公开(公告)号：US08421198B2

公开(公告)日：2013-04-16

申请号：US11856841

申请日：2007-09-18

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.

摘要翻译： 集成电路封装系统包括：连接集成电路管芯和外部互连; 在所述集成电路管芯和所述外部互连的一部分上形成封装; 以及在所述外部互连件之间形成隔离孔并且进入所述封装的暴露所述外部互连的一侧。

公开(公告)号：US20090072365A1

公开(公告)日：2009-03-19

申请号：US11856841

申请日：2007-09-18

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, JR.

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, JR.

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.

摘要翻译： 集成电路封装系统包括：连接集成电路管芯和外部互连; 在所述集成电路管芯和所述外部互连的一部分上形成封装; 以及在所述外部互连件之间形成隔离孔并且进入所述封装的暴露所述外部互连的一侧。

公开(公告)号：US07919850B2

公开(公告)日：2011-04-05

申请号：US12331416

申请日：2008-12-09

申请人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/04 ,  H01L23/02

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供引线; 安装内部封装，使得引线是内部封装的周边，并且内部封装具有连接焊盘; 在连接焊盘上形成暴露的端子互连; 并封装内部封装，并用封装部分地封装暴露的端子互连。

公开(公告)号：US07732901B2

公开(公告)日：2010-06-08

申请号：US12050428

申请日：2008-03-18

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula, Jr. ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula, Jr. ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: forming a finger; forming a die pad adjacent the finger; applying a fill material around the finger and the die pad; forming a cavity in the finger and fill material; and attaching an integrated circuit die over the die pad adjacent the finger with the fill material.

摘要翻译： 一种集成电路封装系统，包括：形成手指; 形成与所述手指相邻的芯片焊盘; 在手指和芯片垫周围施加填充材料; 在手指中形成空腔并填充材料; 以及使用所述填充材料将集成电路管芯附接在所述手指附近的所述管芯焊盘上。

公开(公告)号：US08513801B2

公开(公告)日：2013-08-20

申请号：US12193540

申请日：2008-08-18

申请人： Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/34

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: mounting a first integrated circuit over a carrier; mounting an interposer, having an opening, over the first integrated circuit and the carrier with the interposer having an overhang over the carrier; connecting an internal interconnect, through the opening, between the carrier and the interposer; and forming an encapsulation over the first integrated circuit, the internal interconnect, and the carrier.

摘要翻译： 集成电路封装系统包括：将第一集成电路安装在载体上; 在所述第一集成电路和所述载体上安装具有开口的插入件，所述插入件在所述载体上具有突出端; 通过开口在载体和插入件之间连接内部互连件; 以及在第一集成电路，内部互连和载体上形成封装。

公开(公告)号：US08344495B2

公开(公告)日：2013-01-01

申请号：US12636696

申请日：2009-12-11

申请人： Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

发明人： Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

IPC分类号： H01L23/498

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有开口的基板外层; 在所述开口内形成凸形互连件，所述凸起互连件具有突出部和与所述基板外部层基本上水平共面的水平凸缘; 在所述衬底外层和所述凸互连之上形成绝缘层; 在绝缘层上形成水平导电通路; 从所述水平导电路径形成单层间导电连接器到所述凸互连; 并连接集成电路和水平导电通路。

公开(公告)号：US08304869B2

公开(公告)日：2012-11-06

申请号：US12185061

申请日：2008-08-01

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49531 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An integrated circuit package on package system includes: providing a lead having a wire-bonded die with a bond wire connected thereto; mounting a fan-in interposer over the wire-bonded die and the bond wire; connecting the fan-in interposer to the lead with the bond wires; and encapsulating the wire-bonded die, bond wires, and the fan-in interposer with an encapsulation leaving a portion of the fan-in interposer exposed.

摘要翻译： 包装系统上的集成电路封装包括：提供具有与其连接的接合线的引线接合管芯的引线; 将插入式插入器安装在引线接合芯片和接合线上; 使用接合线将风扇插入插座连接到引线; 并且用封装封装引线接合的管芯，接合引线和风扇插入器，从而使风扇插入件的一部分露出。

公开(公告)号：US20120241928A1

公开(公告)日：2012-09-27

申请号：US13070291

申请日：2011-03-23

申请人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L25/07 ,  H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49558 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system and method of manufacture thereof includes: leads and a paddle; a first encapsulant molded between the leads and the paddle, the first encapsulant thinner than the leads; a non-conductive layer over the paddle; and conductive traces directly on the leads, the first encapsulant, and the non-conductive layer.

摘要翻译： 集成电路封装系统及其制造方法包括：引线和桨; 模制在引线和桨之间的第一密封剂，第一密封剂比引线更薄; 在桨上的非导电层; 导电迹线直接在引线，第一密封剂和非导电层上。

公开(公告)号：US08273602B2

公开(公告)日：2012-09-25

申请号：US12046430

申请日：2008-03-11

申请人： Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Jose Alvin Caparas

IPC分类号： H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49531 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/48 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: fabricating a package base including: forming a lead frame, coupling a first integrated circuit device under the lead frame, coupling a second integrated circuit device over the first integrated circuit device, and molding an enclosure on the lead frame, the first integrated circuit device, and the second integrated circuit device for forming an integration port; and coupling a third integrated circuit device on the integration port.

摘要翻译： 一种集成电路封装系统，包括：制造封装基座，包括：形成引线框架，将引线框架下方的第一集成电路器件耦合到第一集成电路器件上的第二集成电路器件，以及将引线框架上的外壳模制成型 ，第一集成电路器件和用于形成集成端口的第二集成电路器件; 并在集成端口上耦合第三集成电路器件。

公开(公告)号：US08216883B2

公开(公告)日：2012-07-10

申请号：US13023329

申请日：2011-02-08

申请人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Lionel Chien Hui Tay

IPC分类号： H01L21/58

CPC分类号： H01L23/49541 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a semiconductor package system includes: providing a leadframe, having an open center, with leads adjacent to a peripheral edge of the leadframe; making a die support pad, formed without tie bars, separately from the leadframe; providing a coverlay tape for positioning the support pad centered within the leadframe; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the leads; and connecting a bonding pad on the semiconductor die to one of the leads using a bonding wire.

摘要翻译： 一种用于制造半导体封装系统的方法，包括：提供具有开放中心的引线框架，其具有与引线框架的周边边缘相邻的引线; 制成与引线框分开形成的没有连接条的模具支撑垫; 提供用于将所述支撑垫定位在所述引线框内的中心的覆盖带; 通过管芯附着粘合剂将半导体管芯附接到管芯支撑焊盘，半导体管芯与引线间隔开; 以及使用接合线将半导体管芯上的接合焊盘连接到引线之一。