公开(公告)号：EP2731133A2

公开(公告)日：2014-05-14

申请号：EP13191022.6

申请日：2013-10-31

申请人： Delta Electronics, Inc.

发明人： Tsai, Hsin-Chang ,  Lee, Chia-Yen ,  Lee, Peng-Hsin

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L21/268 ,  H01L21/2885 ,  H01L21/76834 ,  H01L21/76879 ,  H01L21/76895 ,  H01L23/481 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/91 ,  H01L25/074 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0332 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/73221 ,  H01L2224/73255 ,  H01L2224/73257 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/13064 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A method of forming an interconnection structure is disclosed, including providing a substrate having a first side and a second side opposite to the first side, forming a via hole through the substrate, wherein the via hole has a first opening in the first side and a second opening in the second side, forming a first pad covering the first opening, and forming a via structure in the via hole subsequent to forming the first pad, wherein the via structure includes a conductive material and is adjoined to the first pad.

摘要翻译： 公开了一种形成互连结构的方法，包括提供具有第一侧和与第一侧相对的第二侧的基板，通过基板形成通孔，其中通孔在第一侧具有第一开口， 在所述第二侧上形成第二开口，形成覆盖所述第一开口的第一焊盘，以及在形成所述第一焊盘之后在所述通孔中形成通孔结构，其中所述通孔结构包括导电材料并与所述第一焊盘邻接。

公开(公告)号：EP2706828A2

公开(公告)日：2014-03-12

申请号：EP13182978.0

申请日：2013-09-04

申请人： LSIS Co., Ltd.

发明人： Youn, Bo Hyun ,  Heo, Min

IPC分类号： H05K1/02 ,  H05K7/20 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L23/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/72 ,  H01L24/73 ,  H01L24/91 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/371 ,  H01L2224/40106 ,  H01L2224/40227 ,  H01L2224/732 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/014 ,  H05K1/0203 ,  H05K1/0215 ,  H05K3/301 ,  H05K3/3421 ,  H05K7/2049 ,  H05K2201/10409 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2224/84

摘要： Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB 300, a power semiconductor device 100 comprising a plurality of legs 110 electrically connected to a circuit pattern disposed on the PCB, a connection member 200 disposed above the power semiconductor device, the connection member being formed of an electrically conductive material, a main fixing unit 410 fixing the power semiconductor device to the PCB, and a housing disposed outside the PCB. Thus, a coupling force between the power semiconductor device and the PCB and electric efficiency may be improved to a heat generation amount. In addition, heat may be more quickly dissipated through the connection member to improve a cooling effect.

摘要翻译： 本发明提供一种功率半导体器件和印刷电路板（PCB）的连接组件。 功率半导体器件和印刷电路板（PCB）的联接组件包括PCB 300，其包括腿110电连接到设置在PCB上的电路图案的多个A功率半导体装置100，一个连接构件200的上方所设置的 功率半导体器件，所述连接构件被形成的导电材料，所述功率半导体器件固定到所述PCB中的主固定单元410，与PCB外面设置在壳体的。 因此，功率半导体器件和印刷电路板和电效率之间的联接力可被提高到发热量。 另外，热可以更快速地通过连接构件消散以改善冷却效果。

公开(公告)号：EP2295993B1

公开(公告)日：2014-03-05

申请号：EP10183958.7

申请日：2006-05-23

申请人： Allegro Microsystems, LLC

发明人： Doogue, Michael, C ,  Sharma, Nirmal ,  Gagnon, Jay ,  Dickinson, Richard

IPC分类号： G01R15/20 ,  H01L43/06

CPC分类号： G01R15/207 ,  G01R1/18 ,  G01R15/202 ,  H01L23/552 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP1791178B1

公开(公告)日：2012-03-07

申请号：EP06023090.1

申请日：2006-11-07

申请人： Semikron Elektronik GmbH & Co. KG Patentabteilung

发明人： Tauscher, Björn

IPC分类号： H01L23/48 ,  H01L25/07

CPC分类号： H01L25/072 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/91 ,  H01L2224/05599 ,  H01L2224/4813 ,  H01L2224/4846 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00

公开(公告)号：EP2148556A2

公开(公告)日：2010-01-27

申请号：EP09008709.9

申请日：2009-07-03

申请人： Semikron Elektronik GmbH & Co. KG Patentabteilung

发明人： Tobias, Fey ,  Göbl, Christian ,  Braml, Heiko ,  Hermann, Ulrich

IPC分类号： H05K3/32 ,  H01L21/60 ,  H01L23/482

CPC分类号： H05K3/321 ,  B23K20/16 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/72 ,  H01L24/73 ,  H01L24/91 ,  H01L25/072 ,  H01L2224/29 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16195 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2203/0278 ,  H05K2203/1163 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

摘要： Die Erfindung beschreibt ein Edelmetallverbindungsmittel mit einem Feststoffanteil und einem Flüssiganteil mit einem zugeordneten Mischungsverhältnis in Volumenprozent von 99,5:0,5 bis 80:20 der beiden. Hierbei weist der Feststoffanteil einen Volumenanteil an einer ersten Komponente Silber von 60% bis 99% und einen Volumenanteil an einer zweiten Komponente einem Element, das sich mit Sauerstoff in einer exothermen Reaktion verbindet und eine minimale Reaktionsenthalpie von 400kJ aufweist, von 1% bis 40% auf. Die Verwendung des Edelmetallverbindungsmittels dient der Ausbildung einer stoffschlüssigen Verbindung zweier metallischer Verbindungspartner, wobei die Ausbildung der Verbindung durch Wärmeeinwirkung erfolgt.

摘要翻译： 贵金属连接包括固体和液体组分，其混合比为99.5:0.5至80:20。 固体组分包含60-99体积％的银组分和1-40体积％的另一种液体组分。 固体组分包括长度尺寸为50-20μm的颗粒。 后一种组分是通过具有400千焦耳的最小反应焓的放热反应与氧结合的元素。

公开(公告)号：EP1891452B1

公开(公告)日：2009-09-16

申请号：EP06770974.1

申请日：2006-05-23

申请人： ALLEGRO MICROSYSTEMS INC.

发明人： TAYLOR, William P. ,  DOOGUE, Michael C. ,  SHARMA, Nirmal ,  GAGNON, Jay ,  MANGTANI, Vijay ,  DICKINSON, Richard ,  FRIEDRICH, Andreas, P.

IPC分类号： G01R15/20 ,  H01L43/06

CPC分类号： G01R15/207 ,  G01R1/18 ,  G01R15/202 ,  H01L23/552 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chip arrangement.

公开(公告)号：EP1988569A2

公开(公告)日：2008-11-05

申请号：EP07008553.5

申请日：2007-04-26

申请人： SIEMENS AKTIENGESELLSCHAFT

发明人： Birner, Martin ,  Kreutzer, Rainer ,  Wöllmer, Heinz, Dr.

IPC分类号： H01L21/60 ,  H01L21/607 ,  H01L23/49 ,  B23K20/10

CPC分类号： H01L24/01 ,  B23K20/12 ,  B23K2201/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/371 ,  H01L2224/37599 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2224/45099

摘要： Bei einem Verfahren zum Herstellen eines Anschlusskontaktes an einem Halbleiterbauelement (2) für die Leistungselektronik wird das Halbleiterbauelement (2) auf zumindest einer seiner Flachseiten (8, 12) mit einem Reibschweißverfahren mit einem metallischem Kontaktelement (22) verschweißt.

摘要翻译： 在一个过程，用于创建电源向半导体部件（2），金属接触部（22）是摩擦焊接到所述平坦的侧面（8）的半导体E.G. thrysistor。 在摩擦焊接过程通过超声波排放实现。 进一步声称是结合一个摩擦焊接接触的电子半导体装置。

公开(公告)号：EP1643625A1

公开(公告)日：2006-04-05

申请号：EP05018076.9

申请日：2005-08-19

申请人： HITACHI, LTD.

发明人： Hozoji, Hiroshi

IPC分类号： H02M7/00 ,  H01L23/495

CPC分类号： H02M7/003 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L24/95 ,  H01L25/072 ,  H01L2224/16245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/0401

摘要： The invention relates to an inverter which has a plurality of arms for conducting or cutting off a current and each arm has a switching device (SW) and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates (180), and one face of the switching device is fixed to the first wiring layer (182), and the second wiring layer (186) and the other face of the switching device are electrically connected by a lead-shaped conductor (LC), and the lead-shaped conductor (LC) has a first and a second connection, and the first connection (172) of the lead-shaped conductor (LC) is fixed to the other face of the switching device, and the second connection (170) of the lead-shaped conductor (LC) is fixed to the second wiring layer (186).
Thereby, a large current of the inverter (200) can be realized and the assembly capacity of the inverter (200) or the vehicle drive unit will be improved.

摘要翻译： 本发明涉及一种具有用于传导或切断电流的多个臂的逆变器，每个臂具有开关装置（SW）以及用于连接开关装置的第一和第二布线层。 每个臂的第一和第二布线层分别形成在绝缘基板（180）上，并且开关器件的一个面固定到第一布线层（182），第二布线层（186）和第二布线层 开关装置通过引线形导体（LC）电连接，并且引线形导体（LC）具有第一和第二连接，并且引线形导体（LC）的第一连接（172）是 固定到开关装置的另一面，并且引线形导体（LC）的第二连接（170）固定到第二布线层（186）。 由此，能够实现逆变器200的大电流化，能够提高逆变器200或车辆驱动装置的组装性。

公开(公告)号：EP1039541A1

公开(公告)日：2000-09-27

申请号：EP00110729.1

申请日：1996-10-24

申请人： Oki Electric Industry Co., Ltd.

发明人： Yamada, Shigeru, c/o Oki Electric Ind. Co., Ltd. ,  Uchida, Yasufumi, c/o Oki Electric Ind. Co., Ltd. ,  Murakami, Noriko, c/o Oki Electric Ind. Co., Ltd. ,  Shizuno, Yoshinori, c/o Oki Electric Ind. Co.,Ltd.

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/60 ,  H01L23/498 ,  H01L23/367

CPC分类号： H01L24/11 ,  H01L23/055 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having projections formed on the back thereof, with an organic dies bonding agent. Pads on the semiconductor chip, and inner leads are respectively electrically connected to one another by metal thin lines. These portions are sealed with a molding resin. Further, each inner lead extends to the outside of the molding resin and is processed into gull-wing form for substrate mounting. Moreover, the inner lead is processed by soldering so that an external terminal is formed. Thus, since the projections are provided on the back of the die pad, the back of a packing material is brought into point contact with that of the die pad as compared with the conventional face-to-face contact. It is therefore possible to minimize the transfer of organic substances from the packing material. Further, since such transfer that a reduction in adhesive property occurs in the back of the die pad, is greatly reduced, the adhesiveness between the upper surface of the die pad and the molding resin is improved, whereby the resistance of SMD to the reflow is enhanced.

摘要翻译： 根据本申请中公开的发明的典型发明，其中形成有电子电路的半导体芯片利用有机管芯结合剂固定到在其背面上形成有突起的引线框的管芯焊盘。 半导体芯片上的焊盘和内部引线分别通过金属细线彼此电连接。 这些部分用模制树脂密封。 此外，每个内引线延伸到模制树脂的外部并被加工成用于基板安装的鸥翼形式。 而且，通过焊接来处理内引线，从而形成外部端子。 因此，由于突起设置在管芯焊盘的背面，所以与传统的面对面接触相比，封装材料的背面与管芯焊盘的背面进行点接触。 因此可以使包装材料中的有机物质的转移最小化。 此外，由于在管芯焊盘背面发生粘合性降低的转移大大减少，因此管芯焊盘上表面和模制树脂之间的粘附性提高，由此SMD对回流焊的电阻是 增强。

公开(公告)号：EP1039538A1

公开(公告)日：2000-09-27

申请号：EP00110727.5

申请日：1996-10-24

申请人： Oki Electric Industry Co., Ltd.

发明人： Yamada, Shigeru, c/o Oki Electric Ind. Co., Ltd. ,  Uchida, Yasufumi, c/o Oki Electric Ind. Co., Ltd. ,  Murakami, Noriko, c/o Oki Electric Ind. Co., Ltd. ,  Shizuno, Yoshinori, c/o Oki Electric Ind. Co.,Ltd.

IPC分类号： H01L23/367 ,  H01L23/495 ,  H01L23/31 ,  H01L21/60 ,  H01L23/055 ,  H01L23/498

CPC分类号： H01L24/11 ,  H01L23/055 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having projections formed on the back thereof, with an organic dies bonding agent. Pads on the semiconductor chip, and inner leads are respectively electrically connected to one another by metal thin lines. These portions are sealed with a molding resin. Further, each inner lead extends to the outside of the molding resin and is processed into gull-wing form for substrate mounting. Moreover, the inner lead is processed by soldering so that an external terminal is formed. Thus, since the projections are provided on the back of the die pad, the back of a packing material is brought into point contact with that of the die pad as compared with the conventional face-to-face contact. It is therefore possible to minimize the transfer of organic substances from the packing material. Further, since such transfer that a reduction in adhesive property occurs in the back of the die pad, is greatly reduced, the adhesiveness between the upper surface of the die pad and the molding resin is improved, whereby the resistance of SMD to the reflow is enhanced.

摘要翻译： 。根据在本申请中的游离缺失发明盘的典型发明，与在半导体芯片上的电子电路形成于其中被固定到所述垫在有机此粘合剂形成在其背面，与引线框架具有突起。 在半导体芯片上的焊盘，并且内部引线分别电通过金属细线连接到彼此。 这些部分密封的模制树脂。 此外，每个内部引线延伸到模制树脂的外面，并加工成鸥翼形状为安装基板。 更上方，内引线通过焊接所以没有到外部端子被形成处理。 因此，由于设置在衬垫的背面突起，包装材料的背面被带入与所述管芯焊盘点接触那样与常规面 - 面接触相比的。 因此，可以最小化有机物质从包装材料的转移。 此外，由于搜索转印的确在发生在管芯焊盘的背面粘接性的降低，大大降低，管芯焊盘和所述模制树脂的上表面之间的密合性提高，由此SMD的电阻回流是 增强。