专利检索 ap:("史達晶片有限公司" OR "STATS CHIPPAC, LTD.") AND inv:"KUAN, HEAP HOE" 第 1 页

1.

发明专利
半導體元件和形成三維垂直指向之整合電容器的方法有权
简体标题：半导体组件和形成三维垂直指向之集成电容器的方法

公开(公告)号：TWI488261B

公开(公告)日：2015-06-11

申请号：TW099106255

申请日：2010-03-04

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 黃銳 , HUANG, RUI , 官怡荷 , KUAN, HEAP HOE , 林耀劍 , LIN, YAOJIAN , 鄒勝原 , CHOW, SENG GUAN

IPC分类号： H01L21/70 , H01L27/04

CPC分类号： H01L23/3128 , H01L21/486 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/147 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L23/5389 , H01L23/642 , H01L24/24 , H01L24/48 , H01L25/105 , H01L2221/68345 , H01L2221/68381 , H01L2223/6677 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/12105 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556

2.

发明专利
在基板的孔穴中鑲嵌具有直通矽晶穿孔的晶粒用以扇入封裝疊加的電互連之半導體裝置和方法有权
简体标题：在基板的孔穴中镶嵌具有直通硅晶穿孔的晶粒用以扇入封装叠加的电互连之半导体设备和方法

公开(公告)号：TWI508226B

公开(公告)日：2015-11-11

申请号：TW099123256

申请日：2010-07-15

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 派蓋菈瑞莎A , PAGAILA, REZA A. , 官怡荷 , KUAN, HEAP HOE , 馬力羅迪歐斯可洛A , MERILO, DIOSCORO A.

IPC分类号： H01L21/768 , H01L23/52 , H01L25/04

CPC分类号： H01L23/5384 , H01L23/13 , H01L23/3128 , H01L23/481 , H01L23/49816 , H01L23/5385 , H01L23/5389 , H01L24/73 , H01L25/0657 , H01L2224/14181 , H01L2224/16145 , H01L2224/16245 , H01L2224/32145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/85005 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/00012 , H01L2924/00

3.

发明专利
在鋸道上使用通孔晶粒之封裝中的封裝有权
简体标题：在锯道上使用通孔晶粒之封装中的封装

公开(公告)号：TWI427754B

公开(公告)日：2014-02-21

申请号：TW097115853

申请日：2008-04-30

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 杜雍台 , DO, BYUNG TAI , 官怡荷 , KUAN, HEAP HOE , 鄒勝源 , CHOW, SENG GUAN

IPC分类号： H01L23/535 , H01L23/52 , H01L25/00

CPC分类号： H01L23/5384 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68336 , H01L2221/68372 , H01L2224/02371 , H01L2224/02372 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/05554 , H01L2224/1134 , H01L2224/12105 , H01L2224/131 , H01L2224/13138 , H01L2224/13147 , H01L2224/14131 , H01L2224/16145 , H01L2224/16225 , H01L2224/20 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45139 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73204 , H01L2224/73265 , H01L2224/96 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06551 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15313 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19107 , H01L2924/30105 , H01L2924/00 , H01L2924/00012

4.

发明专利
晶圓級積體封裝有权
简体标题：晶圆级积体封装

公开(公告)号：TWI421987B

公开(公告)日：2014-01-01

申请号：TW097115852

申请日：2008-04-30

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 官怡荷 , KUAN, HEAP HOE , 鄒勝源 , CHOW, SENG GUAN , 周佩儀 , CHUA, LINDA PEI EE

IPC分类号： H01L23/48 , H01L21/304 , H01L21/60

CPC分类号： H01L21/78 , H01L21/568 , H01L23/3128 , H01L23/552 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48235 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2224/85 , H01L2224/94 , H01L2224/97 , H01L2225/06537 , H01L2225/06589 , H01L2924/00014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/10329 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2924/167 , H01L2924/181 , H01L2924/18161 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2224/83 , H01L2924/00012 , H01L2224/48227 , H01L2224/05599 , H01L2224/05099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

5.

发明专利
晶圓級積體封裝有权
简体标题：晶圆级积体封装

公开(公告)号：TWI527172B

公开(公告)日：2016-03-21

申请号：TW102134499

申请日：2008-04-30

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 官怡荷 , KUAN, HEAP HOE , 鄒勝源 , CHOW, SENG GUAN , 周佩儀 , CHUA, LINDA PEI EE

IPC分类号： H01L23/48 , H01L21/304 , H01L21/60

CPC分类号： H01L21/78 , H01L21/568 , H01L23/3128 , H01L23/552 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48235 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2224/85 , H01L2224/94 , H01L2224/97 , H01L2225/06537 , H01L2225/06589 , H01L2924/00014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/10329 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2924/167 , H01L2924/181 , H01L2924/18161 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2224/83 , H01L2924/00012 , H01L2224/48227 , H01L2224/05599 , H01L2224/05099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

6.

发明专利
半導體元件以及在垂直互連結構附近形成非流動的底部填充材料的方法有权
简体标题：半导体组件以及在垂直互链接构附近形成非流动的底部填充材料的方法

公开(公告)号：TWI515810B

公开(公告)日：2016-01-01

申请号：TW099106849

申请日：2010-03-10

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 黃銳 , HUANG, RUI , 官怡荷 , KUAN, HEAP HOE , 林耀劍 , LIN, YAOJIAN , 鄒勝原 , CHOW, SENG GUAN

IPC分类号： H01L21/60 , H01L21/56 , H01L23/488 , H01L23/31

CPC分类号： H01L25/105 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/32 , H01L24/81 , H01L24/96 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L2224/0401 , H01L2224/1134 , H01L2224/12105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73265 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/92 , H01L2224/96 , H01L2225/06517 , H01L2225/06541 , H01L2225/06582 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2224/82 , H01L2924/00 , H01L2924/00014 , H01L2224/11 , H01L2224/03

7.

发明专利
在鋸道上使用通孔晶粒之封裝上的封裝有权
简体标题：在锯道上使用通孔晶粒之封装上的封装

公开(公告)号：TWI425610B

公开(公告)日：2014-02-01

申请号：TW097115854

申请日：2008-04-30

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 杜雍台 , DO, BYUNG TAI , 官怡荷 , KUAN, HEAP HOE , 鄒勝源 , CHOW, SENG GUAN

IPC分类号： H01L25/04 , H01L23/522

CPC分类号： H01L2224/16 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/014 , H01L2924/19107 , H01L2924/00014

8.

发明专利
具擴展式重分佈層之凸起封裝晶圓有权
简体标题：具扩展式重分布层之凸起封装晶圆

公开(公告)号：TWI425583B

公开(公告)日：2014-02-01

申请号：TW097111945

申请日：2008-04-02

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 杜雍台 , DO, BYUNG TAI , 希普胡官 , KUAN, HEAP HOE

IPC分类号： H01L21/60 , H01L21/304

CPC分类号： H01L24/97 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L23/3185 , H01L23/498 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/96 , H01L2221/68327 , H01L2221/68359 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/1134 , H01L2224/12105 , H01L2224/13099 , H01L2224/131 , H01L2224/13138 , H01L2224/13147 , H01L2224/14131 , H01L2224/20 , H01L2224/96 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15787 , H01L2924/30105 , H01L2924/00 , H01L2224/03 , H01L2224/11 , H01L2924/00014

9.

发明专利
半導體裝置以及形成具有響應外部刺激的主動區之半導體晶粒之方法有权
简体标题：半导体设备以及形成具有响应外部刺激的主动区之半导体晶粒之方法

公开(公告)号：TWI620271B

公开(公告)日：2018-04-01

申请号：TW101127965

申请日：2012-08-03

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 韓丙濬 , HAN, BYUNG JOON , 沈一權 , SHIM, IL KWON , 官怡荷 , KUAN, HEAP HOE

IPC分类号： H01L21/768 , H01L25/04

CPC分类号： H01L31/0203 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L23/3128 , H01L24/19 , H01L24/97 , H01L27/14618 , H01L27/14636 , H01L27/14698 , H01L31/02005 , H01L31/1876 , H01L2224/12105 , H01L2224/24137 , H01L2224/96 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H05K1/185 , H05K3/4038 , H05K2203/1461 , H01L2224/03 , H01L2924/00 , H01L2924/00012

10.

发明专利
切割道上之穿通孔有权

公开(公告)号：TWI437682B

公开(公告)日：2014-05-11

申请号：TW097111951

申请日：2008-04-02

申请人： 史達晶片有限公司 , STATS CHIPPAC, LTD.

发明人： 杜雍台 , DO, BYUNG TAI , 希普胡官 , KUAN, HEAP HOE

IPC分类号： H01L23/535 , H01L23/52 , H01L21/60

CPC分类号： H01L23/49805 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3114 , H01L23/3185 , H01L23/5389 , H01L24/19 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L2221/68327 , H01L2221/68336 , H01L2224/02371 , H01L2224/04105 , H01L2224/20 , H01L2224/45139 , H01L2224/48145 , H01L2224/73265 , H01L2225/06506 , H01L2225/06541 , H01L2225/06551 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/15173 , H01L2924/15313 , H01L2924/15787 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012

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