公开(公告)号：US08421198B2

公开(公告)日：2013-04-16

申请号：US11856841

申请日：2007-09-18

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.

摘要翻译： 集成电路封装系统包括：连接集成电路管芯和外部互连; 在所述集成电路管芯和所述外部互连的一部分上形成封装; 以及在所述外部互连件之间形成隔离孔并且进入所述封装的暴露所述外部互连的一侧。

公开(公告)号：US20080284002A1

公开(公告)日：2008-11-20

申请号：US11750218

申请日：2007-05-17

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula ,  Lionel Chien Hui Tay

IPC分类号： H01L23/28

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.

摘要翻译： 提供了一种集成电路封装系统，包括将外部互连件附接在磁带上; 将背面元件附接在与外部互连件相邻的带上; 将集成电路裸片与后侧元件连接，后侧元件位于集成电路管芯的第一被动侧; 连接集成电路管芯的第一有源侧和外部互连; 以及在所述背面元件暴露的情况下在所述集成电路裸片上形成第一封装。

公开(公告)号：US07868471B2

公开(公告)日：2011-01-11

申请号：US11854934

申请日：2007-09-13

申请人： Zigmund Ramirez Camacho ,  Arnel Trasporto ,  Jeffrey D. Punzalan ,  Abelardo Hadap Advincula, Jr.

发明人： Zigmund Ramirez Camacho ,  Arnel Trasporto ,  Jeffrey D. Punzalan ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/495

CPC分类号： H01L23/49551 ,  H01L23/3135 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.

摘要翻译： 集成电路封装包装系统包括：形成集成电路封装系统，包括：连接第一集成电路管芯和引线，以及形成覆盖所述第一集成电路管芯和所述引线的一部分的内部封装; 将第二集成电路管芯安装到所述集成电路封装系统; 连接第二集成电路管芯和引线; 以及形成覆盖所述集成电路封装系统的封装封装和所述引线暴露的所述第二集成电路管芯。

公开(公告)号：US20080308933A1

公开(公告)日：2008-12-18

申请号：US11763154

申请日：2007-06-14

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/91 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/26145 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556 ,  H01L2924/206

摘要： An integrated circuit package system is provided including forming an external interconnect having a tip without a die-attach paddle; mounting a first integrated circuit device structure having a conductive ball over the tip; connecting a first wire between the first integrated circuit device structure and under the tip; and encapsulating the first integrated circuit device structure, the first wire, and the external interconnect with the external interconnect partially exposed.

摘要翻译： 提供了一种集成电路封装系统，包括形成具有尖端的外部互连件，而没有管芯附接的焊盘; 在所述尖端上安装具有导电球的第一集成电路器件结构; 在第一集成电路器件结构和尖端之间连接第一线; 并且将第一集成电路器件结构，第一引线和外部互连件与外部互连部分地暴露在一起。

公开(公告)号：US20080237816A1

公开(公告)日：2008-10-02

申请号：US11694921

申请日：2007-03-30

申请人： Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Abelardo Hadap Advincula ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Abelardo Hadap Advincula ,  Jose Alvin Caparas

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.

摘要翻译： 提供一种集成电路封装系统，包括形成引线框架，包括形成模具门，提供第一表面，并提供与第一表面相对的第二表面; 以及在所述第一表面和所述第二表面之间的模具浇口中形成彼此相对的成角度的浇口侧。

公开(公告)号：US08207600B2

公开(公告)日：2012-06-26

申请号：US11694921

申请日：2007-03-30

申请人： Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Abelardo Hadap Advincula ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Abelardo Hadap Advincula ,  Jose Alvin Caparas

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.

摘要翻译： 提供一种集成电路封装系统，包括形成引线框架，包括形成模具门，提供第一表面，并提供与第一表面相对的第二表面; 以及在所述第一表面和所述第二表面之间的模具浇口中形成彼此相对的成角度的浇口侧。

公开(公告)号：US20090072365A1

公开(公告)日：2009-03-19

申请号：US11856841

申请日：2007-09-18

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, JR.

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, JR.

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.

摘要翻译： 集成电路封装系统包括：连接集成电路管芯和外部互连; 在所述集成电路管芯和所述外部互连的一部分上形成封装; 以及在所述外部互连件之间形成隔离孔并且进入所述封装的暴露所述外部互连的一侧。

公开(公告)号：US08115305B2

公开(公告)日：2012-02-14

申请号：US11750218

申请日：2007-05-17

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula ,  Lionel Chien Hui Tay

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.

摘要翻译： 提供了一种集成电路封装系统，包括将外部互连件附接在磁带上; 将背面元件附接在与外部互连件相邻的带上; 将集成电路裸片与后侧元件连接，后侧元件位于集成电路管芯的第一被动侧; 连接集成电路管芯的第一有源侧和外部互连; 以及在所述背面元件暴露的情况下在所述集成电路裸片上形成第一封装。

公开(公告)号：US07919850B2

公开(公告)日：2011-04-05

申请号：US12331416

申请日：2008-12-09

申请人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/04 ,  H01L23/02

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供引线; 安装内部封装，使得引线是内部封装的周边，并且内部封装具有连接焊盘; 在连接焊盘上形成暴露的端子互连; 并封装内部封装，并用封装部分地封装暴露的端子互连。

公开(公告)号：US07732901B2

公开(公告)日：2010-06-08

申请号：US12050428

申请日：2008-03-18

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula, Jr. ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula, Jr. ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: forming a finger; forming a die pad adjacent the finger; applying a fill material around the finger and the die pad; forming a cavity in the finger and fill material; and attaching an integrated circuit die over the die pad adjacent the finger with the fill material.

摘要翻译： 一种集成电路封装系统，包括：形成手指; 形成与所述手指相邻的芯片焊盘; 在手指和芯片垫周围施加填充材料; 在手指中形成空腔并填充材料; 以及使用所述填充材料将集成电路管芯附接在所述手指附近的所述管芯焊盘上。