公开(公告)号：EP1096607B1

公开(公告)日：2003-04-02

申请号：EP00120021.1

申请日：2000-09-14

Applicant: AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Onizuka, Takahiro, c/o AUTONETWORKS TECH., LTD.

IPC: H01R9/24 ,  H01R43/02

CPC classification number: H05K3/4038 ,  H01R9/2458 ,  H01R43/0221 ,  H05K1/0289 ,  H05K3/202 ,  H05K3/4084 ,  H05K2201/0394 ,  H05K2203/107 ,  H05K2203/128

公开(公告)号：EP1272016A2

公开(公告)日：2003-01-02

申请号：EP02013312.0

申请日：2002-06-18

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yokoyama, Yukio ,  Someya, Keisuke

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K1/0212 ,  H05K3/202 ,  H05K3/28 ,  H05K3/3468 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09781

Abstract: There is provided a resin-molded board that enables soldering of electronic components to the metal frame of the resin-molded board to be carried out well, with no increase in production cost. A metal frame is comprised of a plurality of frame parts that form an electric circuit pattern, and a resin layer is molded onto the metal frame. The resin layer has provided in a surface thereof first openings for soldering electronic components onto the metal frame, each of the first openings having exposed therein a corresponding one of the frame parts, and second openings associated with the first openings, respectively, for maintaining a temperature at the first openings at not less than a predetermined temperature when soldering the electronic components onto the metal frame in the first openings using a flow soldering method.

Abstract translation: 提供一种树脂模制板，其能够使电子部件焊接到树脂模制板的金属框架上，而不会增加制造成本。 金属框架由形成电路图案的多个框架部件构成，并且树脂层被模制到金属框架上。 树脂层在其表面上设置有用于将电子元件焊接到金属框架上的第一开口，每个第一开口具有暴露在其中的对应的一个框架部分以及分别与第一开口关联的第二开口， 当使用流焊接方法将电子元件焊接到第一开口中的金属框架上时，第一开口处的温度不低于预定温度。

公开(公告)号：EP1269808A1

公开(公告)日：2003-01-02

申请号：EP01916828.5

申请日：2001-03-30

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/0268 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/113 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/162 ,  H05K1/185 ,  H05K3/005 ,  H05K3/0055 ,  H05K3/0061 ,  H05K3/041 ,  H05K3/046 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4084 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09636 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2201/10598 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/163 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00

Abstract: According to the invention, a microperforation (PMP) process step is combined with the lamination process. To this end, a dielectric layer (11,11') and a prefabricated product (1) are placed between two perforation dies (21,23) or a support and a perforation die. The prefabricated product (1) is partially covered by a conducting layer forming structures to be contacted by microvias. Pressure is applied on the perforation die (21,22), perforation tips of the perforation dies forming microvias for contacting the structures. A surface of the dielectric layer (11,11') or the prefabricated product (1) is configurated or coated to in a manner that the prefabricated product (1) and the dielectric layer (11,11') stick to each other after the pressure has been applied.

公开(公告)号：EP1267597A2

公开(公告)日：2002-12-18

申请号：EP02013103.3

申请日：2002-06-13

Applicant: Denso Corporation

Inventor： Kondo, Koji, c/o DENSO CORPORATION ,  Yokochi, Tomohiro, c/o DENSO CORPORATION ,  Miyake, Toshihiro, c/o DENSO CORPORATION ,  Takeuchi, Satoshi, c/o DENSO CORPORATION

IPC: H05K3/46 ,  H05K1/18

CPC classification number: H05K1/186 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05624

Abstract: A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Abstract translation: 具有嵌入式电装置（41）的印刷电路板（100）被制造如下。 具有上开口（35）具有凹部（82）的第一树脂薄膜（23）或一个薄片构件（81）与堆积第二树脂膜的多个（23），其上的导电层（22）多个是 形成。 第一和第二树脂薄膜（23）和片材构件（81）包括热塑性树脂。 一种电气设备（41）被插入在所述开口（35）或凹部中。 然后，堆积体包括所述电气装置（41）被按压，并加热至堆积体集成。 当加压和加热的堆积体，电极的电装置（41）的多个（42）电连接到导电层（22），而第一和第二树脂薄膜（23）和片材构件（81） 塑性变形，以密封所述电气装置（41）。

公开(公告)号：EP1237398A2

公开(公告)日：2002-09-04

申请号：EP01128913.9

申请日：2001-12-05

Applicant: JAPAN RADIO CO., LTD

Inventor： Abe, Shigetoshi, c/o Japan Radio Co., Ltd. ,  Kato, Tomoko, c/o Japan Radio Co., Ltd. ,  Sato, Yasuo, c/o Japan Radio Co., Ltd. ,  Itagaki, Takashi, c/o Japan Radio Co., Ltd. ,  Matsumoto, Kenji, c/o Japan Radio Co., Ltd.

IPC: H05K3/42 ,  H05K1/11

CPC classification number: H05K3/421 ,  H05K1/113 ,  H05K3/064 ,  H05K3/386 ,  H05K3/427 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2203/063 ,  H05K2203/1394 ,  Y10T29/49156 ,  Y10T29/49213 ,  Y10T29/49218

Abstract: A method includes the steps of forming a first metal foil (82) on a surface of an insulator substrate (1a), drilling, with a thermosetting resin film (84) temporarily fixed to an opposite surface of the substrate, a through hole (86) simultaneously in the first foil, the substrate, and the resin film, simultaneously heating and vacuum-pressing the first foil, the substrate, the resin film, and a second metal foil (87) brought into contact with the resin film to obtain an intermediate board in which a bottom of the through hole is covered with the second foil and has a corner with a corner rounded portion (93) formed by the resin film, and forming a metal plating layer (95) on the first and the second foils, on the bottom and an inner wall of the through hole, and on the corner rounded portion to obtain a final printed wiring board.

公开(公告)号：EP1220591A2

公开(公告)日：2002-07-03

申请号：EP01130722.0

申请日：2001-12-21

Applicant: Denso Corporation

Inventor： Yazaki, Yoshitaro ,  Shiraishi, Yoshihiko ,  Kondo, Koji ,  Harada, Toshikazu ,  Yokochi, Tomohiro

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T428/24917

Abstract: A heated and pressed printed wiring board (100) is made by filling via-holes formed in layers of insulating film of the wiring board (100) with an interlayer conducting material. The insulating film is stacked with conductor patterns (22), and each conductor pattern (22) closes a via hole (24). The interlayer conducting material forms a solid conducting material (51, 52) in the via holes (24) after a heating a pressing procedure. The solid conducting material (51, 52) includes two types of conducting materials. The first type of conducting material (51) includes a metal, and the second type of conductive material (52) includes an alloy formed by the metal and conductor metal of the conductor patterns (22). The conductor patterns (22) are electrically connected reliably without relying on mere mechanical contact.

Abstract translation: 通过用层间导电材料填充布线板（100）的绝缘膜形成的通孔来制造加热压制印刷线路板（100）。 绝缘膜与导体图案（22）堆叠，并且每个导体图案（22）封闭通孔（24）。 层压导电材料在加压压制程序之后在通孔（24）中形成固体导电材料（51,52）。 固体导电材料（51,52）包括两种类型的导电材料。 第一类导电材料（51）包括金属，第二类导电材料（52）包括由导体图案（22）的金属和导体金属形成的合金。 导体图案（22）可靠地电连接，而不依赖于机械接触。

公开(公告)号：EP1220588A1

公开(公告)日：2002-07-03

申请号：EP00944386.2

申请日：2000-07-10

Applicant: IBIDEN CO., LTD.

Inventor： ENOMOTO, Ryo, Technology Research Group, R&D Op ,  KARIYA, Takashi, Technology Research Group, R&D Op ,  SAKAMOTO, Hajime, Electronics 2 Group, R&D Op

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4069 ,  H05K3/386 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: By filling a predetermined amount of conductive paste into an opening for forming a through hole or a VH formed in a resin insulating layer of a circuit board, and pressurizing the filled conductive paste under the condition of reduced pressure, removing air bubbles trapped in the conductive paste.

Abstract translation: 通过将预定量的导电浆料填充到用于形成在电路板的树脂绝缘层中的通孔或VH形成的开口中，并且在减压条件下对填充的导电糊进行加压，除去捕获在导电 糊。

公开(公告)号：EP1116420B1

公开(公告)日：2002-06-26

申请号：EP99952417.6

申请日：1999-08-16

Applicant: Infineon Technologies AG

Inventor： HACKE, Hans-Jürgen

IPC: H05K1/11 ,  G01R1/073 ,  G01R1/04

CPC classification number: G01R1/0735 ,  G01R31/2886 ,  H05K1/0393 ,  H05K1/112 ,  H05K3/326 ,  H05K2201/0394 ,  H05K2201/09472

Abstract: The present invention relates to a printed circuit plate (10) which is intended for testing electric components (20) having a plurality of connection contacts (21, 22) on their surfaces. The plate comprises an electrically isolated isolation layer (11) in which through-holes (12) are formed. The area about each through-hole (12) comprises a conductive contact pad (14) located on one surface of the isolation layer (11). A printed conductor (13) extends from each contact pad (14) mainly in the direction of an edge area in the isolation layer (11).

公开(公告)号：EP0390996B1

公开(公告)日：2002-01-16

申请号：EP89308034.1

申请日：1989-08-07

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Kodai, Syojiro c/o Kitaitami Seisakusho of ,  Ochi, Katsunori c/o Kitaitama Seisakusho of ,  Baba, Fumiaki c/o Zairyo Kenyusho of

IPC: H01L21/56 ,  H01L23/31 ,  G06K19/06 ,  H01L23/28 ,  H01L23/48 ,  H05K5/06

CPC classification number: G06K19/07747 ,  G06K19/07745 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/49855 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/0394 ,  H05K2201/10977 ,  H05K2203/1316 ,  H01L2924/00014

公开(公告)号：EP1155602A1

公开(公告)日：2001-11-21

申请号：EP00910519.8

申请日：2000-02-01

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： LOIBL, Josef ,  HAUPT, Detlef ,  FRANZEN, Frank

IPC: H05K3/32 ,  H05K3/34

CPC classification number: H05K3/328 ,  H01R12/59 ,  H01R43/0221 ,  H05K1/118 ,  H05K1/189 ,  H05K3/281 ,  H05K3/3447 ,  H05K3/3494 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2203/107

Abstract: The invention relates to a method for producing an electrical connection between a flexible printed circuit (1) and a metallic contact partner (8). According to said method, an irradiation opening (5) is produced in a first insulating layer (2) and a connecting opening (6) is produced in a second insulating layer (3). A section (8a) of the metallic contact partner (8) is contacted with a strip conductor (4) through the connecting opening (6). The strip conductor (4) is welded/soldered at the connecting section (8a) through the irradiation heat produced by the laser light (9) which is directed through the irradiation opening (5).