摘要:
An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
摘要:
Disclosed is a lighting device comprising at least one LED and at least one optical element, wherein the LED and the optical element are aligned with each other by means of at least one dowel pin. A method of making such a lighting device is also specified. The described lighting device is particularly well suited for use in a vehicle headlight.
摘要:
A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.
摘要:
An optoelectronic component with a desired color impression in the switched-off state includes, in particular, a semiconductor layer sequence with an active region, that during operation radiates electromagnetic radiation with a first spectrum, and a wavelength conversion layer that is disposed downstream from the semiconductor layer sequence in the beam path of the electromagnetic radiation with the first spectrum, and that at least partially converts a subspectrum of the electromagnetic radiation with the first spectrum into electromagnetic radiation with a second spectrum, and a filter layer that reflects at least a part of the radiation incident from outside onto the optoelectronic component.
摘要:
In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
摘要:
A light-emitting module is specified that comprises a light source, a carrier for said light source, and an optical element, wherein the optical element comprises dowel pins that engage in corresponding recesses in the carrier. The light-emitting module is particularly well suited for use in optical projection apparatuses and in motor vehicle projection lamps.
摘要:
Disclosed is a lighting device comprising at least one LED and at least one optical element, wherein the LED and the optical element are aligned with each other by means of at least one dowel pin. A method of making such a lighting device is also specified. The described lighting device is particularly well suited for use in a vehicle headlight.
摘要:
A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).
摘要:
A reflector (1; 31; 41) for a lighting device comprising: (13; 61; 62), at least one rear cutout (6) for a light source (20; 47; 56) in each case and at least one front-side reflector opening (8), wherein at least one spring element (10; 34; 45) is incorporated into the reflector (1; 31; 41).
摘要:
A light-emitting module includes a supporting element, a number of optoelectronic semiconductor components mounted on the supporting element for the generation of electromagnetic radiation, and a metallic connecting layer by means of which the optoelectronic semiconductor components are supplied with operating voltage. An insulation layer is arranged in a region of the optoelectronic semiconductor components between the supporting element and the metallic connecting layer. The metallic connecting layer forms a light shade for the optoelectronic semiconductor components, so that the electromagnetic radiation is only emitted in a specified direction.