公开(公告)号：EP1505860A1

公开(公告)日：2005-02-09

申请号：EP04018473.1

申请日：2004-08-04

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Yatsu, Hiroyuki, Alps Electric Co.Ltd

IPC: H05K5/00 ,  H05K5/03

CPC classification number: H05K3/403 ,  H01L23/055 ,  H01L23/10 ,  H01L24/97 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/0052 ,  H05K3/3405 ,  H05K2201/09181 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2201/10371

Abstract: The present invention provides an electronic circuit module having a certainty of soldering attachment to a motherboard, a small size and a highly reliable connection to the motherboard. An electronic circuit module of the present invention comprises a circuit board (1) formed with laminated plurality of insulating sheets, and a cover (9) made from a metal plate and having attaching legs (9c) soldered to electrode portions (8) in the concave portions (1c) in a state of covering the electronic component (7). The concave portions (1c) are formed from an upper surface of the circuit board (1) toward a lower surface side, stopping portions (1d) for plugging the lower portions of the concave portions (1c) are provided in the circuit board (1), and the attaching legs (9c) of the cover (9) are soldered to the electrode portions (8) in a state of being inserted into the concave portions (1c). As a result, it is possible to prevent the soldering connecting the attaching legs (9c) to the electrode portions (8) from leaking downward by way of the stopping portions (1d). Accordingly, the degree of flatness of the circuit board (1) to the motherboard (10) becomes better and the soldering is reliable.

Abstract translation: 本发明提供一种电子电路模块，其具有焊接附着到主板的可靠性，与主板的小尺寸和高度可靠的连接。 本发明的电子电路模块包括形成有层压的多个绝缘片的电路板（1）和由金属板制成并具有焊接到电极部分（8）的连接脚（9c）的盖（9） 处于覆盖电子部件（7）的状态的凹部（1c）。 凹部（1c）由电路基板（1）的上表面朝向下表面侧形成，用于堵塞凹部（1c）的下部的停止部（1d）设置在电路基板（1） ），并且在插入凹部（1c）的状态下，将盖（9）的安装腿（9c）焊接到电极部（8）。 结果，可以防止通过停止部（1d）将连接脚（9c）与电极部（8）的焊接部向下泄漏。 因此，电路板（1）与母板（10）的平坦度变得更好，焊接可靠。

公开(公告)号：EP1459611A1

公开(公告)日：2004-09-22

申请号：EP02798283.4

申请日：2002-12-19

Applicant: ROBERT BOSCH GMBH

Inventor： SCHIEFER, Peter

IPC: H05K5/00

CPC classification number: H05K9/0026 ,  H05K1/181 ,  H05K3/301 ,  H05K5/0056 ,  H05K5/0069 ,  H05K9/0037 ,  H05K9/0049 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10583 ,  H05K2203/1572 ,  Y02P70/611

Abstract: The invention relates to a housing system for an electric device (1), which has at least two housing parts (2, 3) and an electronic circuit arranged on a circuit board (4) therein, provided with a conductive layer which is connected to the ground of at least one metallic housing part (2). The housing part (3) is made of a plastic part. At least the connecting device (9) for the voltage source of the device and/or the signal transmission to the electronic circuit is integrated therein. The circuit board (4) is covered on both sides. Perturbing-radiation-sensitive components (5) are arranged on the side thereof, and are continuously surrounded by the metallic housing part (2) and the conductive layer, and other components (6) and contacts of the connecting device (9) are arranged on the other side of the circuit board (4).

公开(公告)号：EP1428418A1

公开(公告)日：2004-06-16

申请号：EP02772850.0

申请日：2002-09-12

Applicant: Nec Schott Components Corporation

Inventor： FUKUSHIMA, Daisuke,NEC SCHOTT COMPONENTS CORP.

IPC: H05K3/34

CPC classification number: H03H9/1021 ,  H01L23/04 ,  H01L23/045 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material filling in an internal space defined by the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface on the internal space side of the metal lead. The internal space is held at an air-tight atmosphere. The metal base has a lower surface positioned on the same plane as a lower surface of the metal lead or the insulating material, the same plane forming a plane to be attached to a mounting board.

公开(公告)号：EP1399006A2

公开(公告)日：2004-03-17

申请号：EP03255690.4

申请日：2003-09-11

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Watanabe, Hideki ,  Matsuno, Satoru

IPC: H05K1/14 ,  H05K3/34 ,  H05K9/00

CPC classification number: H05K9/0024 ,  H05K1/141 ,  H05K3/3447 ,  H05K5/0091 ,  H05K2201/096 ,  H05K2201/10371

Abstract: A mounting structure of a wireless module having low cost and excellent productivity is provided. In the mounting structure of a wireless module according to the present, a cover (4) has a box-shaped cover portion (4a) and one or a plurality of leg portions (4b) projected downward from the cover portion (4a). First through holes 1a for inserting the leg portions (4b) are provided in the circuit board (1), and second through holes (6a) for inserting the leg portions (4b) are provided in the motherboard (6). Since the leg portions (4b) are soldered to the circuit board (1) and the motherboard (6) at the first and second through holes (1a, 6a) in a state that the leg portions (4b) are inserted into the first and second through holes (1a, 6a), respectively, the cover (4) also serves as the conventional protective cover. Therefore, this invention has less components than the conventional art, decreases the cost, simplifies the mounting process of the cover, and thus provides excellent productivity.

Abstract translation: 提供了具有低成本和优异生产率的无线模块的安装结构。 在根据本发明的无线模块的安装结构中，盖（4）具有盒形盖部（4a）和从盖部（4a）向下突出的一个或多个腿部（4b）。 在电路板（1）中设置用于插入腿部（4b）的第一通孔1a，并且用于插入腿部（4b）的第二通孔（6a）设置在母板（6）中。 由于腿部（4b）在腿部（4b）插入第一和第二通孔（1a，6a）中的状态下在第一和第二通孔（1a，6a）处焊接到电路板（1）和母板 第二通孔（1a，6a），盖（4）也用作常规保护盖。 因此，与现有技术相比，本发明具有更少的部件，降低了成本，简化了盖的安装过程，因此提供了优异的生产率。

公开(公告)号：EP0910163B1

公开(公告)日：2004-02-04

申请号：EP98306825.5

申请日：1998-08-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Uno, Masao

IPC: H03B1/04

CPC classification number: H05K5/0095 ,  H05K1/0243 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/42 ,  H05K9/0022 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10075 ,  H05K2201/10371

公开(公告)号：EP0957665B1

公开(公告)日：2003-12-10

申请号：EP99303101.2

申请日：1999-04-21

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Terashima, Kiminori

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H05K3/3405 ,  H05K3/3447 ,  H05K7/02 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/2018

公开(公告)号：EP1274149A2

公开(公告)日：2003-01-08

申请号：EP02012482.2

申请日：2002-06-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Ogura, Hiroshi ,  Takahashi, Kazuaki

IPC: H01P5/107 ,  H01P11/00

CPC classification number: H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P5/107 ,  H01P11/00 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/037 ,  H05K2201/0969 ,  H05K2201/10371 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T156/1052 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed is a radio frequency circuit having a membrane structure and manufacturing method for the same. The radio frequency circuit has a circuit element formed on an insulating material plate having copper bonded on both surfaces or one surface thereof whereby a metal substrate having a hollow bore and the insulating material plate forming the circuit element are bonded together. The circuit element is mounted with an active element on which a lid having a partition wall is bonded for packaging. The hollow bore in the metal substrate, for forming a membrane structure, is formed by press-blanking. Because the metal substrate is not wet-etched, dimensions control can be easily, precisely made on a hollow bore region of the metal substrate. Furthermore, it is possible to shorten the working time on the hollow bore region.

Abstract translation: 公开了一种具有膜结构的射频电路及其制造方法。 射频电路具有形成在绝缘材料板上的电路元件，该绝缘材料板在两面或一个表面上具有铜键合，由此具有中空孔的金属基板和形成电路元件的绝缘材料板接合在一起。 电路元件安装有活动元件，在其上结合有具有隔壁的盖子用于包装。 用于形成膜结构的金属基底中的中空孔通过冲压冲裁形成。 由于金属基板未被湿式蚀刻，因此可以容易地，精确地在金属基板的中空孔区域上进行尺寸控制。 此外，可以缩短在中空孔区域上的工作时间。

公开(公告)号：EP1237025A2

公开(公告)日：2002-09-04

申请号：EP02004306.3

申请日：2002-02-28

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Sato, Shunsuke, Yokohama Works ,  Nishiyama, Naoki, Yokohama Works

IPC: G02B6/42

CPC classification number: G02B6/4201 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/2036 ,  H05K2203/1572

Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34e are mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.

Abstract translation: 光学数据链路20包括安装构件22，光学元件组件24，电路板26和间隔件32.PGA基板22具有基板22a和多个导电销22b。 电路板26具有一对表面。 电子元件34a至34e安装在该对表面上。 光学元件组件24包括半导体光学元件24f。 半导体光学元件24f连接到电路板26上的导电层。间隔物32用于使电路板26与PGA衬底22间隔开。由于电路板26远离PGA衬底22，所以 电子部件34a至34e可以安装在电路板22的两个表面上

公开(公告)号：EP1096662A2

公开(公告)日：2001-05-02

申请号：EP00308956.2

申请日：2000-10-11

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Kajita, Kazutoyo, Alps Electric Co., Ltd

IPC: H03B1/02

CPC classification number: H03B1/02 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/325 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/0314 ,  H05K2201/0715 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10969 ,  H05K2201/2036

Abstract: An oscillator attachment structure which prevents inference by a beat signal caused by mixture of a reference oscillation signal from a PLL circuit and an oscillation signal from an oscillator. A plate conductive rubber member (16), electrically connected to a ground conductor (12), is provided on the lower surface of a circuit board, and the conductive rubber member is placed on a ground conductive member of a printed circuit board. The ground conductor and the ground conductive member are electrically connected to each other, and the circuit board can be sufficiently grounded to the PLL circuit on the printed circuit board.

公开(公告)号：EP0876088A3

公开(公告)日：1999-10-27

申请号：EP98303445.5

申请日：1998-05-01

Applicant: NEC Corporation

Inventor： Oga, Toshiyuki

IPC: H05K1/18 ,  H05K9/00 ,  H03F3/19

CPC classification number: H05K1/0243 ,  H05K3/3421 ,  H05K3/3447 ,  H05K9/002 ,  H05K2201/10166 ,  H05K2201/10371

Abstract: A semiconductor microwave amplifier includes input- and output-side microstrip lines formed on a printed-circuit board to oppose each other, input and output electrodes formed on the microstrip lines to be parallel to the microstrip lines, a pair of ground electrodes formed in a direction perpendicular to the input and output electrodes to oppose each other, and a semiconductor amplification device connected to all of the electrodes. This amplifier further has a metal plate connected to the ground electrodes to ensure high-frequency isolation between the input electrode and the output electrode and shield electromagnetic connection, and a through hole for connecting a ground portion of the semiconductor device to a ground surface for the microstrip lines, the ground surface being formed on the printed-circuit board.