公开(公告)号：US20140367702A1

公开(公告)日：2014-12-18

申请号：US14370803

申请日：2012-07-25

申请人： Kei Yamamoto ,  Kazuhiro Tada ,  Hideki Komori ,  Toru Kimura ,  Masaki Goto ,  Hiroyuki Yoshihara

发明人： Kei Yamamoto ,  Kazuhiro Tada ,  Hideki Komori ,  Toru Kimura ,  Masaki Goto ,  Hiroyuki Yoshihara

IPC分类号： H01L23/367 ,  H01L29/20 ,  H01L21/56 ,  H01L29/16 ,  H01L23/31 ,  H01L21/48

CPC分类号： H01L23/3672 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/4334 ,  H01L29/1602 ,  H01L29/1608 ,  H01L29/2003 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.

摘要翻译： 目的在于提供一种鳍状集成型半导体器件及其制造方法，其具有简单的结构和良好的散热特性。 半导体器件包括：在第一主面上形成有以直立状态排列的翅片的基板; 绝缘层，形成在所述基板的第二主面上，所述第二主面与所述基板的所述第一主面相对; 固定到所述绝缘层的电路图案; 以及连接到电路图案的半导体元件。 翅片形成有沿翅片的厚度方向穿过的狭缝。

公开(公告)号：US08659147B2

公开(公告)日：2014-02-25

申请号：US12988035

申请日：2009-06-04

申请人： Takao Mitsui ,  Hiroyuki Yoshihara ,  Toru Kimura ,  Masao Kikuchi ,  Yoichi Goto

发明人： Takao Mitsui ,  Hiroyuki Yoshihara ,  Toru Kimura ,  Masao Kikuchi ,  Yoichi Goto

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/3107 ,  H01L23/3672 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.

摘要翻译： 一种功率半导体电路器件及其制造方法，它们均设置有：至少安装有功率半导体元件的基板; 在基板的与安装有功率半导体元件的表面相对的基板表面露出的基板的部分表面的状态下模制基板和功率半导体元件的树脂; 以及通过按压力与基板接合的散热翅片。 在基板上形成有与散热片接合的部分的槽，散热片通过铆接而与沟槽接合。

公开(公告)号：US20110031612A1

公开(公告)日：2011-02-10

申请号：US12988035

申请日：2009-06-04

申请人： Takao Mitsui ,  Hiroyuki Yoshihara ,  Toru Kimura ,  Masao Kikuchi

发明人： Takao Mitsui ,  Hiroyuki Yoshihara ,  Toru Kimura ,  Masao Kikuchi

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/3107 ,  H01L23/3672 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.

摘要翻译： 一种功率半导体电路器件及其制造方法，它们均设置有：至少安装有功率半导体元件的基板; 在基板的与安装有功率半导体元件的表面相对的基板表面露出的基板的部分表面的状态下模制基板和功率半导体元件的树脂; 以及通过按压力与基板接合的散热翅片。 在基板上形成有与散热片接合的部分的槽，散热片通过铆接而与沟槽接合。

公开(公告)号：US06734551B2

公开(公告)日：2004-05-11

申请号：US10126606

申请日：2002-04-22

申请人： Hiroyuki Yoshihara ,  Kenichi Hayashi ,  Hisashi Kawafuji ,  Mitsugu Tajiri

发明人： Hiroyuki Yoshihara ,  Kenichi Hayashi ,  Hisashi Kawafuji ,  Mitsugu Tajiri

IPC分类号： H01L2310

CPC分类号： H01L23/4334 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Each lead frame for a power chip has one side main surface on which a power chip is mounted and a suspension lead part provided projectingly from a region reserved for forming mold resin in addition to a lead terminal. Thus, the lead frame can be supported by the plurality of suspension lead parts in a molding step. A metal block is provided on the other main surface of the lead frame to face the power chip. Consequently, a semiconductor device with good heat radiation properties and good insulation breakdown voltages can be obtained.

摘要翻译： 用于功率芯片的每个引线框架除了引线端子之外还具有安装有功率芯片的一个侧面主表面和从保留用于形成模制树脂的区域突出设置的悬挂引线部分。 因此，引线框架可以在成型步骤中被多个悬架引线部分支撑。 在引线框架的另一个主表面上设置金属块以面对功率芯片。 因此，可以获得具有良好的散热性能和良好的绝缘击穿电压的半导体器件。

公开(公告)号：US20070139858A1

公开(公告)日：2007-06-21

申请号：US11606954

申请日：2006-12-01

申请人： Hiroyuki Yoshihara ,  Masao Kikuchi ,  Masaki Kato ,  Yoshihito Asao

发明人： Hiroyuki Yoshihara ,  Masao Kikuchi ,  Masaki Kato ,  Yoshihito Asao

IPC分类号： H01G2/08

CPC分类号： H02K11/046 ,  H02K11/33

摘要： A control device of a rotating electric machine to which an inverter is integrally assembled is downsized, and manufacturing costs are reduced. An inverter for controlling outputs from the rotating electric machine is integrated with a rotating electric machine, and in which a control device forming an inverter is constructed of a switching element and a heat sink, a drain electrode terminal of the switching element is directly joined to the heat sink, and a source electrode terminal and gate electrode terminal of the switching element are joined to a metal pattern formed at a connection member.

摘要翻译： 逆变器整体组装的旋转电机的控制装置小型化，制造成本降低。 用于控制来自旋转电机的输出的逆变器与旋转电机集成，其中形成逆变器的控制装置由开关元件和散热器构成，开关元件的漏电极端子直接连接到 散热器以及开关元件的源电极端子和栅电极端子连接到形成在连接构件上的金属图案。

公开(公告)号：US20180303572A1

公开(公告)日：2018-10-25

申请号：US15945629

申请日：2018-04-04

申请人： Hiroyuki Yoshihara

发明人： Hiroyuki Yoshihara

IPC分类号： A61B90/00 ,  A61B17/16

CPC分类号： A61B90/08 ,  A61B17/1604 ,  A61B2090/08021

摘要： Disclosed are devices, systems and methods for providing soft and/or flexible barrier materials of various configurations for providing a protective shield between surgical cutting surfaces of a surgical tool and various surrounding tissues, thereby reducing and/or preventing inadvertent and/or unwanted damage to tissues proximate to a surgical site within a patient.

公开(公告)号：US09390995B2

公开(公告)日：2016-07-12

申请号：US14370803

申请日：2012-07-25

申请人： Kei Yamamoto ,  Kazuhiro Tada ,  Hideki Komori ,  Toru Kimura ,  Masaki Goto ,  Hiroyuki Yoshihara

发明人： Kei Yamamoto ,  Kazuhiro Tada ,  Hideki Komori ,  Toru Kimura ,  Masaki Goto ,  Hiroyuki Yoshihara

IPC分类号： H01L23/367 ,  H01L23/34 ,  B23P15/26 ,  H01L23/433 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56 ,  H01L23/373 ,  H01L29/16 ,  H01L29/20

CPC分类号： H01L23/3672 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/4334 ,  H01L29/1602 ,  H01L29/1608 ,  H01L29/2003 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.

摘要翻译： 目的在于提供一种鳍状集成型半导体器件及其制造方法，其具有简单的结构和良好的散热特性。 半导体器件包括：在第一主面上形成有以直立状态排列的翅片的基板; 绝缘层，形成在所述基板的第二主面上，所述第二主面与所述基板的所述第一主面相对; 固定到所述绝缘层的电路图案; 以及连接到电路图案的半导体元件。 翅片形成有沿翅片的厚度方向穿过的狭缝。

公开(公告)号：US09134076B2

公开(公告)日：2015-09-15

申请号：US13510162

申请日：2009-11-17

申请人： Hiroyuki Yoshihara ,  Masaki Goto ,  Toru Kimura

发明人： Hiroyuki Yoshihara ,  Masaki Goto ,  Toru Kimura

IPC分类号： F28F3/02 ,  B23P11/00 ,  H01L21/48 ,  H01L23/367 ,  B21D53/02 ,  H01L23/00

CPC分类号： F28F3/02 ,  B23P11/00 ,  B23P2700/10 ,  H01L21/4878 ,  H01L21/4882 ,  H01L23/3672 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other.

摘要翻译： 一种散热器，包括：多个散热片; 以及辐射翅片支撑基座，其具有安装到其一个表面的加热器元件和安装有辐射翅片的多个平行翅片槽，以及突出部，其将形成的辐射翅片固定到其另一个表面上，其中， 突起推动散热片的一个侧表面，以将散热片的另一侧表面推向散热片槽的侧表面，并且其中散热片槽和突起分别沿着 翅片槽，并且分割的翅片槽和每个分割的突起在翅片槽的纵向方向上具有相同的长度，并且彼此成对配合。

公开(公告)号：US20120227952A1

公开(公告)日：2012-09-13

申请号：US13510162

申请日：2009-11-17

申请人： Hiroyuki Yoshihara ,  Masaki Goto ,  Toru Kimura

发明人： Hiroyuki Yoshihara ,  Masaki Goto ,  Toru Kimura

IPC分类号： F28F7/00 ,  B21D53/02

CPC分类号： F28F3/02 ,  B23P11/00 ,  B23P2700/10 ,  H01L21/4878 ,  H01L21/4882 ,  H01L23/3672 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other.

摘要翻译： 一种散热器，包括：多个散热片; 以及辐射翅片支撑基座，其具有安装到其一个表面的加热器元件和安装有辐射翅片的多个平行翅片槽，以及突出部，其将形成的辐射翅片固定到其另一个表面上，其中， 突起推动散热片的一个侧表面，以将散热片的另一侧表面推向散热片槽的侧表面，并且其中散热片槽和突起分别沿着 翅片槽，并且分割的翅片槽和每个分割的突起在翅片槽的纵向方向上具有相同的长度，并且彼此成对配合。

公开(公告)号：US07439696B2

公开(公告)日：2008-10-21

申请号：US11606954

申请日：2006-12-01

申请人： Hiroyuki Yoshihara ,  Masao Kikuchi ,  Masaki Kato ,  Yoshihito Asao

发明人： Hiroyuki Yoshihara ,  Masao Kikuchi ,  Masaki Kato ,  Yoshihito Asao

IPC分类号： H02P6/14

CPC分类号： H02K11/046 ,  H02K11/33

摘要： A control device of a rotating electric machine to which an inverter is integrally assembled is downsized, and manufacturing costs are reduced. An inverter for controlling outputs from the rotating electric machine is integrated with a rotating electric machine, and in which a control device forming an inverter is constructed of a switching element and a heat sink, a drain electrode terminal of the switching element is directly joined to the heat sink, and a source electrode terminal and gate electrode terminal of the switching element are joined to a metal pattern formed at a connection member.

摘要翻译： 逆变器整体组装的旋转电机的控制装置小型化，制造成本降低。 用于控制来自旋转电机的输出的逆变器与旋转电机集成，其中形成逆变器的控制装置由开关元件和散热器构成，开关元件的漏电极端子直接连接到 散热器以及开关元件的源电极端子和栅电极端子连接到形成在连接构件上的金属图案。