公开(公告)号：EP0978729A3

公开(公告)日：2002-03-20

申请号：EP99306230.6

申请日：1999-08-05

申请人： Hitachi, Ltd.

发明人： Sekine, Kenji ,  Kondoh, Hiroshi ,  Kamozaki, Keigo ,  Nagaishi, Hideyuki ,  Matsuura, Kazuo ,  Nakazawa, Terumi ,  Tanimoto, Michio ,  Sasaki, Hideaki ,  Taniguchi, Yuzo

IPC分类号： G01S7/03 ,  G01S13/93

CPC分类号： H01L23/66 ,  G01S7/03 ,  G01S7/032 ,  G01S2013/9325 ,  H01L24/48 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01Q1/3233 ,  H01Q21/0087 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A high-frequency transmitter-receiver apparatus includes a transceiver circuit (10) realized in a planar structure by a dielectric substrate (3) and a semiconductor chip (4) and a planar antenna (7) formed on a dielectric substrate (2) are provided on front and rear surfaces, respectively, of a single electrically conductive base plate (1). Signal lines of the planar circuit and the planar antenna are electrically interconnected by a coaxial line (106-1, 106-2).

公开(公告)号：EP0276940A3

公开(公告)日：1990-05-30

申请号：EP88300399.8

申请日：1988-01-19

申请人： HITACHI, LTD.

发明人： Tanimoto, Michio ,  Ozawa, Masakazu ,  Okamoto, Michio ,  Yasuda, Hajime

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/83805 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/48824 ,  H01L2924/01204 ,  H01L2224/83205 ,  H01L2924/07025 ,  H01L2924/0541 ,  H01L2924/05432

摘要： A resin-encapsulated integrated circuit has a semiconductor chip (2) whose bonding pads (2A) are connected to corresponding leads (3A) by wires (4). In order to achieve the correct interconnection of pads (2A) and leads (3A) some of the wires (4) intersect and to prevent short circuits they are coated in an insulator. This permits great design versatility as the pads and leads may be positioned as desired, rather than having inter­connected pads and leads adjacent each other, as is normal. The use of insulated wires also permits one or more of the bonding pads to be central on the chip rather than at its periphery, and some of the pads may be connected to remote leads.

摘要翻译： 树脂封装集成电路具有半导体芯片（2），其接合焊盘（2A）通过导线（4）连接到相应的引线（3A）。 为了实现焊盘（2A）和引线（3A）的正确互连，一些电线（4）相交并且防止短路，它们被涂覆在绝缘体中。 这样可以很好地设计通用性，因为焊盘和引线可以根据需要进行定位，而不是正常地将互连的焊盘和引线彼此相邻。 绝缘电线的使用还允许一个或多个焊盘在芯片上而不是在其周边处是中心的，并且一些焊盘可以连接到远程引线。

公开(公告)号：EP0355955A3

公开(公告)日：1991-12-27

申请号：EP89305884.2

申请日：1989-06-12

申请人： HITACHI, LTD. ,  HITACHI MICROCOMPUTER SYSTEM LTD.

发明人： Okikawa, Susumu ,  Watanabe, Hiroshi ,  Tanimoto, Michio ,  Homma, Makoto ,  Kaneda, Tsuyoshi ,  Koike, Shunji ,  Nishita, Takafumi 202 Hitachimaikon

IPC分类号： H01B3/30 ,  H01B13/16 ,  H01L23/49 ,  H01L21/60 ,  H01L23/29

CPC分类号： H01L24/85 ,  H01L21/56 ,  H01L23/4952 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/745 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/745 ,  H01L2224/78251 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/7865 ,  H01L2224/83805 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85948 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/01004 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/48824 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2224/83205 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/0675 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor integrated circuit device (2) in which wire bonding is applied by using a bonding wire (5) having heat resistant polyurethane coating (5B), a semiconductor integrated circuit device applied with bonding by way of a coated wire and encapsulated with a resin composition (6) of a low heat expansion coefficient, and a semiconductor integrated circuit device free from disconnection and damage to the coated wire by applying chamfering to a chip, etc.

摘要翻译： 一种半导体集成电路器件（2），其中通过使用具有耐热聚氨酯涂层（5B）的接合线（5）施加引线接合，半导体集成电路器件通过涂覆线施加粘合并被树脂封装 具有低热膨胀系数的组成（6），以及通过对芯片等进行倒角而没有断开和损坏涂层线的半导体集成电路装置。

公开(公告)号：EP0978729A2

公开(公告)日：2000-02-09

申请号：EP99306230.6

申请日：1999-08-05

申请人： HITACHI, LTD.

发明人： Sekine, Kenji ,  Kondoh, Hiroshi ,  Kamozaki, Keigo ,  Nagaishi, Hideyuki ,  Matsuura, Kazuo ,  Nakazawa, Terumi ,  Tanimoto, Michio ,  Sasaki, Hideaki ,  Taniguchi, Yuzo

IPC分类号： G01S7/03

CPC分类号： H01L23/66 ,  G01S7/03 ,  G01S7/032 ,  G01S2013/9325 ,  H01L24/48 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01Q1/3233 ,  H01Q21/0087 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A high-frequency transmitter-receiver apparatus includes a transceiver circuit (10) realized in a planar structure by a dielectric substrate (3) and a semiconductor chip (4) and a planar antenna (7) formed on a dielectric substrate (2) are provided on front and rear surfaces, respectively, of a single electrically conductive base plate (1). Signal lines of the planar circuit and the planar antenna are electrically interconnected by a coaxial line (106-1, 106-2).

摘要翻译： 一种高频发射机 - 接收机装置，包括通过电介质基板（3）和半导体芯片（4）以及形成在电介质基板（2）上的平面天线（7）在平面结构中实现的收发电路（10） 分别设置在单个导电基板（1）的前表面和后表面上。 平面电路和平面天线的信号线通过同轴线（106-1,106-2）电互连。

公开(公告)号：EP0276928A3

公开(公告)日：1990-08-22

申请号：EP88300315.4

申请日：1988-01-15

申请人： HITACHI, LTD.

发明人： Okikawa, Susumu ,  Tanimoto, Michio

IPC分类号： H01L21/00 ,  H02G1/12

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K20/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/20752 ,  H01L2924/01004 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/85399

摘要： When bonding a coated wire to a bonding site, a mixed gas is formed which consists of a combustible gas and a temperature controlling gas for lowering the combustion temperature of the combustible gas, and removing insulator at a bonding part of the coated wire and thus denuding the surface of a metal wire by the use of burning flames produced by the combustion of the combustible gas of the mixed gas. The removal of the insulator is executed by an insulator removal torch. Also, a metal ball may be formed on an end of the coated wire, the metal ball being joined to the bonding site, e.g. an external terminal of a semi­conductor chip. A further part of the side of the coated wire into touch with an external drawing lead of the chip and the insulator at the contact part. Then the further part of the wire may be bonded to the lead. Thus the combustion flames (which do not damage or cause breakdown of the metal wire) will surround substantially the whole area of the bonding part of the coated wire, so that the insulator of the wire can be reliably removed. This reduces bonding defects. Moreover, the melting and shrinking insulator of the coated wire may be blown away, to prevent globes of insulator globes being formed on the wire.

摘要翻译： 当将涂覆的线粘合到结合部位时，形成由可燃气体和用于降低可燃气体的燃烧温度的温度调节气体组成的混合气体，并且在涂覆的电线的接合部分去除绝缘体，从而剥离 通过使用由混合气体的可燃气体的燃烧产生的燃烧火焰的金属线的表面。 绝缘体的去除由绝缘体去除焊炬执行。 此外，金属球可以形成在涂覆线的端部上，金属球接合到结合位置，例如， 半导体芯片的外部端子。 涂层线的另一部分与芯片的外部引导线和接触部分处的绝缘体接触。 然后线的另一部分可以结合到引线。 因此，燃烧火焰（其不损坏或导致金属丝的击穿）将围绕涂覆线的接合部分的整个区域围绕，从而可以可靠地去除线的绝缘体。 这减少了接合缺陷。 此外，涂覆线材的熔化和收缩的绝缘体可以被吹走，以防止绝缘体球体在导线上形成。

公开(公告)号：EP0355955A2

公开(公告)日：1990-02-28

申请号：EP89305884.2

申请日：1989-06-12

申请人： HITACHI, LTD. ,  HITACHI MICROCOMPUTER SYSTEM LTD.

发明人： Okikawa, Susumu ,  Watanabe, Hiroshi ,  Tanimoto, Michio ,  Homma, Makoto ,  Kaneda, Tsuyoshi ,  Koike, Shunji ,  Nishita, Takafumi 202 Hitachimaikon

IPC分类号： H01B3/30 ,  H01B13/16 ,  H01L23/49 ,  H01L21/60 ,  H01L23/29

CPC分类号： H01L24/85 ,  H01L21/56 ,  H01L23/4952 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/745 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/745 ,  H01L2224/78251 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/7865 ,  H01L2224/83805 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85948 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/01004 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/48824 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2224/83205 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/0675 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor integrated circuit device (2) in which wire bonding is applied by using a bonding wire (5) having heat resistant polyurethane coating (5B), a semiconductor integrated circuit device applied with bonding by way of a coated wire and encapsulated with a resin composition (6) of a low heat expansion coefficient, and a semiconductor integrated circuit device free from disconnection and damage to the coated wire by applying chamfering to a chip, etc.

摘要翻译： 一种半导体集成电路装置（2），引线接合是通过使用（5），其具有耐热性的聚氨酯涂料（5B）的接合线，通过被覆电线的方式与接合施加，并用树脂封装的半导体集成电路器件中的应用 组合物（6）低的热膨胀系数，和从断开和损坏包覆线自由的半导体集成电路装置通过施加倒角到芯片的等

公开(公告)号：EP0276928B1

公开(公告)日：1994-10-26

申请号：EP88300315.4

申请日：1988-01-15

申请人： HITACHI, LTD.

发明人： Okikawa, Susumu ,  Tanimoto, Michio

IPC分类号： H01L21/00 ,  H02G1/12

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K20/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/20752 ,  H01L2924/01004 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/85399

公开(公告)号：EP0276940A2

公开(公告)日：1988-08-03

申请号：EP88300399.8

申请日：1988-01-19

申请人： HITACHI, LTD.

发明人： Tanimoto, Michio ,  Ozawa, Masakazu ,  Okamoto, Michio ,  Yasuda, Hajime

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/83805 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/48824 ,  H01L2924/01204 ,  H01L2224/83205 ,  H01L2924/07025 ,  H01L2924/0541 ,  H01L2924/05432

摘要： A resin-encapsulated integrated circuit has a semiconductor chip (2) whose bonding pads (2A) are connected to corresponding leads (3A) by wires (4). In order to achieve the correct interconnection of pads (2A) and leads (3A) some of the wires (4) intersect and to prevent short circuits they are coated in an insulator. This permits great design versatility as the pads and leads may be positioned as desired, rather than having inter­connected pads and leads adjacent each other, as is normal.
The use of insulated wires also permits one or more of the bonding pads to be central on the chip rather than at its periphery, and some of the pads may be connected to remote leads.

摘要翻译： 一种树脂封装的集成电路具有半导体芯片（2），其接合焊盘（2A）通过导线（4）被连接到相应的导线（3A）。 为了实现焊盘（2A）和导线（3A）某些金属丝的正确互连（4）相交，并防止短路它们涂在绝缘体上。 这允许伟大的设计灵活性如所需的垫和引线可以定位，而不是相互连接的垫，并导致相邻的海誓山盟，因为是正常的。 使用绝缘线的所以允许接合焊盘中的一个或多个是中央的芯片上而不是在其周边，并且一些焊盘可以连接到远程引线。

公开(公告)号：EP0276928A2

公开(公告)日：1988-08-03

申请号：EP88300315.4

申请日：1988-01-15

申请人： HITACHI, LTD.

发明人： Okikawa, Susumu ,  Tanimoto, Michio

IPC分类号： H01L21/00 ,  H02G1/12

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K20/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/20752 ,  H01L2924/01004 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/85399

摘要： When bonding a coated wire to a bonding site, a mixed gas is formed which consists of a combustible gas and a temperature controlling gas for lowering the combustion temperature of the combustible gas, and removing insulator at a bonding part of the coated wire and thus denuding the surface of a metal wire by the use of burning flames produced by the combustion of the combustible gas of the mixed gas. The removal of the insulator is executed by an insulator removal torch. Also, a metal ball may be formed on an end of the coated wire, the metal ball being joined to the bonding site, e.g. an external terminal of a semi­conductor chip. A further part of the side of the coated wire into touch with an external drawing lead of the chip and the insulator at the contact part. Then the further part of the wire may be bonded to the lead. Thus the combustion flames (which do not damage or cause breakdown of the metal wire) will surround substantially the whole area of the bonding part of the coated wire, so that the insulator of the wire can be reliably removed. This reduces bonding defects. Moreover, the melting and shrinking insulator of the coated wire may be blown away, to prevent globes of insulator globes being formed on the wire.