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1.发明专利
公开(公告)号：JP5374971B2
公开(公告)日：2013-12-25
申请号：JP2008223867
申请日：2008-09-01
Applicant: 日立化成株式会社
IPC: H01L21/52 , C09J7/02 , H01L21/301
CPC classification number: H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/92247 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247
Abstract: PROBLEM TO BE SOLVED: To provide: an adhesive film and an adhesive sheet which can be stuck on a member such as a semiconductor wafer and can be easily peeled off from a member such as a dicing sheet; and a semiconductor device and a method for manufacturing the semiconductor device using the same. SOLUTION: The adhesive film 1 comprises a high tuck face A and a low tuck face B. When the tuck strength of the high tuck face A at 40°C is FA and the tuck strength of the low tuck face B at 40°C is FB, a relation of FA-FB≥10 gf and FA≥10 gf is satisfied. The high tuck face A contains a first adhesive resin composition and the low tuck face B contains a second adhesive resin composition different from the first adhesive resin composition. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供：可以粘贴在诸如半导体晶片的构件上的粘合剂膜和粘合片，并且可以容易地从诸如切割片的构件剥离; 以及半导体装置及使用该半导体装置的半导体装置的制造方法。 解决方案：粘合膜1包括高褶面A和低折叠面B.当40℃下的高折叠面A的折叠强度为FA时，低折叠面B的折叠强度为40 ℃为FB，满足FA-FB≥10gf和FA≥10gf的关系。 高褶面A包含第一粘合剂树脂组合物，低折叠面B含有与第一粘合剂树脂组合物不同的第二粘合剂树脂组合物。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP5353702B2
公开(公告)日：2013-11-27
申请号：JP2009536999
申请日：2008-10-07
Applicant: 日立化成株式会社
IPC: H01L21/301 , H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC classification number: H01L21/67132 , B23K26/0057 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , B28D5/0052 , H01L21/6836 , H01L21/78 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/8388 , H01L2224/83885 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10156 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号：JP5309886B2
公开(公告)日：2013-10-09
申请号：JP2008271305
申请日：2008-10-21
Applicant: 日立化成株式会社
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a composition of an adhesive for sealing semiconductor devices, wherein the adhesive exhibits high insulation reliability by allowing the adhesive to have effects of suppressing occurrence of voids in connecting a semiconductor chip and a substrate at a high temperature of 200°C or above and suppressing formation of electrically conductive substances by oxidation of tin plated on wiring lines of the substrate. SOLUTION: The composition of the adhesive for sealing semiconductor devices includes (a) an epoxy resin, (b) a curing agent, and (c) an oxidation inhibitor. COPYRIGHT: (C)2009,JPO&INPIT
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公开(公告)号：JP5196034B2
公开(公告)日：2013-05-15
申请号：JP2011545576
申请日：2011-06-14
Applicant: 日立化成株式会社
IPC: H01L21/301 , C09J7/02 , C09J201/00 , H01L21/52
CPC classification number: H01L21/67132 , C09J7/20 , C09J2201/20 , C09J2201/36 , C09J2203/326 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/68377 , H01L2221/68386 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01033 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
Abstract: The disclosed adhesive sheet (1) for manufacturing a semiconductor device is provided with: a base film (10); an adhesive layer (20) disposed on top of the base film (10); an adhesive layer (30) that is disposed on top of the first adhesive layer (20) and has an opening (30a) through which the first adhesive layer (20) is exposed; and a die-bonding film (40) disposed on the section (25) of the first adhesive film (20) that is exposed through the aforementioned opening (30a). At least part of the outer edge of the die-bonding film (40) is in contact with the second adhesive layer (30).
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Patent Agency Ranking
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公开(公告)号：JP5397526B2
公开(公告)日：2014-01-22
申请号：JP2012254470
申请日：2012-11-20
Applicant: 日立化成株式会社
IPC: H01L21/60 , C09J7/02 , C09J11/06 , C09J179/08 , C09J201/00 , H01L23/29 , H01L23/31
CPC classification number: H01L2224/73204
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公开(公告)号：JP5263050B2
公开(公告)日：2013-08-14
申请号：JP2009170447
申请日：2009-07-21
Applicant: 日立化成株式会社
IPC: H01L21/60 , C09J11/06 , C09J163/00 , C09K3/10
CPC classification number: H01L2224/73204
Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition for electrically connecting the connections of each of a semiconductor chip and a printed circuit board. SOLUTION: In a semiconductor device 100 in which the connections 15 of each of the semiconductor chip 10 and the printed circuit board 20 are electrically connected to each other or a substrate in which the connections of a plurality of semiconductor chips are electrically connected to each other, the adhesive composition for sealing the connections contains polymer component having ≥10,000 of weight mean molecular weight, an epoxy resin, a curing agent and an amine-based surface treatment filler. COPYRIGHT: (C)2011,JPO&INPIT
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