公开(公告)号：JP2015534217A

公开(公告)日：2015-11-26

申请号：JP2015531859

申请日：2013-09-13

Applicant: エルジー・ケム・リミテッド

Inventor： ミンスー・カン ,  ドゥクス・オー ,  スン−リュン・リム ,  ドン−ヒュク・ホ

IPC: H05B33/26 ,  F21V23/00 ,  H01L51/50 ,  H05B33/06 ,  H05B33/28

CPC classification number: F21V19/0025 ,  F21K9/20 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/50 ,  H01L2251/5361 ,  H05B33/06 ,  H05B33/145 ,  H05B33/28 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09845 ,  H05K2201/10128 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611

Abstract: 有機発光素子(OLED)を利用した照明モジュールに関し、より詳しくは、OLED照光板のガラス基板上に形成された電極パッドに安定的に電源供給端子を連結できるようにした、有機発光素子を利用した照明モジュールに関して開示する。

Abstract translation: 它使用有机发光器件（OLED）涉及照明模块，并且更具体地，涉及能够耦合稳定电源端子于形成在OLED照明板的玻璃基板上的电极焊盘，使用有机发光元件 它公开了一种相对于所述照明模块。

公开(公告)号：JP5546696B2

公开(公告)日：2014-07-09

申请号：JP2013552792

申请日：2013-05-28

Applicant: 日本写真印刷株式会社

Inventor： 成一 山崎 ,  季裕 東川 ,  智優 松崎 ,  正彦 刈谷

IPC: B29C45/14 ,  B29C33/12 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/40 ,  H01R4/04 ,  H01R43/24 ,  H05K5/00

CPC classification number: G06F3/044 ,  B29C45/14065 ,  B29C45/14467 ,  B29C45/14639 ,  B29C2045/14114 ,  B29L2031/3437 ,  B29L2031/3481 ,  G06F1/16 ,  G06F2203/04112 ,  H01Q1/243 ,  H01Q1/40 ,  H01R4/04 ,  H01R43/24 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/101 ,  H05K3/4015 ,  H05K7/02 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10318

公开(公告)号：JP5290017B2

公开(公告)日：2013-09-18

申请号：JP2009077499

申请日：2009-03-26

Applicant: 日本特殊陶業株式会社

Inventor： 俊哉 浅野

IPC: H05K1/02 ,  H01L23/12 ,  H05K3/46

CPC classification number: H05K3/0064 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15174 ,  H05K3/025 ,  H05K3/303 ,  H05K3/4644 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2224/05599

公开(公告)号：JP5160390B2

公开(公告)日：2013-03-13

申请号：JP2008317912

申请日：2008-12-15

Applicant: 新光電気工業株式会社

Inventor： 健太 内山 ,  昭彦 立岩 ,  裕治 国本

IPC: H01L23/12 ,  H01L23/50

CPC classification number: H05K3/303 ,  H01R12/718 ,  H05K3/284 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49162 ,  Y10T29/49171

公开(公告)号：JP4920754B2

公开(公告)日：2012-04-18

申请号：JP2010010842

申请日：2010-01-21

Applicant: 新光電気工業株式会社

Inventor： 茂生 中島 ,  徳孝 松下

IPC: H01L23/50 ,  H01L23/12

CPC classification number: H01L23/49811 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2924/15312 ,  H05K3/341 ,  H05K2201/10318 ,  Y02P70/613 ,  H01L2924/014

Abstract: A lead pin includes a shaft portion, and a connection head portion which is provided on a top end side of the shaft portion and has a diameter larger than a diameter of the shaft portion, and whose whole outer surface is formed of a spherical surface. The connection head portion is formed of a ball shape, an oval spherical shape, or a teardrop-like shape, and also the connection head portion of the lead pin is connected to a wiring substrate by the reflow soldering.

公开(公告)号：JP4917874B2

公开(公告)日：2012-04-18

申请号：JP2006336276

申请日：2006-12-13

Applicant: 新光電気工業株式会社

Inventor： 晃明 千野 ,  淳 大井

IPC: H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/14

CPC classification number: H01L25/105 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10719 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: In a stacked package in which a plurality of packages having semiconductor elements mounted on substrates are stacked, while being electrically connected together, by use of connection sections, wherein the connection sections are formed from pillar-like members and solder joint sections and the upper package is supported on the lower package by pillar-like members.

公开(公告)号：JPWO2009081705A1

公开(公告)日：2011-05-06

申请号：JP2009547009

申请日：2008-12-03

Applicant: 日本電気株式会社

Inventor： 卓 近藤 ,  近藤　　卓

IPC: H01L23/12 ,  H01L23/50

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00

Abstract: 半導体パッケージなどの電子部品を配線基板に実装するための入出力端子用ピンが取り付けられた基板において、電子部品とピン付き基板の接合信頼性を向上させる。ピン付き基板は、軸部及び軸部の先端に設けられ軸部より径大でフランジ状のピンヘッド部を備えるピンと、表面に露出したピンパッドを備える配線基板と、を有し、ピンヘッド部とピンパッドとが接着材料で接合し、ピンヘッド部における軸部との対向面には環状の切り欠きが形成され、環状切り欠きの内周側端部が対向面に接しており、環状切り欠きの内周側端部と軸部とが離間しており、環状切り欠きの表面が環状切り欠きの内周側端部と外周側端部を繋ぐ面に対してピンパッド側にある。

公开(公告)号：JP4588721B2

公开(公告)日：2010-12-01

申请号：JP2007000149

申请日：2007-01-04

Applicant: フォームファクター, インコーポレイテッド

Inventor： エルドリッジ，ベンジャミン，エヌ ,  グループ，ゲーリー，ダヴリュー ,  ハンドロス，イゴー，ワイ ,  マシュー，ゲータン，エル

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: PROBLEM TO BE SOLVED: To make improvements in an interconnection between microelectronic components by a method wherein a flexible extension element is mounted on a contact region on the electronic component and so formed as to be elastic. SOLUTION: A wire 502 is wrapped up in or covered with a first inner coating layer 520, and the first inner coating layer 520 is coated with a second outer coating layer 522 for the formation of a wire stem 530. The first layer 520 of the wire stem 530 is made to cover a terminal 512 as a contacting region on a semiconductor substrate 508 where the end 502a of the wire 502 is bonded, and the wire 502 of soft gold material is mounted and fixed to the terminal 512. By this setup, improvements can be made in an interconnection between microelectronic components.

公开(公告)号：JP2010529657A

公开(公告)日：2010-08-26

申请号：JP2010510490

申请日：2008-05-29

Applicant: オッカム ポートフォリオ リミテッド ライアビリティ カンパニー

Inventor： シー．フェルスタッド ジョセフ

IPC: H05K3/32 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.

公开(公告)号：JP2010073838A

公开(公告)日：2010-04-02

申请号：JP2008238798

申请日：2008-09-18

Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

Inventor： HORIUCHI AKIO ,  YOKOTA YASUSHI

IPC: H01L23/12

CPC classification number: H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/0058 ,  H05K3/4682 ,  H05K2201/10318 ,  H05K2203/063

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor package capable of obtaining a sufficient mechanical strength even on a thin wiring board.
SOLUTION: The semiconductor package includes the wiring board 10 including connection pads C1 and C2 on both surfaces, respectively, and a supporting plate 40 made of an insulator, provided on one surface of the wiring board 10, including an aperture 40a at a part corresponding to the connection pad C2. An external connection terminal (such as a lead pin) is provided on the connection pad C2 on a face where the supporting plate 40 of the wiring board 10 is provided, and a semiconductor chip 3 is mounted on the connection pad C1 on the opposite face.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供即使在薄的布线板上也能够获得足够的机械强度的半导体封装。 解决方案：半导体封装包括分别在两个表面上包括连接焊盘C1和C2的布线板10和设置在布线板10的一个表面上的由绝缘体制成的支撑板40，包括孔40a 对应于连接焊盘C2的部分。 在布线板10的支撑板40的面上的连接焊盘C2上设置有外部连接端子（例如引脚），半导体芯片3安装在相对面上的连接焊盘C1上 。 版权所有（C）2010，JPO＆INPIT