公开(公告)号：US09480331B2

公开(公告)日：2016-11-01

申请号：US14743992

申请日：2015-06-18

Applicant: Ping-Cheng Tsai

Inventor： Ping-Cheng Tsai

IPC: A47B3/00 ,  A47B3/08 ,  A47B3/087 ,  A47B3/091 ,  A47B13/06 ,  A47B13/08 ,  A47B3/083

CPC classification number: A47B3/0818 ,  A47B3/083 ,  A47B3/087 ,  A47B3/0912 ,  A47B3/0913 ,  A47B13/06 ,  A47B13/083 ,  A47B2003/008 ,  A47B2003/0821 ,  A47B2003/0835 ,  Y10T29/49826

Abstract: A method of folding up a table, which includes two tabletop panels, two leg frames foldably mounted at the tabletop panels respectively, and two connecting joints pivotally coupled between the tabletop panels respectively for enabling the tabletop panels to be pivotally folded between a folded condition and an unfolded condition, wherein a pivotal movable gap is formed at each of the connecting joints to enable a pivotal movement the tabletop panels to be pivotally folded between the folded condition and the unfolded condition, includes the steps of (a) pivotally folding the tabletop panels to the unfolded condition; and (b) locking up the pivotal movement between the tabletop panels in the unfolded condition for preventing a lateral movement of each of the connecting joints through the pivotal movable gap thereof.

Abstract translation: 一种折叠桌子的方法，其包括两个桌面面板，分别可折叠地安装在桌面面板上的两个腿架和分别枢转地联接在桌面面板之间的两个连接接头，用于使台面面板在折叠状态和折叠状态之间枢转地折叠 展开状态，其中在每个连接接头处形成枢转的可移动间隙，以使桌面面板在折叠状态和展开状态之间枢转地折叠的枢转运动包括以下步骤：（a）将桌面面板 到展开状态; 和（b）在展开状态下锁定桌面面板之间的枢转运动，以防止每个连接接头横向移动通过其枢转可移动间隙。

公开(公告)号：US09089204B2

公开(公告)日：2015-07-28

申请号：US14507797

申请日：2014-10-06

Applicant: Ping-Cheng Tsai

Inventor： Ping-Cheng Tsai

IPC: A47B3/00 ,  A47B3/087 ,  A47B3/091 ,  A47B13/06 ,  A47B3/08 ,  A47B13/08 ,  A47B3/083

CPC classification number: A47B3/0818 ,  A47B3/083 ,  A47B3/087 ,  A47B3/0912 ,  A47B3/0913 ,  A47B13/06 ,  A47B13/083 ,  A47B2003/008 ,  A47B2003/0821 ,  A47B2003/0835 ,  Y10T29/49826

Abstract: A foldable table includes a first tabletop panel, a second tabletop panel, and a reinforcing frame which includes first through fourth reinforcing members mounted along longitudinal sides of the first and second tabletop panels respectively, a first transverse member transversely extended between outer end portions of the first and second reinforcing members at the first tabletop panel, and a second transverse member transversely extended between outer end portions of the third and fourth reinforcing members at the second tabletop panel. Two ends of the first transverse member are affixed to the first and second reinforcing members in a non-rotatably movable manner. Two ends of the second transverse member are affixed to the third and fourth reinforcing members in a non-rotatably movable manner. Therefore, the first and second transverse members enhance the rigidity of the reinforcement frame to support two transverse sides of the first and second tabletop panels respectively.

Abstract translation: 折叠台包括第一桌面面板，第二桌面面板和加强框架，其包括分别沿着第一和第二台面面板的纵向侧面安装的第一至第四加强构件，第一横向构件横向延伸在 在第一台面板上的第一和第二加强构件，以及在第二台面板处横向延伸在第三和第四加强构件的外端部之间的第二横向构件。 第一横向构件的两端以不可旋转的方式固定到第一和第二加强构件。 第二横向构件的两端以不可旋转的方式固定到第三和第四加强构件。 因此，第一和第二横向构件增强了加强框架的刚度，以分别支撑第一和第二台面板的两个横向侧面。

公开(公告)号：US08828245B2

公开(公告)日：2014-09-09

申请号：US13275316

申请日：2011-10-18

Applicant: Yu-Chung Chen ,  Yi-Ling Lo ,  Hung-Kun Lee ,  Tzu-Ping Cheng

Inventor： Yu-Chung Chen ,  Yi-Ling Lo ,  Hung-Kun Lee ,  Tzu-Ping Cheng

IPC: H01B13/00 ,  B44C1/22 ,  C25D5/12 ,  C25D5/10 ,  C25D5/40 ,  C25D5/50 ,  C25D5/02 ,  H05K3/00 ,  C25D5/38 ,  C25D5/44 ,  C25D5/36 ,  H05K3/10 ,  H05K3/06

CPC classification number: H05K3/007 ,  C25D5/02 ,  C25D5/10 ,  C25D5/12 ,  C25D5/36 ,  C25D5/38 ,  C25D5/40 ,  C25D5/44 ,  C25D5/50 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2203/0152 ,  H05K2203/0315

Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.

Abstract translation: 柔性电路板的制造方法包括以下步骤。 首先提供其表面上具有金属氧化物层的金属载体箔。 金属氧化物层由环境空气中的金属载体箔的自发氧化形成，并在硫酸溶液或酸性硫酸铜溶液中提供被动保护。 导电种子层电镀在金属氧化物层上。 通过进行聚酰亚胺浇铸工艺在导电种子层上形成柔性绝缘层。 然后将金属载体箔从由绝缘层支撑的导电种子层剥离。 通过进行光致抗蚀剂涂布，显影和蚀刻，在绝缘层上形成图案化电路。

公开(公告)号：US20140086664A1

公开(公告)日：2014-03-27

申请号：US14035459

申请日：2013-09-24

Applicant: Chun Yuen TO ,  Ho Ping CHENG

Inventor： Chun Yuen TO ,  Ho Ping CHENG

IPC: B42F13/22

CPC classification number: B42F13/22 ,  B42F13/0066 ,  B42F13/26 ,  B42P2241/30

Abstract: A ring binder mechanism (10, 110, 210) to be secured with a cover (30, 130, 230) is disclosed as including an upper housing (12, 112, 212) with two through holes (20, 120, 220) and two side skirts (28, 128, 228) depending from the housing (12, 112, 212), a pair of hingedly engaged plates (14, 114, 214) supported by the housing (12, 112, 212), and a number of pairs of half-rings (16, 116, 216) mounted to the plates (14, 114, 214), and the plates (14, 114, 214) are pivotable between an open configuration in which the half-rings (16, 116, 216) are open and a closed configuration in which the half-rings (16, 116, 216) are closed to form a number of closed rings, and each through hole (20, 120, 220) is to be secured with the cover (30, 130, 230) via a rivet (38, 138, 238) only, and that at least part of the side skirts (28, 128, 228) abut the cover (30, 130, 230) when the ring binder mechanism (10, 110, 210) is secured with the cover (30, 130, 230).

Abstract translation: 公开了一种用盖子（30,130,230）固定的环形装订机构（10,110,210），包括具有两个通孔（20,120,220）的上壳体（12,112,212）和 从壳体（12,112,212）悬垂的两个侧裙（28,128,228），由壳体（12,112,212）支撑的一对铰接在一起的板（14,114,214），以及数字 安装到板（14,114,214）的成对的半环（16,116,216），并且板（14,114,214）可以在打开构型之间枢转，其中半环（16， 116,216）是闭合的，其中所述半环（16,116,216）被封闭以形成多个闭合环，并且每个通孔（20,120,220）将被固定在 （30,132,230），并且当环形活页夹（38,138,238）中的至少一部分边裙（28,128,228）与盖（30,130,230）邻接时，至少一部分侧裙 机构（10,110,210）用盖（30,130,230）固定。

公开(公告)号：US20140085264A1

公开(公告)日：2014-03-27

申请号：US13624842

申请日：2012-09-21

Applicant: Tzung-Min Su ,  Chih-Hsin Lin ,  Han-Ping Cheng ,  Ming-Tsan Kao ,  Yi-Hsien Ko

Inventor： Tzung-Min Su ,  Chih-Hsin Lin ,  Han-Ping Cheng ,  Ming-Tsan Kao ,  Yi-Hsien Ko

IPC: G06F3/042

CPC classification number: G06F3/0416 ,  G06F3/042 ,  G06F3/0428 ,  G06F3/04883

Abstract: The present invention discloses an optical touch panel system, an optical sensing module, and an operation method using for the same system. The system recognizes a track of an object moving on or above a touch control surface to determine a corresponding gesture function; it includes a touch control surface, at least one image sensor, and a processor. The touch control surface includes at least two touch control areas. The image sensor captures a plurality of continuous pictures including the images of the objects. The processer determines which touch control area the object is moving on or above according to a starting position or a path of the track, and executes a gesture function corresponding to the track and the touch control area.

Abstract translation: 本发明公开了一种用于同一系统的光学触摸屏系统，光学感测模块和操作方法。 系统识别在触摸控制表面上或之上移动的对象的轨迹，以确定对应的手势功能; 它包括触摸控制表面，至少一个图像传感器和处理器。 触摸控制表面包括至少两个触摸控制区域。 图像传感器捕获包括对象的图像的多个连续图像。 处理器根据轨道的开始位置或路径确定对象正在或移动的触摸控制区域，并且执行与轨道和触摸控制区域相对应的手势功能。

公开(公告)号：US08652307B2

公开(公告)日：2014-02-18

申请号：US12460947

申请日：2009-07-27

Applicant: Biing-Hwa Yan ,  Chh-Ping Cheng ,  Kun-Ling Wu ,  Yu-Shan Hsu

Inventor： Biing-Hwa Yan ,  Chh-Ping Cheng ,  Kun-Ling Wu ,  Yu-Shan Hsu

IPC: B23H7/38 ,  B23H5/02

CPC classification number: B23H7/38 ,  B23H3/00 ,  B23H5/06

Abstract: In an apparatus and method for magnetic field assisted electrochemical discharge machining (ECDM), the magneto hydrodynamic (MHD) effect is utilized to improve the thickness of bubble film and the electrolyte circulation so as to enhance the machining accuracy and efficiency. Since charged ions in a magnetic field are induced by Lorenz force to move, and the electrolysis bubbles generated in the ECDM process are suffused with electrification ions on their surfaces, the electrolysis bubbles can be forced to move in the direction of the magnetic field without the need of mechanical disturbance. The present invention can be widely applied in the micro-machining of non-conductive brittle materials of different dimensions and shapes, comprising the forming of microchannels and microholes on a biochip, and in the micro-opto-electro-mechanical system (MOEMS) and various kinds of micro-machining fields. The machined surface is smooth and does not require a second time machining.

Abstract translation: 在用于磁场辅助电化学放电加工（ECDM）的设备和方法中，利用磁流体动力学（MHD）效应来提高气泡膜和电解质循环的厚度，从而提高加工精度和效率。 由于磁场中的带电离子是由洛伦茨力驱动的，所以在ECDM工艺中产生的电解气泡在其表面上充满了带电离子，电解气泡可以被迫沿磁场方向移动， 需要机械扰动。 本发明可广泛应用于不同尺寸和形状的非导电脆性材料的微加工，包括在生物芯片上形成微通道和微孔，以及在微光电机械系统（MOEMS）和 各种微加工领域。 加工表面光滑，不需要第二次加工。

公开(公告)号：US08492883B2

公开(公告)日：2013-07-23

申请号：US12192702

申请日：2008-08-15

Applicant: Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Chien-Wen Chen ,  Hsu-Yang Lee

Inventor： Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Chien-Wen Chen ,  Hsu-Yang Lee

IPC: H01L23/495

CPC classification number: H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a plurality of leads, a chip, and a package body. The die pad includes: (1) a peripheral edge region defining, a cavity with a cavity bottom including a central portion; (2) an upper sloped portion; and (3) a lower sloped portion. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the central portion of the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body.

Abstract translation: 描述半导体封装和相关方法。 在一个实施例中，封装包括管芯焊盘，多个引线，芯片和封装体。 所述管芯焊盘包括：（1）外围边缘区域，其限定具有包括中心部分的空腔底部的空腔; （2）上倾斜部分; 和（3）下倾斜部分。 每个引线包括上倾斜部分和下倾斜部分。 芯片设置在空腔底部的中心部分并且连接到引线。 封装体形成在芯片和引线上，基本上填充空腔，并且基本上覆盖芯片焊盘和引线的上倾斜部分。 芯片焊盘和引线的下倾斜部分至少部分地从封装主体的下表面向外延伸。

公开(公告)号：US08415728B2

公开(公告)日：2013-04-09

申请号：US12945423

申请日：2010-11-12

Applicant: Ying Cheng Chuang ,  Ping Cheng Hsu ,  Sheng Wei Yang ,  Ming Cheng Chang ,  Hung Ming Tsai

Inventor： Ying Cheng Chuang ,  Ping Cheng Hsu ,  Sheng Wei Yang ,  Ming Cheng Chang ,  Hung Ming Tsai

IPC: H01L27/108 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC classification number: H01L21/76229 ,  H01L27/10876 ,  H01L27/10891

Abstract: A memory device includes a mesa structure and a word line. The mesa structure, having two opposite side surfaces, includes at least one pair of source/drain regions and at least one channel base region corresponding to the pair of source/drain regions formed therein. The word line includes two linear sections and at least one interconnecting portion. Each linear section extends on the respective side surface of the mesa structure, adjacent to the channel base region. The at least one interconnecting portion penetrates through the mesa structure, connecting the two linear sections.

Abstract translation: 存储器件包括台面结构和字线。 具有两个相对侧表面的台面结构包括至少一对源极/漏极区域和与其中形成的一对源极/漏极区域对应的至少一个沟道基极区域。 字线包括两个线性部分和至少一个互连部分。 每个线性部分在台面结构的相邻侧表面上延伸，邻近通道基底区域。 至少一个互连部分穿过台面结构，连接两个线性部分。

公开(公告)号：US08334196B2

公开(公告)日：2012-12-18

申请号：US12917339

申请日：2010-11-01

Applicant: Ying-Cheng Chuang ,  Hung-Ming Tsai ,  Sheng-Wei Yang ,  Ping-Cheng Hsu ,  Ming-Cheng Chang

Inventor： Ying-Cheng Chuang ,  Hung-Ming Tsai ,  Sheng-Wei Yang ,  Ping-Cheng Hsu ,  Ming-Cheng Chang

IPC: H01L21/768 ,  H01L21/28

CPC classification number: H01L27/10876 ,  H01L21/28531 ,  H01L21/76897 ,  H01L27/10855 ,  H01L27/10888

Abstract: A method of forming a conductive contact includes forming a structure comprising an upper surface joining with a sidewall surface. The sidewall surface contains elemental-form silicon. Silicon is epitaxially grown from the sidewall surface. Dielectric material is formed over the upper surface and the epitaxially-grown silicon. A conductive contact is formed through the dielectric material to conductively connect with the upper surface.

Abstract translation: 形成导电接触的方法包括形成包括与侧壁表面接合的上表面的结构。 侧壁表面含有元素型硅。 硅从侧壁表面外延生长。 电介质材料形成在上表面和外延生长的硅上。 通过电介质材料形成导电接触，以与上表面导电连接。

公开(公告)号：US08226286B2

公开(公告)日：2012-07-24

申请号：US12842972

申请日：2010-07-23

Applicant: Wen-yu Lin ,  Taso-yuan Fu ,  Hao-ping Cheng

Inventor： Wen-yu Lin ,  Taso-yuan Fu ,  Hao-ping Cheng

IPC: F21V7/04

CPC classification number: G02B6/0021 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0086

Abstract: An edge-lit backlight module includes a back plate, a light bar, and a light guide plate. The back plate has a bottom plate and four lateral sides. Each of the lateral sides is perpendicular to the bottom plate and connected to a peripheral edge of the bottom plate. The light bar is disposed on a side of an internal face of one of the lateral sides to leave at least one accommodation space on the lateral side. The light guide plate has at least one extension portion corresponding to the accommodation space. The light guide plate is disposed on the bottom plate, and each extension portion of the light guide plate engages with the corresponding accommodation space for fixing the light guide plate onto the back plate.

Abstract translation: 边缘照明背光模块包括背板，光杆和导光板。 背板具有底板和四个侧面。 每个侧面垂直于底板并连接到底板的周边边缘。 光条设置在侧面之一的内表面的一侧，以在侧面留下至少一个容纳空间。 导光板具有至少一个对应于容纳空间的延伸部分。 导光板设置在底板上，导光板的每个延伸部分与相应的容纳空间配合，用于将导光板固定在背板上。