公开(公告)号：EP1878326A4

公开(公告)日：2010-11-03

申请号：EP06740704

申请日：2006-04-05

Applicant: FRAMATOME CONNECTORS INT

Inventor： MINICH STEVEN ,  SMITH STEPHEN B ,  MORLION DANNY

IPC: H05K1/00

CPC classification number: H01R12/737 ,  H01R12/716 ,  H01R12/724 ,  H01R13/6585 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/114 ,  H05K1/115 ,  H05K1/14 ,  H05K3/308 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09627 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10659

公开(公告)号：EP2216855A2

公开(公告)日：2010-08-11

申请号：EP10163786.6

申请日：2007-04-10

Applicant: ADC GmbH

Inventor： Hammond, Bernard Jr. ,  Murray, David P. ,  George, Ian R.

IPC: H01R13/719 ,  H01R24/04 ,  H04B3/32

CPC classification number: H01R13/6466 ,  H01R4/2416 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

Abstract translation: 本公开涉及一种电信插座，其包括具有用于接收插头的端口的壳体。 插座还包括多个接触弹簧，其适于当插头插入壳体的端口时与插头电接触，以及多个用于将插线端接到插座的导线终端触头。 千斤顶还包括将接触弹簧电连接到导线端接触点的电路板。 电路板包括用于减少插座处串扰的多区串扰补偿装置。

公开(公告)号：EP2207244A2

公开(公告)日：2010-07-14

申请号：EP09001669.2

申请日：2009-02-04

Applicant: ERNI Electronics GmbH

Inventor： Lappöhn, Jürgen

IPC: H01R24/12

CPC classification number: H05K1/0219 ,  H01R12/716 ,  H01R12/724 ,  H01R13/6585 ,  H05K1/0237 ,  H05K3/308 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: Die Erfindung betrifft einen mehrpoliger Steckverbinder (10a, 10b) zur Kontaktierung mit einer Multilayerplatine (40), der Signal-Kontakte (11a, 11b; 12a, 12b) aufweist, denen ein erstes und wenigstens ein zweites Abschirm-Kontaktelement (17a, 17b, 17a', 17b'; 18a, 18b, 18a', 18b') zugeordnet und benachbart zum Signal-Kontakt (11 a, 11 b; 12a, 12b) angeordnet sind. Der Steckverbinder (10a, 10b) zeichnet sich dadurch aus, dass zumindest auf der obersten Schicht (41) der Multilayerplatine (40) Ausnehmungen (54, 54', 54") vorgesehen sind, welche zur Aufnahme und Durchführung von wenigstens zwei Abschirm-Kontaktelementen (17a', 17b'; 18a, 18b) bemessen sind, die benachbarten Signal-Kontakten (11a, 11b; 12a, 12b) zugeordnet sind.

Abstract translation: 多极插头连接器（10b）具有信号触头（11b，12b）。 凹槽设置在多层板的上层上。 凹口限制了两个屏幕接触元件（17b'，18b）的接收和执行。

公开(公告)号：EP1816762B1

公开(公告)日：2010-03-17

申请号：EP06010831.3

申请日：2006-05-26

Applicant: OpNext Japan

Inventor： Kagaya, Osamu c/o Hitachi, Ltd. Intell. Prop. Office ,  Sasada, Michihide c/o Hitachi, Ltd. Intell. Prop. Office

IPC: H04B10/158 ,  H03F1/00 ,  H05K1/14

CPC classification number: H04B10/66 ,  H03F3/087 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/147 ,  H05K2201/09236 ,  H05K2201/10022 ,  H05K2201/10121

公开(公告)号：EP2152049A1

公开(公告)日：2010-02-10

申请号：EP08305459.3

申请日：2008-08-08

Applicant: Alcatel Lucent

Inventor： Peron, Daniel ,  Geffroy, Pascal ,  Grimaud, Jean-Yves

IPC: H05K1/02

CPC classification number: H05K1/0245 ,  H01P3/026 ,  H05K1/0228 ,  H05K2201/09236

Abstract: The invention concerns a system (10) for transmitting differential signals, characterized in that it comprises at least a first and a second pairs of electrically conductive paths (12 -15), at least a path (13; 14) of the first pair being arranged between the paths (12, 14; 13, 15) of the second pair.

Abstract translation: 本发明涉及用于传送差分信号的系统（10），其特征在于，其包括至少第一对和第二对导电路径（12-15），所述第一对的至少一个路径（13; 14）是 布置在第二对的路径（12,14; 13,15）之间。

公开(公告)号：EP2037722A3

公开(公告)日：2010-01-27

申请号：EP08006205.2

申请日：2008-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kim, Kwan-Ho ,  Jang, Ick-Kyu ,  Myeong, Ji-Man

IPC: H05K1/00 ,  H05K1/03 ,  H05K9/00

CPC classification number: H05K1/0219 ,  G09G3/3696 ,  G09G2330/06 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/09672 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49156

Abstract: A printed circuit board ("PCB") includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise.

公开(公告)号：EP1909543A3

公开(公告)日：2009-12-16

申请号：EP07117054.2

申请日：2007-09-24

Applicant: NITTO DENKO CORPORATION

Inventor： Hu, Szu-Han ,  Ho, Voon Yee ,  McCaslin, Martin John ,  Yamazaki, Hiroshi

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/0219 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09563 ,  H05K2201/09809

Abstract: A wired circuit board (1) has an insulating layer (2) extending in a longitudinal direction, a conductive layer (3) having a plurality of signal wirings (4) covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals (5) provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer (7) covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit (8) along the longitudinal direction is formed between each of the signal wirings in the insulating layer.

公开(公告)号：EP2031944A4

公开(公告)日：2009-12-09

申请号：EP08704242

申请日：2008-01-31

Applicant: NIPPON MEKTRON KK

Inventor： TOYOSHIMA RYOICHI

IPC: H05K1/02

CPC classification number: H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09272

公开(公告)号：EP1232540B1

公开(公告)日：2009-10-28

申请号：EP99962856.3

申请日：1999-11-24

Applicant: Amphenol Corporation

Inventor： COHEN, Thomas, S. ,  GAILUS, Mark, W. ,  STOKOE, Philip, T.

IPC: H01R12/16 ,  H01R12/18 ,  H01R24/00

CPC classification number: H01R12/724 ,  H01R12/727 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6587 ,  H01R24/44 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189

公开(公告)号：EP2086293A1

公开(公告)日：2009-08-05

申请号：EP08254167.3

申请日：2008-12-29

Applicant: Hon Hai Precision Industry Co., Ltd.

Inventor： Lin, Yu-Hsu ,  Wu, Jeng-Da ,  Chao, Chih-Hang

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0366 ,  H05K1/0245 ,  H05K1/0248 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09281

Abstract: A printed circuit board includes a base (40) and a signal trace (47) formed on the base. The signal trace includes a plurality of straight line segments (C1,C2,C3,C4) parallel to the first fibers (41). The signal trace is formed on the base in such a manner that the line segments partially superpose the first fibers (41) and partly superpose gap between adjacent first fibers.

Abstract translation: 印刷电路板包括基座（40）和形成在基座上的信号迹线（47）。 信号迹线包括平行于第一光纤（41）的多个直线段（C1，C2，C3，C4）。 信号迹线以这样的方式形成在基座上，即线段部分地叠置第一光纤（41）并部分地叠置相邻第一光纤之间的间隙。