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    Image reading apparatus and multilayer substrate
    86.
    发明专利
    Image reading apparatus and multilayer substrate 有权
    图像读取装置和多层基板

    公开(公告)号：JP2011024128A

    公开(公告)日：2011-02-03

    申请号：JP2009169416

    申请日：2009-07-17

    Applicant: Fuji Xerox Co Ltd ,  富士ゼロックス株式会社

    Inventor： TAKEUCHI HIDEO

    IPC: H04N1/04 ,  G03B27/54 ,  H04N1/028 ,  H04N1/10 ,  H04N1/107

    CPC classification number: H05K1/0206 ,  H04N1/0083 ,  H04N1/00978 ,  H04N1/00989 ,  H04N1/02815 ,  H04N1/02855 ,  H04N1/02865 ,  H04N1/02895 ,  H04N1/1017 ,  H04N1/12 ,  H05K1/0207 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10106

    Abstract: PROBLEM TO BE SOLVED: To provide an image reading apparatus which allows the employment of a substrate capable of maintaining a high strength regardless of complicated wiring and has a higher reliability.
    SOLUTION: The image reading apparatus 1 includes: a light source 55 which is constituted by arraying a plurality of LED on a multilayer substrate in a column and irradiates a document with light; and a CCD image sensor 59 which receives reflected light from the document. The multilayer substrate has at least a pair of through-holes which have an LED interposed therebetween and have a reinforcement member formed on inner surfaces thereof, and the reinforcement member comes into contact with wiring formed on a first surface whereon LEDs are arranged, of the multilayer substrate and wiring formed on a second surface opposite to the first surface.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种图像读取装置，其允许使用能够保持高强度的基板，而与复杂的布线无关，并且具有更高的可靠性。 解决方案：图像读取装置1包括：光源55，其通过在列中的多层基板上排列多个LED而对光进行照射; 以及接收来自原稿的反射光的CCD图像传感器59。 多层基板具有至少一对通孔，其间插入有LED，并且在其内表面上形成有加强件，并且加强件与布置在LED的第一表面上形成的布线接触， 多层基板和在与第一表面相对的第二表面上形成的布线。 版权所有（C）2011，JPO＆INPIT

    Circuit board structure
    88.
    发明专利
    Circuit board structure 有权
    电路板结构

    公开(公告)号：JP2010183052A

    公开(公告)日：2010-08-19

    申请号：JP2009146674

    申请日：2009-06-19

    Applicant: Tatung Co ,  大同股▲ふん▼有限公司

    Inventor： CHAO SHIH-CHIEH ,  HUANG CHIH-WEN ,  LIAO CHUN-LIN

    IPC: H05K1/02 ,  H05K3/46 ,  H05K9/00

    CPC classification number: H05K1/0233 ,  H05K1/0225 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09663

    Abstract: PROBLEM TO BE SOLVED: To provide a circuit board structure capable of suppressing noise.
    SOLUTION: The circuit board structure includes a dielectric layer, a first metal layer, a second metal layer and a first ferrite element. The first metal layer is disposed on an upper surface of the dielectric layer and has a first circuit area, a second circuit area and a first metallic neck connecting the first circuit area and the second circuit area. The second metal layer is disposed on a lower surface of the dielectric layer and has a third circuit area, a fourth circuit area and at least a second metallic neck connecting the third circuit area and the fourth circuit area. The orthogonal projections of the first and the second metallic necks on the upper surface are not overlapped. The first ferrite element is disposed on the upper surface and overlays at least one of the orthogonal projections of the first and the second metallic necks on the upper surface.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供能够抑制噪声的电路板结构。 解决方案：电路板结构包括电介质层，第一金属层，第二金属层和第一铁氧体元件。 第一金属层设置在电介质层的上表面上，并且具有连接第一电路区域和第二电路区域的第一电路区域，第二电路区域和第一金属颈部。 第二金属层设置在电介质层的下表面上，并且具有第三电路区域，第四电路区域和连接第三电路区域和第四电路区域的至少第二金属管颈。 第一和第二金属颈部在上表面上的正交突起不重叠。 第一铁氧体元件设置在上表面上并且覆盖在上表面上的第一和第二金属颈部的至少一个正交突起。 版权所有（C）2010，JPO＆INPIT

    Substrate device and manufacturing method thereof
    90.
    发明专利
    Substrate device and manufacturing method thereof 有权
    基板装置及其制造方法

    公开(公告)号：JP2010103907A

    公开(公告)日：2010-05-06

    申请号：JP2008275509

    申请日：2008-10-27

    Applicant: Nec Corp ,  日本電気株式会社

    Inventor： OTSUKA EIGO

    IPC: H01P5/08

    CPC classification number: H05K1/117 ,  H05K1/0216 ,  H05K1/024 ,  H05K1/025 ,  H05K2201/0792 ,  H05K2201/09663 ,  H05K2201/09909 ,  H05K2201/10318 ,  Y10T29/49204

    Abstract: PROBLEM TO BE SOLVED: To reduce the degradation of a signal waveform by suppressing reflection noises from a stab end, and to improve impedance mismatch caused by a capacity between a stab and a ground layer. SOLUTION: A substrate device includes: a substrate; a ground layer disposed on one of both surfaces of the substrate; a transmission line disposed on the other surface of the substrate; a pad which is disposed on the other surface of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad is configured so that a part on the transmission line side and a part on the opposite side across a contact point with the connector are electrically insulated from each other. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：通过抑制来自刺针的反射噪声来减少信号波形的劣化，并且改善由刺入和接地层之间的容量引起的阻抗失配。 解决方案：基板装置包括：基板; 设置在所述基板的两个表面中的一个表面上的接地层; 设置在所述基板的另一个表面上的传输线; 衬垫，其设置在所述衬底的另一表面上并连接到所述传输线; 以及通过接触点连接到焊盘的连接器。 衬垫被配置为使得传输线侧的部分和与连接器的接触点相反的一侧的部分彼此电绝缘。 版权所有（C）2010，JPO＆INPIT

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