摘要:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要:
Grid structured data arranged for a spherical structured grid constituted by combining two component structured grids are visualized by using computer graphics technology. Coordinate conversion means 31 converts grid point coordinates of first and second component structured grids (referred to as N and E systems, respectively), represented by specific regions in spherical coordinates, into local xyz coordinates used in computer graphics. Filter means 32 obtains first and second graphic objects for the N and E systems, respectively. Using E system rotation and N and E system synthesis means 33, the second graphic object for the E system is rotated by 90 degrees with respect to an x axis of a first local xyz coordinate system, and is then rotated by 180 degrees with respect to a z axis of the first local xyz coordinate system, thereby obtaining the rotated second graphic object for the E system, and then, both of the graphic objects are synthesized.
摘要:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要:
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
摘要:
A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.
摘要翻译:作为必要成分(A)热塑性树脂,(B)环氧树脂,(C)偶联剂,(D)粉末状无机填料,(E)具有橡胶弹性的粉末和(F) 有机溶剂,当涂布并干燥时,得到空隙率为3体积%以上的涂膜,在40℃,90%RH下测定的水蒸气透过率为500g / m 2·24h, 减; 通过将糊剂组合物涂布在半导体部件的表面并干燥而形成的保护膜,其空隙率为3体积%以上,水分透过率为40℃,90%RH 500 g / m2.24 h以下; 以及具有保护膜的半导体器件。
摘要:
A direct injection ignition engine includes a piston with a cavity on a top surface thereof, an injector arranged at a peripheral portion of a combustion chamber to be faced to the combustion chamber for injecting a fuel directly into the combustion chamber, an ignition plug arranged to be projected to the combustion chamber for igniting the fuel introduced into the combustion chamber, an intake passage connected to the combustion chamber for introducing an intake air to the combustion chamber, intake air flow control valve arranged in the intake passage for controlling an intake air flow of an inclined vortex including a tumble component and swirl component produced in the combustion chamber, an actuator for driving the control valve, engine load detecting sensor for detecting an engine load, engine speed detecting sensor for detecting an engine speed, fuel supply controller, based on the output signals from the engine load detecting sensor and the engine speed detecting sensor, for producing control signals for the injector which include a fuel injection amount and fuel injection timing in a compression stroke for accomplishing a stratified combustion condition in which an air fuel mixture with an air fuel ratio greater than a theoretical one is concentrated around the ignition plug when an operating condition is in at least a low engine load and low engine speed condition, and, the fuel injection amount and fuel injection timing in an intake stroke for accomplishing a uniform combustion condition in which an air fuel mixture with an air fuel ratio greater than a theoretical one is uniformly and entirely dispersed in the combustion chamber when the operating condition is at least in a condition beyond said low engine load and engine speed condition with regard to the engine load and engine speed, and, producing control signals for the actuator to produce the inclined vortex of the air fuel mixture in the operating condition from the stratified combustion condition to the uniform combustion condition.
摘要:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要:
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.