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公开(公告)号：TWI453840B
公开(公告)日：2014-09-21
申请号：TW097108282
申请日：2008-03-10
发明人： 王忠裕 , WANG, CHUNG YU , 李建勳 , LEE, CHIEN HSIUN , 曹佩華 , TSAO, PEI HAW , 張國欽 , CHANG, KUO CHIN , 林忠毅 , LIN, CHUNG YI , 江浩然 , KIANG, BILL
IPC分类号： H01L21/60 , H01L23/485 , H01L21/28
CPC分类号： H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/13 , H01L2224/0231 , H01L2224/02313 , H01L2224/0401 , H01L2224/04042 , H01L2224/05008 , H01L2224/05569 , H01L2224/05571 , H01L2224/056 , H01L2224/05647 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/1148 , H01L2224/11901 , H01L2224/13005 , H01L2224/13022 , H01L2224/13027 , H01L2224/131 , H01L2224/16 , H01L2224/45144 , H01L2224/48647 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/207 , H01L2224/13099 , H01L2924/00 , H01L2224/05552
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公开(公告)号：TWI430483B
公开(公告)日：2014-03-11
申请号：TW099123934
申请日：2010-07-21
发明人： 王忠裕 , WANG, CHUNG YU
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L24/17 , H01L33/486 , H01L33/54 , H01L33/642 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
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公开(公告)号：TWI482322B
公开(公告)日：2015-04-21
申请号：TW099115077
申请日：2010-05-12
发明人： 王忠裕 , WANG, CHUNG YU
IPC分类号： H01L33/64
CPC分类号： H01L33/64 , H01L24/17 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/16235 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15156 , H01L2924/15788 , H01L2924/18161 , H01L2924/00
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公开(公告)号：TWI490991B
公开(公告)日：2015-07-01
申请号：TW101112571
申请日：2012-04-10
发明人： 陳志壕 , CHEN, CHIH HAO , 李隆華 , LEE, LONG HUA , 蘇峻興 , SU, CHUN HSING , 蔡宜霖 , TSAI, YI LIN , 葉宮辰 , YEH, KUNG CHEN , 王忠裕 , WANG, CHUNG YU , 洪瑞斌 , HUNG, JUI PIN , 林俊成 , LIN, JING CHENG
IPC分类号： H01L23/485 , H01L21/304 , H01L23/31 , H01L23/488
CPC分类号： H01L21/563 , H01L21/561 , H01L21/78 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/131 , H01L2224/16225 , H01L2224/17181 , H01L2224/26145 , H01L2224/2919 , H01L2224/32145 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/83104 , H01L2224/9202 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H01L2224/81 , H01L2224/32225 , H01L2924/00 , H01L2924/00014 , H01L2224/11 , H01L2924/014 , H01L2924/0665
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公开(公告)号：TWI458140B
公开(公告)日：2014-10-21
申请号：TW099124277
申请日：2010-07-23
发明人： 王忠裕 , WANG, CHUNG YU
CPC分类号： H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48464 , H01L2224/49107 , H01L2224/73265 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
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公开(公告)号：TWI413285B
公开(公告)日：2013-10-21
申请号：TW099119856
申请日：2010-06-18
发明人： 王忠裕 , WANG, CHUNG YU
IPC分类号： H01L33/62
CPC分类号： H01L33/647 , H01L23/481 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/73 , H01L24/94 , H01L24/97 , H01L27/15 , H01L33/0025 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/32 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/83385 , H01L2224/83815 , H01L2224/83895 , H01L2224/92247 , H01L2224/94 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01026 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2933/0066 , H01L2924/00014 , H01L2924/0781 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
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公开(公告)号：TW201322391A
公开(公告)日：2013-06-01
申请号：TW101112571
申请日：2012-04-10
发明人： 陳志壕 , CHEN, CHIH HAO , 李隆華 , LEE, LONG HUA , 蘇峻興 , SU, CHUN HSING , 蔡宜霖 , TSAI, YI LIN , 葉宮辰 , YEH, KUNG CHEN , 王忠裕 , WANG, CHUNG YU , 洪瑞斌 , HUNG, JUI PIN , 林俊成 , LIN, JING CHENG
IPC分类号： H01L23/485 , H01L21/304 , H01L23/31 , H01L23/488
CPC分类号： H01L21/563 , H01L21/561 , H01L21/78 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/131 , H01L2224/16225 , H01L2224/17181 , H01L2224/26145 , H01L2224/2919 , H01L2224/32145 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/83104 , H01L2224/9202 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H01L2224/81 , H01L2224/32225 , H01L2924/00 , H01L2924/00014 , H01L2224/11 , H01L2924/014 , H01L2924/0665
摘要： 一種晶圓級封裝，包括一接合至支撐晶圓的半導體晶粒。半導體晶粒在其基板具有至少一個階梯式凹陷。一底膠層形成於半導體晶粒及支撐晶圓之間。再者，底膠層的高度受限於階梯式凹陷。在晶圓級封裝的製程中，階梯式凹陷幫助降低晶圓級封裝上的應力。
简体摘要： 一种晶圆级封装，包括一接合至支撑晶圆的半导体晶粒。半导体晶粒在其基板具有至少一个阶梯式凹陷。一底胶层形成于半导体晶粒及支撑晶圆之间。再者，底胶层的高度受限于阶梯式凹陷。在晶圆级封装的制程中，阶梯式凹陷帮助降低晶圆级封装上的应力。
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