公开(公告)号：EP0792517A4

公开(公告)日：1998-06-24

申请号：EP95941408

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 探针卡组件（500）包括探针卡（502）和具有安装到其表面上的端子（522）并且在其表面上从端子（522）延伸的弹性接触结构（524）的空间变换器（506）。 插入器（504）设置在空间变换器和探针卡之间。 空间变压器和插入器堆叠在探针卡上，并且可以布置弹性接触结构以优化整个晶片的探测。

公开(公告)号：EP0792462A4

公开(公告)日：1997-12-29

申请号：EP95939968

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 探针卡组件（500）包括探针卡（502）和具有安装到其表面上的端子（522）并且在其表面上从端子（522）延伸的弹性接触结构（524）的空间变换器（506）。 插入器（504）设置在空间变换器和探针卡之间。 空间变压器和插入器堆叠在探针卡上，并且可以布置弹性接触结构以优化整个晶片的探测。

公开(公告)号：EP0792463A4

公开(公告)日：1998-06-24

申请号：EP95940718

申请日：1995-11-15

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/06 ,  B23K1/00 ,  B23K20/00 ,  B32B15/08 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/52 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 °C, and can be completed in less than 60 minutes.

Abstract translation: 本发明提供一种在从半导体晶片分离之前测试半导体器件（702,704）的方法。 所述方法包括以下步骤：将驻留在半导体晶片上的至少一个半导体器件（702,704）上的多个弹性接触结构（708）直接固定到多个第一端子上，每个所述弹性接触结构 具有尖端并从半导体器件的表面延伸; 将具有多个第二端子（712）的衬底（710）推向半导体器件的表面以实现弹性接触结构的相应的第二端子和尖端之间的多个电连接; 并向衬底的第二端提供信号以锻炼半导体器件。

公开(公告)号：EP0795200A4

公开(公告)日：1997-11-12

申请号：EP95939966

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 弹性接触结构从支撑基板的顶表面延伸，并且焊球（或其它合适的）接触结构设置在支撑基板的底表面上。 互连元件（110）被用作弹性接触结构并被设置在支撑基板上。 在支撑基板顶上的弹性接触结构中选定的弹性接触结构经由支撑基板连接到支撑基板的底表面上的对应的接触结构。 在旨在接收LGA型半导体封装（304）的实施例中，利用大致垂直于支撑衬底的顶表面的接触力在半导体封装的弹性接触结构和外部连接点之间形成压力接触（ 302）。 在旨在接收BGA型半导体封装（404）的实施例中，利用大致平行于支撑衬底的顶表面的接触力在半导体封装的弹性接触结构和外部连接点之间形成压力接触（ 402）。