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    Interconnect board, printed circuit board unit, and method
    81.
    发明公开
    Interconnect board, printed circuit board unit, and method 审中-公开
    互连板，印刷电路板单元和方法

    公开(公告)号：EP2312920A3

    公开(公告)日：2011-06-22

    申请号：EP10179078.0

    申请日：2010-09-23

    Applicant: FUJITSU LIMITED

    Inventor： Koide, Masateru ,  Mizutani, Daisuke

    IPC: H05K1/14 ,  H05K3/36 ,  H01L23/498 ,  H05K3/00

    CPC classification number: H05K1/141 ,  H01L23/142 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/445 ,  H05K2201/10378 ,  H05K2201/10477 ,  H01L2224/0401

    Abstract: An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a conductive plate including a connection terminal to be electrically connected to a power supply terminal or a ground terminal of each of the first circuit board and the second circuit board, an insulating member wrapping the conductive plate except for the connection terminal, and a conductive member penetrating the insulating member to electrically connect a signal terminal of the first circuit board to a signal terminal of the second circuit board.

    Abstract translation: 1。一种互连板，用于互连并布置在第一电路板和第二电路板之间，所述互连板包括导电板，所述导电板包括与所述第一电路板中的每一个的电源端子或接地端子电连接的连接端子，以及 所述第二电路板，除所述连接端子之外的包覆所述导电板的绝缘构件以及贯穿所述绝缘构件以将所述第一电路板的信号端子电连接到所述第二电路板的信号端子的导电构件。

    A METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE
    86.
    发明公开
    A METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE 有权
    方法用于制造电子组件; 电子模块盖和衬底

    公开(公告)号：EP2010452A2

    公开(公告)日：2009-01-07

    申请号：EP07735462.9

    申请日：2007-04-11

    Applicant: NXP B.V.

    Inventor： WEEKAMP, Johannes, W. ,  SLOB, Cornelis ,  SCHEER, Jacob, M. ,  VAN STRATEN, Freerk, E.

    IPC: B81C1/00

    CPC classification number: B81C1/00833 ,  B81C1/00269 ,  B81C2203/035 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49117

    Abstract: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; -providing an electronic component (10) having a first pattern with a substantially closed configuration; -providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; -providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; -disposing solder material at the solder pad; -positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; -reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

    POWER LED TYPE LIGHTING OR LIGHT SIGNALING DEVICE
    87.
    发明公开
    POWER LED TYPE LIGHTING OR LIGHT SIGNALING DEVICE 审中-公开
    LEISTUNGS-LED-BELEUCHTUNGS- ODER- LICHTSIGNALISIERUNGSEINRICHTUNG

    公开(公告)号：EP1941786A1

    公开(公告)日：2008-07-09

    申请号：EP05802256.7

    申请日：2005-09-27

    Applicant: Immobiliare Eder S.R.L.

    Inventor： CUCCHI, Mauro ,  INCERTI, Edda

    IPC: H05K1/18

    CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V19/0055 ,  F21V23/002 ,  F21Y2103/33 ,  F21Y2115/10 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10477 ,  H05K2201/1056

    Abstract: The device is of the type comprising: - a laminate (6, 30, 38, 54, 57, 60, 64, 79, 91, 109, 127) with a printed circuit; - at least one power LED (1, 16, 56, 59, 62, 63, 78, 89, 90, 107, 108, 125, 126) comprising a main body (4, 144) with two electrical terminals (3, 35, 44, 47) protruding from this, connected to such printed circuit, and with a slug (5, 20, 29, 37,49, 53) on one side acting as heat sink for dispersion of heat; - a metallic body (9, 22, 33, 42, 67, 82, 96, 114, 132) where such slug is connected indirectly in order to permit such dispersion of heat, such metallic body having a flat face parallel and opposed to such laminate and on which the laminate is fastened; and is characterized by the fact that: - the LED is not outside the laminate of the printed circuit but is inserted in the same through a hole (7, 31, 39, 65, 80, 92, 93, 110, 111, 128, 129) present in the printed circuit; - the aforesaid face is covered, at least at a position opposite to the aforesaid LED, by a thin layer (8, 32, 41, 66, 81, 94, 95, 112, 113, 130, 131) of insulating material in contact with such slug, to assure not only electrical insulation but also thermal coupling with the slug; - the edges of such hole, pressing on the body of the LED, maintain the aforesaid slug in contact with such thin layer of insulating material.

    Abstract translation: 该装置的类型包括：具有印刷电路的层压板（6,30,38,54,57,60,64,79,91,109,127）; - 至少一个功率LED（1,16,56,59,62,63,78,89,90,107,108,125,126,126）包括具有两个电端子（3,35）的主体（4,144） ，44,47），连接到这种印刷电路，并且在作为用于散热的散热器的一侧上的芯块（5,20,29,37,49,53）上; - 金属体（9,22,33,42,67,82,96,114,132），其中这样的塞子间接连接以允许这种热分散，这样的金属体具有平行并与之相对的平面 层压板，并在其上固定层压板; 并且其特征在于：LED不在印刷电路层叠体的外部，而是通过孔（7,31,39,65,80,92,93,110,111,128， 129）存在于印刷电路中; - 至少在与上述LED相对的位置处，上述面被接触绝缘材料的薄层（8,32,31,66,81,94,95,112,113,130,131）覆盖 具有这种块状物，以确保不仅电绝缘，而且确保与块塞的热耦合; - 这种孔的边缘压在LED的主体上，保持上述的块与这种绝缘材料薄层接触。

    Small and securely-soldered electronic unit
    89.
    发明公开
    Small and securely-soldered electronic unit 审中-公开
    小和安全，焊接电子单元

    公开(公告)号：EP1416778A3

    公开(公告)日：2006-10-11

    申请号：EP03256881.8

    申请日：2003-10-30

    Applicant: ALPS ELECTRIC CO., LTD.

    Inventor： Yatsu, Hiroyuki

    IPC: H05K1/14 ,  H05K3/34

    CPC classification number: H05K1/184 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/10477 ,  H05K2201/10727 ,  Y02P70/613

    Abstract: An electronic unit includes a module (1) in which a semiconductor device (3) is attached on the bottom of a circuit board (2) and which has lands (4) provided on the bottom of the circuit board, and a printed circuit board (5) on which the module is mounted, the printed circuit board having a hole (5a) in a position facing the semiconductor device and having electrical conductors (6) to which the lands are soldered. The module is mounted on the printed circuit board by soldering the lands to the electrical conductors while the semiconductor device is disposed in the hole. Accordingly, the electronic unit is smaller in height than conventional electronic units. Such a structure allows the module to be surface-mounted on the printed circuit board with solder paste, and thus high productivity of the electronic unit can be achieved.

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