公开(公告)号：EP2229040A1

公开(公告)日：2010-09-15

申请号：EP10001097.4

申请日：2010-02-03

Applicant: EUROCOPTER

Inventor： Imbert, Nicolas ,  Chuc, Charles

IPC: H05K1/00 ,  H01H69/02 ,  H01H85/046 ,  H01L21/48

CPC classification number: H01L21/4867 ,  H01H69/022 ,  H01H85/046 ,  H05K1/0293 ,  H05K3/1216 ,  H05K2201/099 ,  H05K2201/10181 ,  H05K2203/1453

Abstract: La présente invention concerne un procédé pour lier électriquement un premier et un deuxième éléments électriquement conducteurs (1, 2) disposés sur un support (3) à l'aide d'une connexion (10) comportant un produit électriquement conducteur étant liquide lors de son application et solide postérieurement à ladite application. Lors d'une phase de préparation, on appose par sérigraphie au moins une couche de vernis (4, 5) afin de réaliser un espace de confinement (11) de ladite connexion (10) allant de ladite première extrémité (1') à ladite deuxième extrémité (2'). Ensuite, lors d'une phase de finition, on applique par sérigraphie le produit électriquement conducteur pour le disposer dans l'espace de confinement (11).

Abstract translation: 该方法包括利用用于连接到端（1“）的导电元件（1）在端部（2”）的另一导电元件的连接。 上的导电元件和支撑组件清漆层通过丝网印刷在一个准备阶段的时间，以实现端部之间的连接容纳空间固定。 导电产品即 导电墨，是在液体形式通过丝网印刷在完成阶段时施加在该空间中以沉积产品。

公开(公告)号：EP1887846A4

公开(公告)日：2010-08-11

申请号：EP06780770

申请日：2006-06-28

Applicant: IBIDEN CO LTD

Inventor： KAWAMURA YOICHIRO ,  SAWA SHIGEKI ,  TANNO KATSUHIKO ,  TANAKA HIRONORI ,  FUJII NAOAKI

IPC: H05K3/34 ,  H01L21/48 ,  H01L23/498 ,  H01L23/544

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2201/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

公开(公告)号：EP2187435A1

公开(公告)日：2010-05-19

申请号：EP09773081.6

申请日：2009-02-16

Applicant: Omron Corporation

Inventor： ONO, Kazuyuki ,  TANAKA, Yoshio ,  NAKAJIMA, Kiyoshi ,  KURATANI, Naoto ,  MAEKAWA, Tomofumi

IPC: H01L23/02 ,  H01L23/04

CPC classification number: H05K3/341 ,  H01L23/055 ,  H01L23/10 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/1632 ,  H01L2924/3025 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10371 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package for storing a semiconductor element mounted on an upper surface of a substrate (52) is configured by a substrate (52) and a conductive cap (54). A grounding electrode (57) is annularly formed on an upper surface outer circumferential section of the substrate (52). An upper surface of an inner circumferential section of the grounding electrode (57) is covered with a solder resist (67). On an outer circumference lower end surface of the conductive cap (54), a flange (70) substantially horizontally bent is formed. The conductive cap (54) is arranged on the upper surface of the substrate (52), and a lower surface of the flange (70) is permitted to abut to an upper surface of the solder resist (67). Furthermore, on a further outer circumferential side from the solder resist (67), a space formed between the lower surface of the flange (70) and the grounding electrode (57) is filled with a conductive bonding member (73), and the conductive cap (54) is bonded to the substrate (52).

Abstract translation: 用于存储安装在基板（52）的上表面上的半导体元件的封装由基板（52）和导电盖（54）构成。 接地电极（57）环形地形成在基板（52）的上表面外周部分上。 接地电极（57）的内周部的上表面被阻焊剂（67）覆盖。 在导电盖（54）的外周下端面上形成大致水平弯曲的凸缘（70）。 导电盖（54）布置在基板（52）的上表面上，并且凸缘（70）的下表面被允许邻接阻焊剂（67）的上表面。 此外，在阻焊剂（67）的另外的外周侧，在凸缘（70）的下表面和接地电极（57）之间形成的空间填充有导电性接合部件（73），导电性 帽（54）结合到基底（52）上。

公开(公告)号：EP1880587B1

公开(公告)日：2008-08-13

申请号：EP06742333.5

申请日：2006-05-12

Applicant: Conti Temic microelectronic GmbH

Inventor： FRIEDRICH, Ferdinand ,  TRAGESER, Hubert ,  SCHUCH, Bernhard ,  NEHMEIER, Friedrich

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10166

Abstract: Disclosed is a printed circuit board (1) comprising a top face (2) for positioning an electronic component. A bottom face (4) of the circuit board (1) is used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) create heat transfer from the top face (2) to the bottom face (4). Said heat transfer holes (12) are irregularly distributed on the top face (2) in such a way that the top face (2) is provided with several free sectors (14) which are free from heat transfer holes (12) in order to connect the electronic component to the circuit board (1). The free sectors (14) are arranged in columns or lines. A plurality of heat transfer holes (12) are placed at least along the long sides of the free sectors (14). The inventive circuit board is provided with low thermal resistance between the electronic component and the heat-dissipating base.

公开(公告)号：EP1940207A2

公开(公告)日：2008-07-02

申请号：EP07122615.3

申请日：2007-12-07

Applicant: ROBERT BOSCH GMBH

Inventor： Klein, Christian ,  Finzer, Guido ,  Haalboom, Thomas ,  Haiss, Eberhard

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: Es wird eine elektrische Vorrichtung mit einem Trägerelement (11), insbesondere einer Leiterplatte, vorgeschlagen. Diese Vorrichtung weist zumindest eine auf dem Trägerelement (11) angeordnete Anschlussfläche (16) auf, die zur Kontaktierung eines Bauelements (50) dient. Die Öffnung ist dadurch gekennzeichnet, dass die benetzbare Anschlussfläche (16) jeweils aus zumindest zwei Teilflächen (28, 31) besteht, wobei eine der Teilflächen (28) schmaler als die andere Teilfläche (31) ist.

Abstract translation: 的装置（10）具有一个承载单元（11），即 印刷电路板，包括在载体单元和用于接触部件布置在连接表面（16）。 连接表面是可润湿的有焊料，并具有两个部分表面（28，31）。 所述部分表面（28）比所述局部表面（31）更窄。 的通道表面（34）为梯形和部分表面之间布置。 连接表面是在与海誓山盟布置在角。

公开(公告)号：EP1887846A1

公开(公告)日：2008-02-13

申请号：EP06780770.1

申请日：2006-06-28

Applicant: IBIDEN CO., LTD.

Inventor： KAWAMURA, Yoichiro ,  SAWA, Shigeki ,  TANNO, Katsuhiko ,  TANAKA, Hironori ,  FUJII, Naoaki

IPC: H05K3/34 ,  H01L21/60 ,  H05K3/28

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2201/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad.
In the printed wiring board, since the at least one conductor pad is aligned at a pitch of 200 µm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is within a range of 1.05 to 1.7, connection reliability and insulation reliability can be easily improved.

Abstract translation: 本发明提供一种印刷线路板，其特征在于，具有至少具备一个导体电路的布线基板，设置在该布线基板的表面上的阻焊层，至少一个导体焊盘，该导体焊盘由从设置于该焊料的开口露出的导体电路的一部分形成 抗蚀剂层和用于将电子部件安装在导体焊盘上的至少一个焊料凸块。 在印刷线路板中，由于至少一个导体焊盘以200μm或更小的间距排列，并且焊料凸点的直径W与形成于其中的开口的开口直径D的比率（W / D） 阻焊层在1.05至1.7的范围内，可以容易地改善连接可靠性和绝缘可靠性。

公开(公告)号：EP1824911A1

公开(公告)日：2007-08-29

申请号：EP05854264.8

申请日：2005-12-14

Applicant: EASTMAN CHEMICAL COMPANY

Inventor： PECORINI, Thomas, Joseph ,  MCWILLIAMS, Douglas, Stephens ,  GILLIAM, Spencer, Allen ,  TINCHER, Mark, Elliott ,  TANNER, Candace, Michele

IPC: C08J5/18

CPC classification number: H05K1/0326 ,  C08J5/18 ,  C08J2367/02 ,  H05K1/0393 ,  H05K1/116 ,  H05K3/281 ,  H05K3/386 ,  H05K3/429 ,  H05K2201/0145 ,  H05K2201/0969 ,  H05K2201/099 ,  Y10T428/1086 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31786

Abstract: Disclosed is a biaxially-oriented polyester film produced from a polyester comprising: (1) diacid residues comprising between about 95 and about 100 mole percent of terephthalic acid residues; (2) diol residues comprising between about 95 and about 100 mole percent of 1,4-­cyclohexanedimethanol residues; and (3) about 0.5 to about 5 mole percent of another dicarboxylic acid or diol residue, wherein the polyester comprises a total of 100 mole percent diacid residues and a total of 100 mole percent diol residues. In one embodiment, the biaxially-oriented film has a thickness of 70 to 150 microns (3-5 mils). In another embodiment, the biaxially-oriented film undergoes not more than 3% shrinkage when immersed for 10 seconds in a solder bath preheated to 260°C. The film can be made by stretching an essentially amorphous cast-film of thickness between about 450-1800 micron (18-70 mil) at a ratio from about 2.5x2.5 to 3.5x3.5 while being held at a temperature between 90°C and 130°C, and heat-setting the stretched film at an actual film temperature of from 260°C to Tm, where Tm is the melting point of the polyester as measured by differential scanning calorimetry (DSC), while maintaining the dimensions of the stretched film.

公开(公告)号：EP1778000A3

公开(公告)日：2007-07-25

申请号：EP07000259.7

申请日：1998-12-24

Applicant: IBIDEN CO., LTD.

Inventor： Shirai, Seiji ,  Shimada, Kenichi ,  Asai, Motoo

IPC: H05K3/46

CPC classification number: H05K3/4644 ,  H05K1/113 ,  H05K1/115 ,  H05K3/184 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/381 ,  H05K3/384 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/099

Abstract: The present invention relates to a multilayer printed wiring board (400) incorporating interlaminer resin insulating layers (40,60) and conductor circuits (34,52,72) such that said interlaminer resin insulating layers and said conductor circuits are alternately stacked, said multilayer printed wiring board comprising: solder bumps (88U,88D) formed on a conductor circuit (72) formed on an outermost interlaminer resin insulating layer (60); and solder bumps (88U) formed on a via hole (70) formed by enclosing metal in an opening formed in said outermost interlaminer resin insulating layer.

Abstract translation: 本发明涉及一种多层印刷线路板（400），其包含层间树脂绝缘层（40,60）和导体电路（34,52,72），使得所述层间树脂绝缘层和所述导体电路交替堆叠，所述多层 印刷电路板，包括：在形成于最外层的层间树脂绝缘层（60）上的导体电路（72）上形成的焊料凸点（88U，88D）; 以及在形成于所述最外层的层间树脂绝缘层中的开口中封入金属而形成的通孔（70）上形成的焊料凸块（88U）。

公开(公告)号：EP1763297A1

公开(公告)日：2007-03-14

申请号：EP06254646.0

申请日：2006-09-06

Applicant: SONY CORPORATION

Inventor： Matsuda, Yoshinari c/o Sony Corporation

IPC: H05K3/34

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed circuit board is disclosed on which a pattern can be formed by screen printing that is suitable for mounting a small part of the 1005 size or less. The printed circuit board includes a pair of soldering lands opposed to each other such that a mounted part having a pair of electrodes on the opposite ends thereof is soldered thereto. A wiring line is connected to each soldering land, and resist covers the wiring lines. The insulating element has openings formed so as to expose the soldering lands therethrough. Wiring line connection elements are formed so as to be connected to the pads only on the opposing side of the pads. Each opening has an edge positioned on the outer side of the corresponding pad and on the inner side of the corresponding wiring line connection element.

Abstract translation: 公开了一种印刷电路板，其上可以通过丝网印刷形成图案，该印刷电路板适用于安装1005或更小的小部分。 印刷电路板包括彼此相对的一对焊接区，使得在其相对端部上具有一对电极的安装部分被焊接到其上。 布线连接到每个焊接区，并且抗蚀剂覆盖布线。 绝缘元件具有形成的开口，以暴露焊接区。 布线连接元件形成为仅在焊盘的相对侧上连接到焊盘。 每个开口具有位于相应的焊盘的外侧上和相应的布线连接元件的内侧上的边缘。

公开(公告)号：EP1761115A2

公开(公告)日：2007-03-07

申请号：EP06018262.3

申请日：2006-08-31

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Arai, Koji Shinko Electric Industries Co. Ltd. ,  Kikuchi, Tomofumi Shinko Electric Ind. Co. Ltd ,  Maruyama, Atsushi Shinko Electric Ind. Co. Ltd. ,  Wakabayashi, Hideyuki Shinko Electric Ind. Co. Ltd

IPC: H05K1/11

CPC classification number: H05K3/243 ,  H01L2224/13 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0191 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/0571 ,  H05K2203/1476

Abstract: The invention is characterized in a printed wiring board having a wiring pattern 14 including a pad for mounting a solder ball as a connection terminal, wherein
the pad 20 is constituted by laminating a conductive layer constituting the wiring pattern, a lower layer plating layer, and an upper layer plating layer in this order;
an immediate vicinity region 34 surrounding the pad is constituted by laminating the conductive layer, at least the lower layer plating layer in the lower layer plating layer and the higher layer plating layer, and a solder resist layer in the order;
a thickness of the upper layer plating layer is a thickness negligible in comparison with respective thicknesses of the lower layer plating layer and the upper layer plating layer; and
a height of an upper face of the pad does not exceed a height of an upper face of the immediate vicinity region.

Abstract translation: 本发明的特征在于具有布线图案14的印刷布线板，该布线图案14包括用于安装焊球的焊盘作为连接端子，其中焊盘20通过层压构成布线图案的导电层，下层镀层和 上层电镀层依次; 通过将导电层，至少下层镀层中的下层镀层和上层镀层以及阻焊层依次层叠来构成围绕焊盘的紧邻区域34; 上层镀层的厚度与下层镀层和上层镀层的厚度相比可以忽略不计; 并且垫的上表面的高度不超过紧邻区域的上表面的高度。