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    Semiconductor device package and method of manufacturing the same
    2.
    发明专利
    Semiconductor device package and method of manufacturing the same 有权
    半导体器件封装及其制造方法

    公开(公告)号：JP2009147080A

    公开(公告)日：2009-07-02

    申请号：JP2007322337

    申请日：2007-12-13

    申请人： Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    发明人： KOIZUMI NAOYUKI ,  OI ATSUSHI ,  TATEIWA AKIHIKO

    IPC分类号： H01L23/12

    CPC分类号： H01L23/142 ,  H01L21/4846 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/06 ,  H05K3/4608 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  H01L2924/00

    摘要： PROBLEM TO BE SOLVED: To provide a package for semiconductor device for enabling high density wiring. SOLUTION: A semiconductor device package 10 includes wiring patterns 14 formed on the front and rear surfaces of a core substrate 12 and connected via a conductive part 18 formed in a through-hole. This semiconductor device package 10 is characterized in that the core substrate 12 is formed in the manner that a first through-hole 16 for the conductive part, a second through-hole 22, and a projected part 24 are formed integrally and two sheets of metal plate 20a, 20b having an insulating layer 26 formed on the front surface are formed through lamination allowing that the projected parts 24 of respective metal plates are going into the second through-hole 22 of the metal plate in the other side with each other, the front end of each projected part 24 is exposed to the front surface of the metal plate of the other side and is formed to a first terminal part 24a, and moreover a second terminal part 28 exposed from the insulating layer 26 is formed on the front surface in the side where the first terminal part 24a of the metal plate of the other side is exposed. COPYRIGHT: (C)2009,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种用于实现高密度布线的半导体器件的封装。 解决方案：半导体器件封装10包括形成在芯基板12的前表面和后表面上并经由形成在通孔中的导电部分18连接的布线图案14。 该半导体器件封装体10的特征在于，芯基板12的形成方式为：用于导电部件的第一通孔16，第二通孔22和突出部分24一体地形成，并且两片金属 通过层叠形成具有形成在前表面上的绝缘层26的板20a，20b，使得各个金属板的突出部分24彼此进入金属板的第二通孔22， 每个突出部分24的前端暴露于另一侧的金属板的前表面并且形成于第一端子部分24a，此外，从绝缘层26露出的第二端子部分28形成在前表面 在另一侧的金属板的第一端子部24a露出的一侧。 版权所有（C）2009，JPO＆INPIT

    Substrate-sticking device
    3.
    发明专利
    Substrate-sticking device 审中-公开
    基板装置

    公开(公告)号：JP2009010072A

    公开(公告)日：2009-01-15

    申请号：JP2007168491

    申请日：2007-06-27

    申请人： Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    发明人： KOIZUMI NAOYUKI ,  HAYAKAWA EIJI

    IPC分类号： H01L21/683

    摘要： PROBLEM TO BE SOLVED: To provide a substrate-sticking device having a high working efficiency and capable of preventing an engulfing of a bubble and coincidentally causing no crinkle or the like after the sticking. SOLUTION: The substrate-sticking device comprises: a substrate holding part 30; a supporting-body-holding part 20 aligned to the substrate holding part 30 and provided to the substrate holding part 30 in a contacting-or-detaching capable manner with suction-holding a supporting body 50; a regulating means 23 of a direction of the contacting-or-detaching; a curvature forming body 33 provided to at least the substrate holding part 30; and a decompression chamber 10 housing the substrate holding part 30, the supporting-body-holding part 20, and the curvature forming body 33. The curvature forming body 33 causes curvature of a substrate 40 in convex shape in the decompression chamber 10 to cause curvature of at least the substrate 40 out of the substrate 40 and the supporting body 50, letting the supporting-body-holding part 20 approach to the substrate holding part 30, and sticking the substrate 40 to the supporting body 50 by depressing a central part of the supporting body 50 to a central part of the substrate 40. COPYRIGHT: (C)2009,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种具有高工作效率并且能够防止气泡吞没并巧合地在粘贴之后不产生皱纹等的基底粘贴装置。 基板粘贴装置包括：基板保持部30; 支撑体保持部20，其与基板保持部30对准并且以吸附保持支撑体50以接触或分离的方式设置到基板保持部30; 接触或分离方向的调节装置23; 至少设置在基板保持部30上的曲率形成体33; 以及容纳基板保持部30，支撑体保持部20以及曲率形成体33的减压室10.曲率形成体33使减压室10内的基板40呈凸形的曲率，使曲率 至少基板40从基板40和支撑体50出来，使支撑体保持部20靠近基板保持部30，并且通过按压基板40的中心部分将基板40粘贴到支撑体50 支撑体50到基板40的中心部分。版权所有（C）2009，JPO＆INPIT

    Electronic component device
    5.
    发明专利
    Electronic component device 审中-公开
    电子元器件

    公开(公告)号：JP2007281021A

    公开(公告)日：2007-10-25

    申请号：JP2006102213

    申请日：2006-04-03

    申请人： Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    发明人： KOIZUMI NAOYUKI

    IPC分类号： H01L23/02 ,  H01L31/02

    CPC分类号： H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16152 ,  H01L2924/00014

    摘要： PROBLEM TO BE SOLVED: To provide an electronic component device wherein electronic components are hermetically sealed in a package provided with a light transmission window and the light transmission window having an inclined face with an optional angle is accurately arranged.
    SOLUTION: An electronic component 40 is mounted onto the bottom of the housing S of a package body 30 which is provided with the housing S inside and an opening 20x on its upper side, and a light transmission window 50 which allows light from the outside to enter the electronic component 40 is provided to block the opening 20x, so that the electronic component 40 is hermetically sealed. A pair of facing faces in the direction of light transmission are formed by a combination of a horizontal surface HS and an inclined surface IS, and the horizontal surface HS side is fixed onto the vicinity of the opening 20x of the package body 30, so that the light transmission window 50 is arranged in a manner to have the inclined surface IS to the light receiving surface of the electronic component 40.
    COPYRIGHT: (C)2008,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种电子部件装置，其中将电子部件气密地密封在设置有透光窗的封装中，并且具有可选角度的倾斜面的透光窗被精确地布置。 解决方案：电子部件40安装在封装主体30的壳体S的底部，封装主体30的内部设置有壳体S，并且在其上侧设置有开口20x，以及透光窗50，其允许来自 提供进入电子部件40的外部以阻挡开口20x，使得电子部件40被气密地密封。 通过水平表面HS和倾斜表面IS的组合形成在透光方向上的一对面对面，并且水平表面HS侧被固定在包装主体30的开口20x附近，使得 光传输窗口50以使电子部件40的光接收表面具有倾斜表面IS的方式布置。版权所有：（C）2008，JPO＆INPIT

    Optical device
    6.
    发明专利
    Optical device 审中-公开
    光学装置

    公开(公告)号：JP2007212576A

    公开(公告)日：2007-08-23

    申请号：JP2006030188

    申请日：2006-02-07

    申请人： Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    发明人： KOIZUMI NAOYUKI ,  HARUHARA MASAHIRO ,  SHIRAISHI AKINORI ,  TAGUCHI YUICHI ,  MURAYAMA HIROSHI ,  SAKAGUCHI HIDEAKI ,  AZUMA MITSUTOSHI

    IPC分类号： G03B21/00 ,  G03B21/14 ,  H04N5/74

    CPC分类号： G03B21/208 ,  G03B21/008 ,  G03B21/145 ,  H04N9/315

    摘要： PROBLEM TO BE SOLVED: To provide an optical device designed so as to have a smaller size in the optical device used in a projector, optical switch, bar code, copying machine or the like. SOLUTION: The optical device 10 includes: a light source 13; a mirror element 12 having a mirror 36 that reflects light emitted from the light source 13 toward a predetermined direction; and a mirror element accommodating body 11 for accommodating the mirror element 12 and sealing a space D where the mirror element 12 is accommodated. The light source 13 is disposed in the mirror element accommodating body 11. COPYRIGHT: (C)2007,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种在投影仪，光学开关，条形码，复印机等中使用的光学装置中具有较小尺寸的光学装置。 解决方案：光学装置10包括：光源13; 具有将从光源13发射的光朝向预定方向反射的反射镜36的反射镜元件12; 以及用于容纳反射镜元件12并且密封容纳镜子元件12的空间D的反射镜容纳体11。 光源13设置在镜子容纳体11中。版权所有（C）2007，JPO＆INPIT

    Method of manufacturing semiconductor chip mounting tape and the semiconductor chip mounting tape
    9.
    发明专利
    Method of manufacturing semiconductor chip mounting tape and the semiconductor chip mounting tape 审中-公开
    制造半导体芯片安装胶带和半导体芯片安装胶带的方法

    公开(公告)号：JP2003332268A

    公开(公告)日：2003-11-21

    申请号：JP2002137366

    申请日：2002-05-13

    申请人： Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    发明人： KOIZUMI NAOYUKI

    IPC分类号： H01L21/683 ,  H01L21/301 ,  H01L21/50 ,  H01L21/52 ,  H01L21/68

    摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor chip mounting tape for improving a product yield rate and simplifying a moving mechanism of a pickup pin and to provide the semiconductor chip mounting tape. SOLUTION: A semiconductor wafer is stuck to an upper face of a dicing film having extensibility and adhesion. The semiconductor wafer is vertically and laterally cut and a plurality of semiconductor chips 112 are formed. The dicing film is extended and intervals between the semiconductor chips 112 are enlarged. The extended dicing film is cut in such a way that the semiconductor chips 112 are arranged in a line along an arranging direction of the semiconductor chips 112. Thus, a plurality of dicing tapes 103 are formed. End parts in a longitudinal direction of a plurality of the dicing tapes 103 are bonded and the semiconductor chip mounting tape 100 where the semiconductor chips 112 are mounted in a line is formed. COPYRIGHT: (C)2004,JPO

    摘要翻译： 解决的问题：提供一种用于提高产品成品率的半导体芯片安装带的制造方法，并简化拾取销的移动机构并提供半导体芯片安装带。 解决方案：半导体晶片粘附到具有延展性和粘合力的切割膜的上表面。 半导体晶片被垂直和横向切割，并且形成多个半导体芯片112。 切割膜延伸并且半导体芯片112之间的间隔被扩大。 将延伸的切割膜切割成半导体芯片112沿着半导体芯片112的排列方向排成一行。因此，形成多个切割带103。 接合多个切割带103的纵向的端部，形成半导体芯片112一行安装的半导体芯片安装带100。 版权所有（C）2004，JPO

    Wiring board and manufacturing method of the same
    10.
    发明专利
    Wiring board and manufacturing method of the same 有权
    接线板及其制造方法

    公开(公告)号：JP2013219191A

    公开(公告)日：2013-10-24

    申请号：JP2012088642

    申请日：2012-04-09

    申请人： Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    发明人： FURUICHI JUN ,  TATEIWA AKIHIKO ,  KOIZUMI NAOYUKI

    IPC分类号： H05K3/46

    CPC分类号： H05K1/115 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H05K1/0298 ,  H05K3/002 ,  H05K3/4605 ,  H05K3/4694 ,  H05K2201/09227

    摘要： PROBLEM TO BE SOLVED: To provide a wiring board including a core board where through electrodes having different diameters are formed.SOLUTION: A core board 21 of a wiring board 20 includes: first and second core boards 30, 40; a first insulation member 23; and a second insulation member 24. A first through electrode 33 is formed in a first through hole 32 that is formed having a predetermined hole diameter (a first diameter) at a first glass board 31 of the first core board 30. Further, a second through electrode 43 is formed in a second through hole 42 that is formed having a hole diameter (a second diameter) larger compared to the first through hole 32 at a second glass board 41 of the second core board 40. The first and second core boards 30, 40 are arranged parallel with each other in a plane direction so as to be spaced away from each other through the first insulation member 23 formed in a gap 22 between the core boards 30, 40.

    摘要翻译： 要解决的问题：提供一种包括形成具有不同直径的贯通电极的芯板的布线基板。解决方案：布线板20的芯板21包括：第一和第二芯板30,40; 第一绝缘构件23; 和第二绝缘构件24.第一通孔33形成在第一通孔32中，第一通孔32在第一芯板30的第一玻璃板31处形成为具有预定孔直径（第一直径）。此外，第二通孔 通孔电极43形成在第二通孔42中，第二通孔42在第二芯板40的第二玻璃板41处形成有与第一通孔32相比更大的孔直径（第二直径）。第一和第二芯板 30,40在平面方向上彼此平行地布置成通过形成在芯板30,40之间的间隙22中的第一绝缘构件23彼此间隔开。