公开(公告)号：JP5521848B2

公开(公告)日：2014-06-18

申请号：JP2010164134

申请日：2010-07-21

Applicant: デクセリアルズ株式会社

Inventor： 恭志 阿久津 ,  宏一 佐藤 ,  茂行 吉澤

IPC: H01R11/01 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J133/04 ,  C09J133/24 ,  C09J201/00 ,  H01B1/22 ,  H01B5/16 ,  H01B13/00 ,  H01L21/60

CPC classification number: H01L24/29 ,  C08F2220/283 ,  C08K3/08 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2205/102 ,  C09J2433/00 ,  H01B1/22 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer composition, a radical polymerization initiator, and a film-forming resin. The (meth)acrylate-based monomer composition includes a (meth)acrylate-based monomer which has a cyclic ester residue or a cyclic amide residue represented by the formula (1): R1 is a hydrogen atom or a methyl group; R2 is an alkylene group or an alkyloxy group; R3 is an alkyl group, an alkylene group, an aryl group, or a halogen atom; n is an integer of 0 to 3; R4 is absent or an alkylene, dotted lines on both sides of R4 jointly represent a single bond; X1 is absent, or an oxygen atom or a carbon atom; and X2 is an oxygen atom, a nitrogen atom, or a sulfur atom.

公开(公告)号：JP5549103B2

公开(公告)日：2014-07-16

申请号：JP2009094618

申请日：2009-04-09

Applicant: デクセリアルズ株式会社

Inventor： 泰伸 山田 ,  恭志 阿久津 ,  幸一 宮内

IPC: C09J7/00 ,  C09J4/02 ,  C09J9/02 ,  C09J171/10 ,  C09J201/00 ,  G02F1/1345 ,  H01B5/16 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K3/323 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2433/00 ,  H01B1/22 ,  H01L2224/29 ,  H05K2203/1189 ,  Y10T156/10 ,  Y10T428/2857 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511 ,  Y10T428/31909

Abstract: A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition.

公开(公告)号：JP5349538B2

公开(公告)日：2013-11-20

申请号：JP2011128323

申请日：2011-06-08

Applicant: デクセリアルズ株式会社

Inventor： 元秀 武市 ,  美佐夫 小西 ,  潤二 篠崎 ,  恭志 阿久津

IPC: H01L21/60 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00

公开(公告)号：JP5222490B2

公开(公告)日：2013-06-26

申请号：JP2007115929

申请日：2007-04-25

Applicant: デクセリアルズ株式会社

Inventor： 恭志 阿久津 ,  大祐 佐藤 ,  慎一 林

IPC: C09J7/00 ,  C09J4/02 ,  C09J9/02 ,  C09J109/00 ,  C09J133/00 ,  C09J171/10 ,  H01B1/22 ,  H01B5/16 ,  H01R11/01

CPC classification number: H01R4/04 ,  C08G2650/56 ,  C08L33/066 ,  C08L71/00 ,  H01B1/20 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0212 ,  Y10T428/254 ,  Y10T428/31855 ,  C08L2666/04

公开(公告)号：JP5196703B2

公开(公告)日：2013-05-15

申请号：JP2004007492

申请日：2004-01-15

Applicant: デクセリアルズ株式会社

Inventor： 憲明 工藤 ,  恭志 阿久津 ,  秀次 波木

IPC: B32B27/18 ,  C09J7/02 ,  B32B27/08 ,  C09J7/00 ,  C09J9/02 ,  C09J201/00 ,  H01B5/16 ,  H01B13/00 ,  H01L21/60 ,  H05K3/32

CPC classification number: H01L24/29 ,  B32B27/08 ,  C09J7/29 ,  C09J2201/162 ,  C09J2205/106 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2924/00

Abstract: An adhesive film (4) having a first resin layer (10), a second resin layer (20) formed on the front surface of the first resin layer (10), and a third resin layer (15) formed on the rear surface of the first resin layer (10), wherein the lowest viscosity in the temperature range lower than the bonding temperature of the first resin layer (10) is higher than the lowest viscosity in the temperature range lower than the bonding temperature of the second and third resin layers (20, 25). When first and second bodies (40, 50) to be bonded are hot pressed while sandwiching the adhesive film (4), the second resin layer (20) flows out toward the outside of the body (50). However, since the first resin layer (10) containing conductive particles (12) does not flow out but stays between the first and second bodies (40, 50), the number of conductive particles (12) sandwiched between first and second connection terminals (42, 52) increases.

公开(公告)号：JP5135564B2

公开(公告)日：2013-02-06

申请号：JP2007154966

申请日：2007-06-12

Applicant: デクセリアルズ株式会社

Inventor： 恭志 阿久津 ,  泰伸 山田 ,  幸一 宮内

IPC: C09J201/00 ,  C09J4/02 ,  C09J9/02 ,  H05K3/32

CPC classification number: H01B1/22 ,  C08F290/06 ,  C08F290/061 ,  C08F290/065 ,  C08G18/8116 ,  C09J133/14 ,  C09J175/06 ,  G02F1/13452 ,  G02F2202/28 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129 ,  Y10S428/901 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2883 ,  Y10T428/2887 ,  Y10T428/2896 ,  Y10T428/31551 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00