and a plurality of electrode structures arranged in the insulating sheet and extending through in a thickness-wise direction of the insulating sheet. Each of the electrode structures is composed of a front-surface electrode part exposed to a front surfaces of the insulating sheet and projected from the front surface of the insulating sheet, a back-surface electrode part exposed to a back surface of the insulating sheet, a short circuit part continuously extending from the base end of the front-surface electrode part through the insulating sheet in the thickness-wise direction thereof and linked to the back-surface electrode part, and a holding part continuously extending from a base end portion of the front-surface electrode part outward along the front surface of the insulating sheet.

    Abstract translation: 这里公开了一种片状连接器，其可以形成具有直径小的前表面电极部分的电极结构，甚至可以确实地获得稳定的电连接状态，其中电路已经形成在小的电路 节距，并且电极结构被防止从绝缘片脱落以实现高耐久性，以及其制造方法和应用。 本发明的片状连接器具有布置在绝缘片中的绝缘片和多个电极结构，并沿绝缘片的厚度方向延伸。 每个电极结构由暴露于绝缘片的前表面并从绝缘片的前表面突出的前表面电极部分，暴露于绝缘片的背面的背面电极部分组成， 短路部从前表面电极部的基端沿其厚度方向连续地延伸，并且与背面电极部连接，并且从基端部连续延伸的保持部， 前表面电极部分沿着绝缘片的前表面向外侧。

    Light emitting module
    40.
    发明公开
    Light emitting module 审中-公开
    Lichtemittierendes Modul

    公开(公告)号：EP1359627A2

    公开(公告)日：2003-11-05

    申请号：EP03007449.6

    申请日：2003-04-03

    Applicant: Omron Corporation

    Inventor： Makuta, Isao Omron Corp., 801, Minamifudodo-cho

    IPC: H01L33/00

    CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0209 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/4015 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10598 ,  H05K2201/10636 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014

    Abstract: By use of a simple structure, also without enlarging thickness and size too much, provided is a light emitting module which can improve heat dissipation of a light emitting component. On a surface of a wiring substrate, a pair of lands face to each other, and two wiring line is connected to the land, respectively. A mounting side outside electrode of a light emitting component is connected to a lead frame to which a light emitting element is die-bonded, and a non-mounting side outside electrode is connected to a lead frame which is connected to the light emitting element through a bonding wire. And, the mounting side outside electrode is bonded to the land by solder, and the non-mounting side outside electrode is bonded to the land by solder and thereby, the light emitting component is mounted on the wiring substrate. A line width of the wiring line at a side to which the mounting side outside electrode of the light emitting component is soldered is made to be larger than a line width of the wiring line at a side to which the non-mounting side outside electrode is soldered.

    Abstract translation: 通过使用简单的结构，也不会太大地增加厚度和尺寸，所以提供了可以改善发光部件的散热的发光模块。 在布线基板的表面上，一对台面彼此面对，并且两个布线分别连接到台面。 发光部件的安装侧外侧电极与发光元件裸片接合的引线框架连接，非安装侧外部电极与连接到发光元件的引线框架连接，该引线框架通过 接合线。 并且，通过焊料将安装侧外部电极接合到焊盘，通过焊料将非安装侧外部电极接合到焊盘，由此将发光部件安装在布线基板上。 将发光部件的安装侧外部电极焊接的一侧的布线的线宽度设定为大于非安装侧外部电极侧的布线的线宽 焊接。

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