公开(公告)号：EP0645810A1

公开(公告)日：1995-03-29

申请号：EP94912058.8

申请日：1994-04-06

申请人： TOKUYAMA CORPORATION

发明人： MIYAHARA, Kenichiro

IPC分类号： H01L23/04 ,  H01L23/50

CPC分类号： H01L23/057 ,  H01L23/3675 ,  H01L23/49537 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85099 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01043 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01061 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20102 ,  H01L2924/20753 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/20109 ,  H01L2924/00012

摘要： A package for a semiconductor chip having the following features: (a) a power-supply layer, a ground layer, and a signal layer are formed in multilayer through intermediate layers including insulating layers; (b) the power-supply layer and ground layer each comprise an inner lead region exposed from the intermediate layers, an outer lead region, and a conductive region sandwiched by these two regions and covered by the intermediate layers; and (c) the conductive regions of the power-supply layer and ground layer consist of planar conductive members. The self-inductances of the power-supply and ground layers of this package are low, and the capacitance of the capacitor formed by these layers is low. Therefore, the noise of the power-supply system is little.

摘要翻译： 一种具有以下特征的半导体芯片的封装：（a）电源层，接地层和信号层，形成为包括绝缘层在内的多层中间层; （b）电源层和接地层各自包括从中间层露出的内引线区域，外引线区域和被这两个区域夹持并被中间层覆盖的导电区域; 和（c）电源层和接地层的导电区域由平面导电构件构成。 该封装的电源和接地层的自感电位低，由这些层形成的电容器的电容低。 因此，电源系统的噪音很小。

公开(公告)号：EP1293492A1

公开(公告)日：2003-03-19

申请号：EP00981727.1

申请日：2000-12-14

申请人： TOKUYAMA CORPORATION

发明人： MIYAHARA, Kenichiro

IPC分类号： C04B41/86 ,  C04B37/04 ,  C03C8/12 ,  H05K1/03

CPC分类号： C04B35/6303 ,  B32B18/00 ,  C03C8/18 ,  C03C8/20 ,  C03C10/0036 ,  C04B35/195 ,  C04B35/581 ,  C04B37/04 ,  C04B41/009 ,  C04B41/5023 ,  C04B41/86 ,  C04B2111/00844 ,  C04B2235/3203 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3284 ,  C04B2235/3296 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/3463 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2235/3826 ,  C04B2235/3865 ,  C04B2235/3873 ,  C04B2235/404 ,  C04B2235/405 ,  C04B2235/5436 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H01L23/3731 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4614 ,  H05K3/4629 ,  C04B41/4539 ,  C04B41/0072 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A compact size, low electric resistance and high heat-spreading electric circuit substrate, which is suitable for an electric circuit used at microwave of 1 GHz or more as used in the field of wireless communication such as portable telephones or optical communication, is provided.
A jointed body of glass-ceramic with aluminum nitride sintered bodiesaid glass-ceramic containing crystals having the strongest line in the range of 2θ = 27.6° - 28.2° in powder X-ray diffraction using CuKα line, e.g., anorthite crystals, and having a composition containing 0.5 - 30 mass% of Zn component in terms of oxide, not more than 10 mass% in total of Ti component and Zr component in terms of corresponding oxides and not more than 5 mass% of Pb component in terms of oxide. Said jointed body is prepared by forming a layer of amorphous glass of above composition on an aluminum nitride sintered body, and thereafter heating the composite at temperatures not lower than the softening point of said amorphous glass, e.g., 600 - 1100°C, and concurrently crystallizing the same by said heating.

公开(公告)号：EP1293492A8

公开(公告)日：2004-05-12

申请号：EP00981727.1

申请日：2000-12-14

申请人： TOKUYAMA CORPORATION

发明人： MIYAHARA, Kenichiro

IPC分类号： C04B41/86 ,  C04B37/04 ,  C03C8/12 ,  H05K1/03

CPC分类号： C04B35/6303 ,  B32B18/00 ,  C03C8/18 ,  C03C8/20 ,  C03C10/0036 ,  C04B35/195 ,  C04B35/581 ,  C04B37/04 ,  C04B41/009 ,  C04B41/5023 ,  C04B41/86 ,  C04B2111/00844 ,  C04B2235/3203 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3284 ,  C04B2235/3296 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/3463 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2235/3826 ,  C04B2235/3865 ,  C04B2235/3873 ,  C04B2235/404 ,  C04B2235/405 ,  C04B2235/5436 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H01L23/3731 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4614 ,  H05K3/4629 ,  C04B41/4539 ,  C04B41/0072 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A compact size, low electric resistance and high heat-spreading electric circuit substrate, which is suitable for an electric circuit used at microwave of 1 GHz or more as used in the field of wireless communication such as portable telephones or optical communication, is provided. A jointed body of glass-ceramic with aluminum nitride sintered bodiesaid glass-ceramic containing crystals having the strongest line in the range of 2θ = 27.6° - 28.2° in powder X-ray diffraction using CuKα line, e.g., anorthite crystals, and having a composition containing 0.5 - 30 mass% of Zn component in terms of oxide, not more than 10 mass% in total of Ti component and Zr component in terms of corresponding oxides and not more than 5 mass% of Pb component in terms of oxide. Said jointed body is prepared by forming a layer of amorphous glass of above composition on an aluminum nitride sintered body, and thereafter heating the composite at temperatures not lower than the softening point of said amorphous glass, e.g., 600 - 1100°C, and concurrently crystallizing the same by said heating.