公开(公告)号：JP2014086246A

公开(公告)日：2014-05-12

申请号：JP2012233885

申请日：2012-10-23

Applicant: Nippon Mektron Ltd ,  日本メクトロン株式会社

Inventor： NOMOTO HIROSHI ,  YOSHIZAWA KOICHIRO

IPC: H01M2/20 ,  H01M2/10

CPC classification number: H01M10/4257 ,  H01M2/1077 ,  H01M2/206 ,  H01M10/4207 ,  H01M10/425 ,  H01M10/482 ,  H05K1/0278 ,  H05K1/0296 ,  H05K3/10 ,  Y10T29/49147

Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed wiring board with a bus bar that is small in size and light in weight, and that can deal with variation in pitch between electrodes of a battery cell with ease.SOLUTION: A flexible printed wiring board 1 with a bus bar according to one embodiment comprises: a flexible printed wiring board 10 having a flexible insulation base material 11, and a plurality of wiring patterns 12 provided on one principal surface of the flexible insulation base material 11 and provided with a land part 12a for bus bar connection at one end; and a plurality of bus bars 29 and 30 fixed to the land part 12a for bus bar connection by an adhesive agent. The bus bars 29 and 30 are electrically connected to the corresponding land parts 12a for bus bar connection as a block by a plating layer 33 formed on the bus bar 3 and the land part 12a for bus bar connection.

Abstract translation: 要解决的问题：提供具有尺寸小，重量轻的母线的柔性印刷布线板，并且可以容易地处理电池单元的电极之间的间距的变化。解决方案：柔性印刷线路板 具有根据一个实施例的汇流条的图1包括：具有柔性绝缘基材11的柔性印刷布线板10和设置在柔性绝缘基材11的一个主表面上的多个布线图案12，并且设置有陆部 12a一端用于母线连接; 并且多个汇流条29和30固定到陆地部分12a上，用于通过粘合剂连接汇流条。 母线29和30通过形成在母线3上的电镀层33和用于母线连接的接地部分12a电连接到用于母线连接的相应接地部分12a作为块。

公开(公告)号：JP5397504B2

公开(公告)日：2014-01-22

申请号：JP2012126631

申请日：2012-06-02

Applicant: 株式会社村田製作所

Inventor： 多通夫 国司 ,  良比古 高野 ,  茂之 黒田 ,  章博 元木 ,  秀之 樫尾 ,  孝志 野路 ,  誠 小川

IPC: H01G4/30 ,  H01G4/12

CPC classification number: C25D3/12 ,  C25D5/02 ,  C25D7/00 ,  C25D21/10 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49163 ,  Y10T29/49204

公开(公告)号：JP5372726B2

公开(公告)日：2013-12-18

申请号：JP2009290849

申请日：2009-12-22

Applicant: ヴイアイエー・テクノロジーズ・インコーポレイテッド

Inventor： 宮振越

IPC: H05K3/46

CPC classification number: H05K3/4007 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/062 ,  H05K3/108 ,  H05K3/243 ,  H05K3/28 ,  H05K3/421 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09436 ,  H05K2201/09545 ,  H05K2203/0361 ,  H05K2203/0554 ,  H05K2203/0574 ,  H05K2203/1152 ,  H05K2203/308 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A circuit substrate includes a base layer, a patterned conductive layer, a dielectric layer, an outer pad and a conductive block. The patterned conductive layer is disposed on the base layer and has an inner pad. The dielectric layer is disposed on the base layer and covers the patterned conductive layer. The outer pad is disposed on the dielectric layer. The conductive layer is passed through the dielectric layer and connected between the outer pad and the inner pad, wherein the outer pad and the conductive block are formed as an integrative unit, and an outer diameter of the outer pad is substantially equal to an outer diameter of the conductive block.

公开(公告)号：JP5340350B2

公开(公告)日：2013-11-13

申请号：JP2011151898

申请日：2011-07-08

Applicant: エプコス アクチエンゲゼルシャフトEpcos Ag

Inventor： パインジップ ローラント ,  シュランク フランツ

IPC: H01C7/04

CPC classification number: H01C7/04 ,  Y10T29/49085 ,  Y10T29/49087 ,  Y10T29/49098 ,  Y10T29/49147

Abstract: An electrical component which has a base body that comprises a ceramic material and at least two contact regions arranged on the base body to which terminal elements are secured, is enveloped by a protective layer containing organic constituents, and has an intermediate layer that is arranged between the base body and the protective layer and is composed of an intermediate layer material that is both hydrophobic as well as lipophobic. The intermediate layer can be advantageously composed of a fluoropolymer which is manufactured by immersing the base body into a fluid that dissolves this polymer. The moisture stability of the electrical component is critically improved by the intermediate layer. The components are particularly employed as hot-carrier thermistor temperature sensors.

公开(公告)号：JP5305787B2

公开(公告)日：2013-10-02

申请号：JP2008218427

申请日：2008-08-27

Applicant: セイコーインスツル株式会社

Inventor： 敬彦 中村 ,  恵二 佐藤 ,  均 竹内 ,  潔 荒武 ,  理志 沼田

IPC: H01L23/04

CPC classification number: H03H9/1021 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.

公开(公告)号：JP2013093404A

公开(公告)日：2013-05-16

申请号：JP2011233720

申请日：2011-10-25

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： INOUE MASAHIRO ,  SUGIMOTO ATSUHIKO

IPC: H05K1/11 ,  H05K3/24 ,  H05K3/40

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/118 ,  H05K1/119 ,  H05K3/34 ,  H05K2201/09545 ,  Y10T29/49147 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which can improve reliability by providing bump electrodes appropriate for connection with a component.SOLUTION: A wiring board 101 of an embodiment has a structure in which a plurality of bump electrodes 11 are arranged on a substrate principal surface 102 in an electrode formation region. At least one of the plurality of bump electrodes 11 is an odd-shaped bump electrode 11 having a depression 13 on a top face 12 and formed such that an outer diameter A1 at a top edge is larger than an outer diameter A2 at a bottom edge and a cross-section shape as a whole is an inverted trapezoid.

Abstract translation: 要解决的问题：提供一种可以通过提供适合于与部件连接的凸块电极来提高可靠性的布线板。 解决方案：实施例的布线板101具有多个凸起电极11布置在电极形成区域中的基板主表面102上的结构。 多个凸起电极11中的至少一个是在顶面12上具有凹陷13的异形凸起电极11，并且形成为使得顶边缘处的外径A1比底边缘处的外径A2大 横截面形状整体上是倒梯形。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP5197741B2

公开(公告)日：2013-05-15

申请号：JP2010512570

申请日：2008-06-11

Applicant: タイコ エレクトロニクス ネーデルランド ビーヴイTyco Electronics Nederland B.V.

Inventor： イエーガー、ペーター

IPC: H01R12/71 ,  H01R33/76 ,  H01R11/01 ,  H01R13/24 ,  H01R43/00

CPC classification number: H01R12/714 ,  Y10T29/49147

公开(公告)号：JP5185650B2

公开(公告)日：2013-04-17

申请号：JP2008033069

申请日：2008-02-14

Applicant: セイコーインスツル株式会社

Inventor： 高志 小林

IPC: H03H3/02 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/253 ,  H01L41/313 ,  H01L41/332 ,  H01L41/338 ,  H03B5/32 ,  H03H3/04 ,  H03H9/19 ,  H03H9/215

CPC classification number: H03H9/21 ,  H03H3/02 ,  H03H3/04 ,  H03H9/1021 ,  H03H2003/026 ,  H03H2003/0442 ,  Y10T29/42 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49798

Abstract: To carry out frequency adjustment easily, accurately and efficiently and achieve low cost formation and promotion of maintenance performance without being influenced by a size of a piezoelectric vibrating piece, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a piezoelectric vibrating pieces having a piezoelectric plate 11, a pair of exciting electrodes 12, 13, and a pair of mount electrodes electrodes 15, 16 by utilizing a wafer S, the method including an outer shape forming step of forming a frame portion S1 at the wafer and forming a plurality of piezoelectric plates to be connected to the frame portion by way of a connecting portion 11a, an electrode forming step of respectively forming pairs of exciting electrodes and pairs of mount electrodes to the plurality of piezoelectric plates and forming a plurality of pairs of extended electrodes S2, S3 to be respectively electrically connected to the pairs of mount electrodes by way of the connecting portion, a frequency adjusting step of adjusting a frequency of the piezoelectric plate while applying a drive voltage between the pair of the extended electrodes, and a cutting step of fragmenting the plurality of piezoelectric plates.

公开(公告)号：JP5148723B2

公开(公告)日：2013-02-20

申请号：JP2011044569

申请日：2011-03-02

Applicant: ハリス コーポレイションHarris Corporation

Inventor： ダブリュ シンジン スミス，シー ,  ビー ジェインズ，ポール ,  エム ニュートン，チャールズ

IPC: H05K3/00 ,  B29C51/00 ,  H05K3/28

CPC classification number: H05K3/0014 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S156/924 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T156/1189 ,  Y10T428/10 ,  Y10T428/1005

公开(公告)号：JP2013026608A

公开(公告)日：2013-02-04

申请号：JP2011163277

申请日：2011-07-26

Applicant: Advantest Corp ,  株式会社アドバンテスト

Inventor： HORI HISAO ,  ABE SACHIKAZU ,  SATO YOSHIHIRO

IPC: H01L41/22 ,  G01R31/28 ,  H01H57/00 ,  H01L41/09 ,  H01L41/18 ,  H01L41/187

CPC classification number: H01L41/331 ,  H01H49/00 ,  H01H57/00 ,  H01H2057/006 ,  H01L41/0478 ,  H01L41/0815 ,  H01L41/094 ,  H01L41/22 ,  H01L41/29 ,  H01L41/318 ,  H01L41/332 ,  H03H9/568 ,  H03H9/584 ,  H03H9/585 ,  H03H9/605 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a bimorph type piezoelectric actuator which enables long life, a switching device, a transmission path switching device, and a testing device.SOLUTION: A manufacturing method of a bimorph type piezoelectric actuator includes: a first piezoelectric element layer formation stage where a first piezoelectric element layer is formed on a substrate; a support layer formation stage where a support layer of an insulator is formed on the first piezoelectric element layer; a second piezoelectric element layer formation stage where a second piezoelectric element layer is formed on the support layer; and a removal stage where a part of the substrate is removed to form an actuator having the first piezoelectric element layer, the support layer, the second piezoelectric element layer.

Abstract translation: 要解决的问题：提供一种使得寿命长的双压电晶片型压电致动器的制造方法，开关装置，传输路径切换装置和检测装置。 解决方案：双压电晶片型压电致动器的制造方法包括：在基板上形成第一压电元件层的第一压电元件层形成阶段; 在所述第一压电元件层上形成绝缘体的支撑层的支撑层形成阶段; 第二压电元件层形成阶段，其中在所述支撑层上形成第二压电元件层; 以及除去基板的一部分以形成具有第一压电元件层，支撑层，第二压电元件层的致动器的去除台。 版权所有（C）2013，JPO＆INPIT