公开(公告)号：US08847356B2

公开(公告)日：2014-09-30

申请号：US13884340

申请日：2011-12-07

申请人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

发明人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

IPC分类号： H01L21/02 ,  H05K3/46 ,  H05K1/18 ,  H01L49/02 ,  H05K1/02

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09154 ,  H05K2201/10015

摘要： Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

摘要翻译： 本发明的实施例提供了一种组件内置线路板，其能够防止当将部件容纳在具有填充树脂填充物的芯材的壳体部分中时由拐角处的应力集中引起的诸如裂纹的缺陷 之间。 构成部件的布线基板可以包括容纳在芯材的壳体部分中的部件和层叠部分，绝缘层和导体层交替地层叠在芯材上。 芯材的壳体部分和部件之间的间隙可以填充树脂填料。 在芯材的壳体部的内周部，在矩形的每个角部形成有第一直角倒角部，在该部件的外周部，在矩形的每个角部形成有第二直角倒角部。

公开(公告)号：US20100084175A1

公开(公告)日：2010-04-08

申请号：US12575504

申请日：2009-10-08

申请人： Shinya SUZUKI ,  Kenichi SAITA ,  Shinya MIYAMOTO ,  Shinji YURI

发明人： Shinya SUZUKI ,  Kenichi SAITA ,  Shinya MIYAMOTO ,  Shinji YURI

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0231 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surface (12) side, the projected area of the mounting area (32) is larger than the projected area of the plate-shaped component (101) and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (23), and wherein a value of the coefficient of thermal expansion (CTE α2) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.

摘要翻译： 一种组件内置布线基板（10），包括：芯基板（11）; 板状部件（101）; 树脂填充部分（92）; 以及布线堆叠部（31），其中，当从所述芯主表面（12）侧观察时，所述安装区域（32）的所述投影面积大于所述板状部件（101）的投影面积，并且 树脂填充部分，并且板状部件和树脂填充部分位于安装区域（23）的正下方，并且其中等于或等于更高的温度范围的热膨胀系数（CTEα2）的值 将树脂填充部的玻璃化转变温度设定为大于板状部件的热膨胀系数的值，并且小于本体温度范围内的芯基板的热膨胀系数的值 。

公开(公告)号：US20080162043A1

公开(公告)日：2008-07-03

申请号：US11819963

申请日：2007-06-29

申请人： Michiko Emoto ,  Shinya Miyamoto ,  Kazuyoshi Yamamoto

发明人： Michiko Emoto ,  Shinya Miyamoto ,  Kazuyoshi Yamamoto

IPC分类号： G01C21/34 ,  G06F3/14

CPC分类号： G01C21/3638

摘要： Navigation apparatuses, methods, and programs set a reference point at an intersection and set a region extending ahead of the vehicle in a direction in which the vehicle enters the intersection, the region including the reference point. Then, the apparatuses, methods, and programs obtain 3D map data of the region, generate a 3D movie which has a predetermined viewpoint on the basis of the obtained 3D map data, and display the generated 3D movie.

摘要翻译： 导航装置，方法和程序在交点处设置参考点，并且在车辆进入交叉点的方向上设置在车辆前方延伸的区域，该区域包括参考点。 然后，装置，方法和程序获得该区域的3D地图数据，基于获得的3D地图数据生成具有预定视点的3D电影，并显示所生成的3D电影。

公开(公告)号：US07233066B2

公开(公告)日：2007-06-19

申请号：US11411020

申请日：2006-04-26

申请人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

发明人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

IPC分类号： H01L23/48

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/19041 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4682 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376

摘要： A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.

摘要翻译： 公开了一种制造多层布线基板的方法。 多层布线基板不含芯基板，并且包括包含绝缘体层和布线层的堆积层。 构建层的第一主表面和第二主表面之一形成有金属支撑框体。 该方法包括以下步骤：在金属支撑板的第一主表面上形成第一绝缘体层，其中第一绝缘体层包含在绝缘体层中，并成为位于第一绝缘体层的第一主表面侧的第一抗蚀剂层 并且在第一绝缘体层的第一主表面上的给定位置形成第一金属焊盘层，其中第一金属焊盘层包括在布线层中并且变成金属焊盘层。

公开(公告)号：US07060604B2

公开(公告)日：2006-06-13

申请号：US10454530

申请日：2003-06-05

申请人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

发明人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

IPC分类号： H01L21/4763

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/19041 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4682 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376

摘要： A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.

摘要翻译： 公开了一种制造多层布线基板的方法。 多层布线基板不含芯基板，并且包括包含绝缘体层和布线层的堆积层。 构建层的第一主表面和第二主表面之一形成有金属支撑框体。 该方法包括以下步骤：在金属支撑板的第一主表面上形成第一绝缘体层，其中第一绝缘体层包含在绝缘体层中，并成为位于第一绝缘体层的第一主表面侧的第一抗蚀剂层 并且在第一绝缘体层的第一主表面上的给定位置形成第一金属焊盘层，其中第一金属焊盘层包括在布线层中并且变成金属焊盘层。

公开(公告)号：US20080040035A1

公开(公告)日：2008-02-14

申请号：US11812923

申请日：2007-06-22

申请人： Michiko Emoto ,  Shinya Miyamoto ,  Kazuyoshi Yamamoto

发明人： Michiko Emoto ,  Shinya Miyamoto ,  Kazuyoshi Yamamoto

IPC分类号： G01C21/34 ,  G01C21/36

CPC分类号： G01C21/3638

摘要： Navigation apparatuses, methods, and programs set a reference point on a route, set at least one point on the route on the basis of the reference point, and set a region along the route, the region being set on the basis of the set at least one point and the region including the at least one point. The navigation apparatuses, methods, and programs obtain 3D map data corresponding to the region, generate a 3D movie which has a predetermined viewpoint on the basis of the obtained 3D map data, and display the generated 3D movie.

摘要翻译： 导航装置，方法和程序在路线上设置参考点，基于参考点在路线上设置至少一个点，并且沿着路线设置区域，该区域是基于设置在 至少一个点和包括至少一个点的区域。 导航装置，方法和程序获得对应于该区域的3D地图数据，根据获得的3D地图数据生成具有预定视点的3D电影，并显示所生成的3D电影。

公开(公告)号：US07974781B2

公开(公告)日：2011-07-05

申请号：US11819963

申请日：2007-06-29

申请人： Michiko Emoto ,  Shinya Miyamoto ,  Kazuyoshi Yamamoto

发明人： Michiko Emoto ,  Shinya Miyamoto ,  Kazuyoshi Yamamoto

IPC分类号： G01C21/32

CPC分类号： G01C21/3638

摘要： Navigation apparatuses, methods, and programs set a reference point at an intersection and set a region extending ahead of the vehicle in a direction in which the vehicle enters the intersection, the region including the reference point. Then, the apparatuses, methods, and programs obtain 3D map data of the region, generate a 3D movie which has a predetermined viewpoint on the basis of the obtained 3D map data, and display the generated 3D movie.

摘要翻译： 导航装置，方法和程序在交点处设置参考点，并且在车辆进入交叉点的方向上设置在车辆前方延伸的区域，该区域包括参考点。 然后，装置，方法和程序获得该区域的3D地图数据，基于获得的3D地图数据生成具有预定视点的3D电影，并显示所生成的3D电影。

公开(公告)号：US20100163172A1

公开(公告)日：2010-07-01

申请号：US12647771

申请日：2009-12-28

申请人： Kenichi Saita ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

发明人： Kenichi Saita ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

IPC分类号： B32B38/00

CPC分类号： B32B38/0008 ,  B32B37/02 ,  B32B2457/08 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1461 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/3436 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/095 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface activation step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface activation step, a surface of the resin layer is activated by means of plasma treatment, after the fixing step but before the insulation layer formation step.

摘要翻译： 制造布线板的方法包括芯基板制备步骤，组分制备步骤，调节步骤，树脂层形成步骤，定影步骤，绝缘层和表面活化步骤。 在接合步骤中，将部件保持在芯基板的容纳孔中。 在树脂层形成工序中，将填充孔的内壁面与部件的侧面之间的间隙填充树脂层。 在定影步骤中，树脂层硬化。 在绝缘层形成步骤中，在第二主表面和第二组分主表面上形成树脂绝缘层。 在表面活化步骤中，树脂层的表面通过等离子体处理，在固定步骤之后，但在绝缘层形成步骤之前被激活。

公开(公告)号：US20080033642A1

公开(公告)日：2008-02-07

申请号：US11812911

申请日：2007-06-22

申请人： Michiko Emoto ,  Shinya Miyamoto ,  Kazuyoshi Yamamoto

发明人： Michiko Emoto ,  Shinya Miyamoto ,  Kazuyoshi Yamamoto

IPC分类号： G01C21/30

CPC分类号： G01C21/3638

摘要： Navigation apparatuses, methods, and programs set a first reference point on a driving route, set a second reference point on the driving route, the second reference point being prior to the first reference point along the driving route, and set a third reference point on the driving route, the third reference point being after the first reference point along the driving route. The apparatuses, methods, and programs set a triangular area having vertices corresponding to the first reference point, the second reference point, and the third reference point and obtain three-dimensional map data around the triangular area. The apparatuses, methods, and programs set a predetermined translucent ratio to a structure included in the triangular area out of the obtained three-dimensional map data. The apparatuses, methods, and programs generate a moving three-dimensional image which displays the driving route overlapped with the structure set with the predetermined translucent ratio and display the generated three-dimensional motion-image.

摘要翻译： 导航装置，方法和程序在驾驶路线上设置第一参考点，在驾驶路线上设置第二参考点，第二参考点沿着驾驶路线在第一参考点之前，并且设置第三参考点 驾驶路线，第三参考点沿着驾驶路线在第一参考点之后。 设备，方法和程序设置具有对应于第一参考点，第二参考点和第三参考点的顶点的三角形区域，并且获得三角形区域周围的三维地图数据。 所述设备，方法和程序将所述三维地图数据中包含在所述三角形区域中的结构设置为预定的半透明比。 装置，方法和程序产生移动三维图像，其显示与以预定的半透明比设置的结构重叠的行驶路线并显示所生成的三维运动图像。

公开(公告)号：US20060189125A1

公开(公告)日：2006-08-24

申请号：US11411020

申请日：2006-04-26

申请人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

发明人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

IPC分类号： H01L21/4763

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/19041 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4682 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376

摘要： A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.