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公开(公告)号：JPWO2012105658A1
公开(公告)日：2014-07-03
申请号：JP2012555961
申请日：2012-02-02
Applicant: 日立化成株式会社
CPC classification number: C09J5/00 , C09J7/35 , C09J2201/28 , C09J2201/61 , C09J2479/086 , H01L21/6835 , H01L2924/10253 , Y10T428/24802
Abstract: 本発明の接着物の製造方法は、第1の被着体と第2の被着体とが接着剤パターンを介して貼り合わされている接着物の製造方法であって、第1の被着体上に接着剤層を設ける工程と、接着剤層の第1の被着体と接する面とは反対側の面上に接着剤層の所定の部分をエッチングから保護する保護層が設けられた状態で接着剤層をエッチングすることにより接着剤パターンを形成する工程と、保護層が除去された後の接着剤パターンに第2の被着体を貼り合わせる工程とを備える。
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公开(公告)号：JP5526783B2
公开(公告)日：2014-06-18
申请号：JP2009544677
申请日：2008-12-02
Applicant: 日立化成株式会社
IPC: H01L21/60
CPC classification number: H01L24/27 , C08G18/8116 , C09J175/16 , C09J179/08 , G03F7/037 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/94 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2924/00014
Abstract: A method for manufacturing a semiconductor device 1, comprising a first step of providing a photosensitive adhesive (insulating resin layer 7) on a board 3 which has a connecting terminal, a second step of patterning the photosensitive adhesive by light exposure and development so that openings 13 are formed where the connecting terminal is exposed, a third step of filling the openings 13 with a conductive material to form a conductive layer 9, and a fourth step of directly bonding a semiconductor chip 5 having a connecting electrode section to the photosensitive adhesive while electrically connecting the connecting terminal of the board 3 and the connecting electrode section of the semiconductor chip 5 via the conductive layer 9.
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公开(公告)号：JP5505421B2
公开(公告)日：2014-05-28
申请号：JP2011540524
申请日：2010-11-10
Applicant: 日立化成株式会社
IPC: H01L21/52 , C09J4/02 , H01L21/301
CPC classification number: H01L24/27 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H01L2924/3025 , Y10T428/2809 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
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公开(公告)号：JP5488001B2
公开(公告)日：2014-05-14
申请号：JP2010017070
申请日：2010-01-28
Applicant: 日立化成株式会社
IPC: H01L21/301 , C09J7/02 , C09J11/06 , C09J179/08 , C09J201/00 , H01L21/52
CPC classification number: H01L24/27 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83191 , H01L2224/92247 , H01L2924/15747 , H01L2924/15788 , H01L2924/351 , H01L2924/00014 , H01L2924/00
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公开(公告)号：JP5477389B2
公开(公告)日：2014-04-23
申请号：JP2011540522
申请日：2010-11-10
Applicant: 日立化成株式会社
IPC: H01L21/52
CPC classification number: H01L23/293 , C09J4/00 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01067 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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Patent Agency Ranking
公开(公告)号：JP5397378B2
公开(公告)日：2014-01-22
申请号：JP2010526745
申请日：2009-08-26
Applicant: 日立化成株式会社
IPC: C09J179/08 , C09J4/02 , C09J7/00 , C09J7/02 , C09J163/00 , G03F7/004 , G03F7/027 , G03F7/075 , H01L21/301 , H01L21/52
CPC classification number: C09J4/00 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/20 , C08L2666/22 , C09J4/06 , C09J163/00 , C09J179/08 , G03F7/038 , G03F7/70383 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2224/16 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83856 , H01L2224/92247 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12041 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24355 , Y10T428/287 , Y10T428/31518 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T 1 (µm) of the adhesive pattern formed after development satisfying the conditions represented by the following expression (1). T 1 / T 0 × 100 ‰¥ 90 [In expression (1), T 0 represents the film thickness (µm) of the adhesive layer before developing treatment.]
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公开(公告)号：JP5374982B2
公开(公告)日：2013-12-25
申请号：JP2008232620
申请日：2008-09-10
Applicant: 日立化成株式会社
IPC: H01L21/52 , C09J7/02 , H01L21/301
CPC classification number: H01L24/27 , H01L24/32 , H01L2224/29017 , H01L2224/29018 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83191 , H01L2224/92247 , H01L2924/15311 , H01L2924/15747 , H01L2924/351 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device that is stuck to a member, such as a semiconductor wafer, at low temperature and prevents bubbles from being generated easily between an adhesive film and a support member when sticking, for example, the adhesive film to the support member. SOLUTION: In the method for manufacturing the semiconductor device, a first varnish containing a first adhesive resin composition and a second varnish containing a second adhesive resin composition different from the first one are overlapped onto a base material 2. Then, the first and second varnishes are dried to form an adhesive film 1 on the base material 2. A semiconductor wafer W is stuck to a high-tack surface A of the adhesive film 1. The semiconductor wafer W is cut. A semiconductor element 8 having an adhesive layer is picked up and adhered to a wiring board. In an adhesive layer 7, a recess formed between lines is embedded when heating at 170°C for two hours. COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JP5374972B2
公开(公告)日：2013-12-25
申请号：JP2008223869
申请日：2008-09-01
Applicant: 日立化成株式会社
IPC: H01L21/52 , C09J7/02 , H01L21/301
CPC classification number: H01L24/27 , H01L2224/29017 , H01L2224/29018 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83191 , H01L2224/92247 , H01L2924/15311 , H01L2924/15747 , H01L2924/351 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an adhesive film and an adhesive sheet which can be adhered, for example, to a member such as a semiconductor wafer at low temperature, easily peeled off, for example, from a member such as a dicing sheet, and air bubbles are hard to be generated between the adhesive film and a support member, for example, when the adhesive film is adhered to the support member, to provide a semiconductor device using the same, and to provide a method for manufacturing the semiconductor device. SOLUTION: The adhesive film has a high tack side A and a low tack side B. When tack strength of the high tack side A at 40°C is denoted by FA, and tack strength of the low tack side B at 40°C is denoted by FB, relations of FA/FB≥5 and FA≥10gf are satisfied. The high tack side A contains a first adhesive resin compound, and the low tack side B contains a second adhesive resin compound different from the first adhesive resin compound. Storage elasticity of a hardened material of the second adhesive resin compound at 260°C is 0.1-2.0 MPa. COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JP5374969B2
公开(公告)日：2013-12-25
申请号：JP2008223852
申请日：2008-09-01
Applicant: 日立化成株式会社
IPC: H01L21/52 , C09J7/02 , H01L21/301
CPC classification number: H01L24/27 , H01L2224/29017 , H01L2224/29018 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/92247 , H01L2924/15311 , H01L2924/15747 , H01L2924/351 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an adhesive film and an adhesive sheet which can be stuck on a member, such as, a semiconductor wafer and easily peeled off from a member, such as, a dicing sheet, and to provide a semiconductor device and a method for manufacturing the semiconductor device that uses the same. SOLUTION: The adhesive film 1 comprises a high-tuck face A and a low-tuck face B. When the tuck strength of the high-tuck face A at 40°C is provided by FA and the tuck strength of the low-tuck face B at 40°C is provided by FB, the relations FA/FB≥5 and FA≥10 gf are satisfied. The high-tuck face A contains a first adhesive resin composition, and the low-tuck face B contains a second adhesive resin composition which differs from the first adhesive resin composition. COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JPWO2011058995A1
公开(公告)日：2013-04-04
申请号：JP2011540520
申请日：2010-11-10
Applicant: 日立化成株式会社
IPC: H01L21/52 , C09J4/02 , H01L21/301 , H01L25/065 , H01L25/07 , H01L25/18
CPC classification number: H01L24/27 , C08F220/30 , H01L21/565 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/27002 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83201 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/93 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , Y10T428/2809 , Y10T428/31935 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/27 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 半導体ウェハの回路面とは反対側の面上に接着剤組成物を成膜して接着剤層を形成する工程と、接着剤層を光照射によりBステージ化する工程と、半導体ウェハを、Bステージ化された前記接着剤層とともに切断して複数の半導体チップに切り分ける工程と、半導体チップと支持部材又は他の半導体チップとを、それらの間に接着剤層を挟んで圧着することにより接着する工程と、を備える半導体装置の製造方法。
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