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公开(公告)号：JPWO2012144033A1
公开(公告)日：2014-07-28
申请号：JP2012534453
申请日：2011-04-20
Applicant: デクセリアルズ株式会社
IPC: H01L33/60 , B22F1/02 , C09J9/02 , C09J11/04 , C09J11/06 , H01B1/00 , H01B1/22 , H01B5/00 , H01B5/16 , H01L33/62
CPC classification number: H01B1/02 , C08G59/42 , C08K9/02 , C09J9/02 , C09J11/04 , C09J163/00 , H01B1/22 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/2939 , H01L2224/29393 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/00014 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998 , H01L2924/00012 , H01L2924/00 , H01L2924/05432 , H01L2924/05341 , H01L2924/05342 , H01L2224/81 , H01L2224/83 , H01L2224/05599
Abstract: 発光素子を配線板に異方性導電接続するために使用する異方性導電接着剤用の光反射性導電粒子は、金属材料で被覆されているコア粒子と、その表面に屈折率が1.52以上の光反射性無機粒子から形成された光反射層とから構成される。屈折率が1.52以上の光反射性無機粒子としては、酸化チタン粒子、酸化亜鉛粒子又は酸化アルミニウム粒子が挙げられる。コア粒子表面の光反射層による被覆率は70%以上である。
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2.发明专利
公开(公告)号：JP5526698B2
公开(公告)日：2014-06-18
申请号：JP2009239578
申请日：2009-10-16
Applicant: デクセリアルズ株式会社
CPC classification number: C09J9/02 , C08G59/42 , C08K3/08 , C08K9/02 , C08L23/02 , C08L63/00 , C09J11/04 , C09J123/02 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/73 , H01L24/83 , H01L33/60 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/2949 , H01L2224/29499 , H01L2224/29644 , H01L2224/29647 , H01L2224/29655 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012 , H01L2924/0665 , H01L2924/00011
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公开(公告)号：JP5555038B2
公开(公告)日：2014-07-23
申请号：JP2010092672
申请日：2010-04-13
Applicant: デクセリアルズ株式会社
CPC classification number: C09J9/02 , C08K3/08 , C08K3/22 , C08K3/24 , C08K7/08 , C08K9/06 , C08K2003/0831 , C08K2003/2241 , C08K2003/2296 , C09J11/04 , H01L24/06 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/0401 , H01L2224/13339 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/29339 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/83855 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01081 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10157 , H01L2924/12041 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.
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公开(公告)号：JPWO2011086680A1
公开(公告)日：2013-05-16
申请号：JP2011549816
申请日：2010-01-15
Applicant: デクセリアルズ株式会社
CPC classification number: H01B1/20 , C08K5/1515 , C08K5/1539 , C08L63/00 , C09J9/02 , C09J163/00 , H01B1/22 , H01R4/04 , H05K1/189 , H05K3/321 , H05K2201/10106 , H05K2201/10674
Abstract: エポキシ化合物と硬化剤とを含有するエポキシ系接着剤に導電粒子が分散した異方性導電接着剤は、その硬化物の35℃、55℃、95℃及び150℃のそれぞれにおける弾性率をEM35、EM55、EM95及びEM150とし、55℃と95℃との間の弾性率変化率をΔEM55−95、95℃と150℃との間の弾性率変化率をΔEM95−150としたときに、数式(1)〜(5)を満足する。
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公开(公告)号：JP5196703B2
公开(公告)日：2013-05-15
申请号：JP2004007492
申请日：2004-01-15
Applicant: デクセリアルズ株式会社
IPC: B32B27/18 , C09J7/02 , B32B27/08 , C09J7/00 , C09J9/02 , C09J201/00 , H01B5/16 , H01B13/00 , H01L21/60 , H05K3/32
CPC classification number: H01L24/29 , B32B27/08 , C09J7/29 , C09J2201/162 , C09J2205/106 , H01L24/83 , H01L2224/16 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/83101 , H01L2224/83192 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H05K3/323 , H05K2201/10674 , H05K2203/1189 , H01L2924/00
Abstract: An adhesive film (4) having a first resin layer (10), a second resin layer (20) formed on the front surface of the first resin layer (10), and a third resin layer (15) formed on the rear surface of the first resin layer (10), wherein the lowest viscosity in the temperature range lower than the bonding temperature of the first resin layer (10) is higher than the lowest viscosity in the temperature range lower than the bonding temperature of the second and third resin layers (20, 25). When first and second bodies (40, 50) to be bonded are hot pressed while sandwiching the adhesive film (4), the second resin layer (20) flows out toward the outside of the body (50). However, since the first resin layer (10) containing conductive particles (12) does not flow out but stays between the first and second bodies (40, 50), the number of conductive particles (12) sandwiched between first and second connection terminals (42, 52) increases.
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Patent Agency Ranking
公开(公告)号：JP5609716B2
公开(公告)日：2014-10-22
申请号：JP2011048625
申请日：2011-03-07
Applicant: デクセリアルズ株式会社
IPC: H01L33/62
CPC classification number: H01L33/60 , C09J9/02 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/00014 , H01L2924/01029 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2924/3512 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2924/05341 , H01L2924/05432 , H01L2224/81 , H01L2224/83 , H01L2224/05599
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公开(公告)号：JP5499448B2
公开(公告)日：2014-05-21
申请号：JP2008185322
申请日：2008-07-16
Applicant: デクセリアルズ株式会社
CPC classification number: H01L24/29 , C09J9/02 , C09J163/00 , H01B1/22 , H01L24/83 , H01L33/62 , H01L2924/07811 , H01L2924/12041 , H05K3/323 , H01L2924/00
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公开(公告)号：JP5402109B2
公开(公告)日：2014-01-29
申请号：JP2009057316
申请日：2009-03-11
Applicant: デクセリアルズ株式会社
CPC classification number: H01L24/32 , C08K3/08 , C08K9/04 , C09J7/10 , C09J11/04 , C09J2201/36 , C09J2205/102 , C09J2463/00 , H01L33/46 , H01L33/60 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83101 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H05K3/323 , H05K2201/10106 , H05K2201/2054 , H05K2203/1189 , Y10T428/25 , Y10T428/28 , H01L2924/00014 , H01L2924/00
Abstract: An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.
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公开(公告)号：JP5402804B2
公开(公告)日：2014-01-29
申请号：JP2010091567
申请日：2010-04-12
Applicant: デクセリアルズ株式会社
CPC classification number: H01L33/46 , H01L24/29 , H01L24/75 , H01L24/83 , H01L33/54 , H01L33/641 , H01L2224/16225 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/75315 , H01L2224/75316 , H01L2224/83101 , H01L2924/07811 , H01L2924/12041 , H01L2924/00
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